Study of the effect of BDMA catalyst in the epoxy novolac curing process by isothermal DSC

Epoxy novolac/anhydride cure kinetics has been studied by differential scanning calorimetry under isothermal conditions. The system used in this study was an epoxy novolac resin (DEN431), with nadic methyl anhydride as hardener and benzyldimethylamine as accelerator. Kinetic parameters including the reaction order, activation energy and kinetic rate constants, were investigated. The cure reaction was described with the catalyst concentration, and a normalized kinetic model developed for it. It is shown that the cure reaction is dependent on the cure temperature and catalyst concentration, and that it proceeds through an autocatalytic kinetic mechanism. The curing kinetic constants and the cure activation energies were obtained using the Arrhenius kinetic model. A suggested kinetic model with a diffusion term was successfully used to describe and predict the cure kinetics of epoxy novolac resin compositions as a function of the catalyst content and temperature. Copyright © 2003 Society of Chemical Industry     

大型连杆流线简易试验方法

介绍了一种大型连杆流线的简易试验方法及其评价原则。该方法可清晰显示流线，并适合任何尺寸和形状的锻造连杆的流线试验。     

一种新型板件连接

TOX板件冲压连接工艺是一种新的板件连接技术。作者对TOX板件冲压连接技术进行了应用研究，并取得了一些经验。主要介绍一种板件连接技术－板件冲连接工艺，较详细地叙述了其原理、应用范围及工艺要点。     

Poly(butylene terephthalate)–clay nanocomposites prepared by melt intercalation: morphology and thermomechanical properties

Nanocomposites based on poly(butylene terephthalate) (PBT) and an organoclay (Cloisite 30B) were prepared by melt blending using a twin‐screw extruder. Two kinds of PBTs, ie PBT‐A and PBT‐B, with different inherent viscosities (η_inh), were used for this study (η_inh of PBT‐A and PBT‐B were 0.74 and 1.48, respectively). Dispersion of the clay layers in the PBT nanocomposites was characterized by using X‐ray diffraction (XRD) and transmission electron microscopy (TEM). Tensile and dynamic mechanical properties and non‐isothermal crystallization temperatures of the nanocomposites were also examined. Nanocomposites based on the higher‐viscosity PBT (PBT‐B) showed a higher degree of exfoliation of the clay and a higher reinforcing effect when compared to the composites based on the lower‐viscosity PBT (PBT‐A). The clay nanolayers dispersed in PBT matrices lead to increases in the non‐isothermal crystallization temperatures of the PBTs, with such increases being more significant for the PBT‐B nanocomposites than for the PBT‐A nanoocomposites. Copyright © 2004 Society of Chemical Industry     

GJB712A-2001航天用GH4169高温合金锻制圆饼规范介绍

介绍了GH 4 16 9高温合金锻制圆饼规范的修订内容 ,对其主要技术指标作了简要说明 ,并与国外同类标准进行了比较。     

聚醚酰亚胺热焓松弛的分子量依赖关系

采用ＤＳＣ对不同分子量的聚醚酰亚胺的等温及动态热焓松弛行为进行了研究，并以ＫＷＷ方程对实验数据进行了非线性拟合。结果表明，分子量对热焓松弛的影响是由高分子端基引起自由体积的差异所致。不同分子量的聚醚酰亚胺分子具有不同数量的端基，淬冷时端基数目的差异将产生不同数量的过剩自由体积，从而影响松弛热焓及松弛速率、低分子量的聚醚酰亚胺松弛相对较快，且起始热焓高，松弛的表观活化能亦较小。     

就拉杆固定支架谈锻件的缺陷分析

针对汽车锻件拉杆固定支架在生产过程中产生的裂纹、折叠、表面脱碳等多种形式缺陷,从锻件生产工艺过程的各工序来分析其可能产生的缺陷,并重点就裂纹、折叠、表面脱碳等缺陷产生的原因及其解决方法进行探讨,从而进一步完善生产工艺,改善锻件质量.     

Powder Deposition in Three Parallel-Oriented Dies of Different Shapes

Uniformity of bulk density distribution during the die filling process is required to minimize quality problems, such as distortion and cracking, for powder compacts. Understanding the die filling process is necessary in ensuring a uniform powder deposition. The second-generation pressure deposition tester (PDT-II) was used to investigate the deposition process and final pressure distribution of powder filling in toroidal, cylindrical, and E-shaped dies. All tests were conducted using a spray-dried free-flowing granular powder. The results indicated that for toroidal dies: (1) the area around 0° orientation (the leeward end) had the highest pressure values (1186.7 to 2498.0 Pa), with the average pressure values of the remaining area 353.7-648.0 Pa; (2) the pressure distribution was symmetrical about the centerline parallel to the feed shoe movement direction; (3) the highest feed shoe speed (500 mm/s) led to the most nonuniform pressure distribution among the three speeds; (4) higher feed shoe speed did not always result in higher final pressure values; and (5) the right die tended to have higher final pressure values (215.0 to 2498.0 Pa) than the center die (95.4 to 2052.5 Pa). For E-shaped dies: (1) the final pressure values of the middle leg (308.9 to 760.7 Pa) were higher than those of the left and the right legs (148.9 to 530.3 Pa); (2) the area along the backside had the highest final pressure value (1054.6 to 1303.8 Pa); (3) the pressure distribution was symmetrical about the centerline parallel to the feed shoe movement direction; and (4) neither the center die nor the right die always had higher pressure values than the other one at all locations. Comparison between cylindrical and toroidal dies indicated that: (1) neither of the two die shapes (cylinder and toroid) led to consistently higher or lower final pressure values at all locations and (2) for all three feed shoe speeds, the toroidal die had higher average final pressure values in the 0° orientation.     

Morphological and kinetics study of PEO/PVC blends

The kinetics of spherulite radial growth and the morphology of the compatible system PEO/PVC have been studied by optical microscopy. The usual spherulite radial growth behaviour has been found for compatible blends with PEO content higher than 70%. For lower composition, distortion of the usual spherulite morphology has been observed; the anomalies have been attributed to partial miscibility of the components.     

Effect of Stress State on Growth of Interfacial Intermetallic Compounds Between Sn-Ag-Cu Solder and Cu Substrates Coated with Electroless Ni Immersion Au

Excessive intermetallic compound (IMC) growth in solder joints will significantly decrease the reliability of the joints. IMC growth is known to be influenced by numerous factors during the component fabrication process and in service. It is reported that, other than temperature and holding time, stress can also influence the IMC growth behavior. However, no existing method can be used to study the effect of stress state on IMC growth in a controlled manner. This paper presents a novel method to study the effect of stress on interfacial IMC growth between Sn-Ag-Cu solder and a Cu substrate coated with electroless Ni immersion Au (ENIG). A C-ring was used and in-plane bending induced tensile and compressive stresses were applied by tightening the C-ring. Results revealed that in-plane compressive stress led to faster IMC growth as compared with in-plane tensile stress.