基于神经网络算法的井下裂缝诊断与堵漏技术

在钻井过程中，常常钻遇不同宽度的井下地层裂缝。钻遇裂缝时容易发生钻井液漏失现象，甚至发生钻井液失返现象，严重影响了安全、高效钻井。目前裂缝封堵的方法常存在封堵成功率不高、堵漏承压能力低的问题，其中一个重要的原因是对井下地层的裂缝宽度等特征认识不清。基于地层裂缝产生的岩石力学机理，确定影响裂缝宽度关键的6个力学和工程因素，并利用神经网络计算的非线性、大数据特点建立了井下地层裂缝宽度的分析模型，模型包含输入层、输出层和3个隐藏层。通过该模型诊断井下裂缝宽度，提高了计算精度，平均误差仅为2.09%，最大误差为5.88%，解决钻井现场仅凭经验判断裂缝误差较大和依靠成像测井成本较高的问题。同时根据神经网络模型诊断得到的裂缝宽度优化堵漏材料的粒径配比，提高了裂缝内的架桥封堵强度和架桥的稳定性，封堵层的承压能力达到12.8 MPa，反向承压能力达到4.5 MPa。现场堵漏试验最高憋压10 MPa，经过封堵作业后大排量循环不漏，达到了裂缝性地层高效堵漏的目的，堵漏一次成功。      

Application of differential evolution for cascaded multilevel VSI with harmonics elimination PWM switching

Harmonic elimination pulse width modulation (HEPWM) method has been widely applied to multilevel voltage source inverter (MVSI) to remove low frequency harmonics from its output voltage. However, the computation of the HEPWM switching angles for MVSI is very challenging due to several constraints, namely angle sequencing, very tight angular spacing and the numerous possibilities of angles distribution ratio. Realizing the potential of Differential Evolution (DE) to handle complex problems, this work proposes its application to solve the HEPWM problem for cascaded MVSI. Its emphasis is on improving the availability of HEPWM for higher output voltage by extending the maximum range of modulation index (M). It also removes the discontinuities in the switching angles and reduces the number of distribution ratio required to obtain the required solution. Compared to the most advanced (similar) work, i.e., 7-level MVSI with seventeen switching angles, DE covers a wider range of M; the maximum achievable M is 2.80. Furthermore, it exhibits very low second order distortion factor (DF₂): for the worst case, the value of DF₂ is 0.0014%. To verify the viability of the proposed algorithm, simulation is carried out and hardware prototype is constructed. Both results show very good agreement with the theoretical prediction.     

M1080B无心外圆磨床改进

M1080B无心外圆磨床砂轮及导轮宽度较窄,磨削轴承套圈外圆时,磨削效率低,托板架调整较为繁琐、皮带打滑、磨损较为严重。针对上述问题,提出了相应的解决办法,提高了磨削效率。     

AT89C2051芯片在车载产品中的应用

本文论述了采用单片机技术研制成功的泊车用超声波测距仪的基本原理,用AT89C2051作为控制器的实现方案,以及采用软件校正的方法,提高了测量精度和整机的可靠性.     

双滑动氧枪的应用

叙述了φO114双焊缝氧枪存在的问题及改型后单焊缝双滑动氧枪的优点及使用效果。     

混凝土小型砌块建筑裂缝宽度的标准设置研究

通过对混凝土小型空心砌块单片墙进行试验 ,了解不同构造措施墙体的初始裂缝在墙体上出现的部位、形态、发展规律以及墙体最终破坏形态 ,并通过试验明确墙体在不同受力状态下的裂缝形态 ,最后根据试验结果初步提出混凝土小型空心砌块建筑的裂缝宽度控制标准     

孔西潜山奥陶系原生油藏成藏时期探讨

黄骅坳陷孔西潜山发现奥陶系（孔古3井、孔古7井）低产原生油藏和石炭-二叠系原生油气藏（孔古4井），油源对比结果证明，前者原油主要源于中奥陶统马家沟组灰岩，后者油气主要源于石炭系太原组及二叠系山西组煤系泥岩。根据孔古3井油藏的两期流体包裹体及储集层自生伊利石K-Ar年龄测定结果，油藏属两期成藏，第一期为晚三叠世（距今222.51～240.34Ma），第二期为第三纪，以晚第三纪为主。     

Reaction scheme and kinetic modelling for the MTO process over a SAPO-18 catalyst

A kinetic model for simulation of the MTO process over SAPO-18 catalyst in a wide range of operating conditions has been proposed. The kinetic model predicts the experimental evolution of reaction products with time on stream, which follows three consecutive periods: initiation (where olefin production increases), a period of maximum olefin production and a period in which this production decreases. The kinetic scheme takes into account these three steps that evolve with time on stream: formation of active intermediate compounds, an step where olefins are formed by reaction of oxygenates (methanol/DME) with these intermediates and deactivation of intermediates by degradation to coke. The presence of water in the reaction medium attenuates the reaction rate of these steps. Discrimination of kinetic equations and calculation of the parameters of best fit have been carried out by solving the mass conservation equations of the individual components of the kinetic scheme together with the kinetic equation for deactivation and taking into account the effect of water on the kinetics of each step.     

微量元素对管道焊缝性能的改善

在焊条中添加微量元素Ce、Y、Ca、Ba和Zr，有利于改善石油天然气管道焊缝的金属性能，俄罗斯专家对此做了一系列实验和研究。结果表明添加微量元素有利于提高焊缝金属平面应变断裂韧性KIC，提高裂纹张开位移δc，减小裂纹扩展速率dα／dN改善焊缝金属的组织结构。通过大量的试验和研究，俄罗斯焊接学者确定了焊缝中微量元素的最佳含量，并建立了相关参数的数学模型。     

现代电子产品焊接质量的检测技术

介绍了现代电子产品焊接质量的检测技术,以及用于检查焊点质量和组装板(SMA)功能的测试仪器的工作原理及测试能力.目前常见和广泛使用的焊接质量检测方法是人工目测检查,其主要问题是其主观性,只能用来检测电子元件的形状、尺寸、颜色、表面特征及焊点的外观质量;自动光学检测(AOI)可以在整个过程中发现和纠正缺陷,但只是外在的焊点缺陷;激光/红外线组合式检测系统、X射线检测系统可以分析焊点微米级水平的缺陷,能找出其他检测所不能可靠地发现的缺陷,包括空洞、焊点形状差和冷焊锡点等;另外,X射线检测系统能一次测试单面或双面电路,准确地定位缺陷,获取工艺参数,例如锡膏厚度等.