排序方式: 共有8条查询结果,搜索用时 15 毫秒
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介绍了环氧树脂塑封料(Epoxy Molding Compounds,EMC)的起源和发展和过程;简述了环氧树脂塑封料的组成、典型配方和制造工艺;分析了环氧树脂塑封料的性能优点、弊端以及正在面临的巨大挑战;总结了国内外近期在环氧树脂塑封料研究上的新进展,其中着重介绍了无卤阻燃EMC以及耐无铅EMC的性能及结构 相似文献
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(反应)模晶生长法制备NBT-6BT织构陶瓷的研究 总被引:1,自引:0,他引:1
以熔盐法合成的片状SrTiO3,Bi4Ti3O12为种晶,分别采用模晶生长法(TGG)和反应模晶生长发(RTGG)制备了具有〈001〉取向的0.94(Na1/2Bi1/2)TiO3-0.06BaTiO3(NBT-6BT)织构陶瓷。研究了不同种晶选择、流延和热处理工艺参数对陶瓷织构化程度、显微结构和压电性能的影响。结果表明,RTGG制备的织构陶瓷比TGG的在结构和性能等方面都具有优势,且用该方法以Bi4Ti3O12为种晶,制备出了高密度(f≥96%)、高织构度(F≈95%)、高性能(d33≈241pC/N)的NBT-6BT无铅压电陶瓷。 相似文献
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Trace amounts of La were utilized to improve the melting behaviors, microstructures, tensile properties and microhardness of Sn-3.0Ag-0.5Cu lead-free solder alloy. La has little effect on the melting behavior of Sn-3.0Ag-0.5Cu alloy according to the differential thermal analysis (DTA) tests. The X-ray diffraction (XRD) patterns show that β-Sn, Ag3Sn and Cu6Sn5 coexist in the as-cast solder alloys and LaSn3 phases emerge when adding 0.4% La. The microstructures modified by La are more uniform and much finer than that of baseline alloy, and the coarse LaSn3 particles with complex dendrites are observed by optical microscopy (OM) and scanning electron microscopy (SEM) when the addition of La is up to 0.4%. The composition of the LaSn3 phases is identified by energy-dispersive spectroscopy (EDS). There are considerable improvements in mechanical properties with 0.05% and 0.1% addition, but degenerations by adding 0.4%La. The Vickers microhardness of β-Sn and eutectic area are both enhanced with the addition of La and the microhardness of LaSn3 is much larger than those of β-Sn and eutectic area. 相似文献
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从无铅焊料的易氧化性、腐蚀性、波峰焊温度曲线等方面分析了无铅焊接相对于Sn-Pb焊接的工艺特点,提出了无铅焊接过程中应注意的问题及解决方法,从而实现波峰焊的无铅化。 相似文献
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景德镇与石湾两地同属陶瓷艺术的重要窑口,创作风格各有千秋。通过对在两地陶艺创作中起到关键性差异的"材料"这一因素来进行比较,分析由材质所产生的创作上的差异性,从而丰富现代陶艺创作的语言,探索陶艺材料的融合与创新。 相似文献
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