Study on the non-uniform contact during ELID groove grinding

This paper introduces the potential feasibility that ELID (electrolytic in-process dressing) grinding replaces superfinishing in bearing manufacturing, but ELID grinding will bring new challenges. Different regions present distinguish surface profile due to the non-uniform contact in ELID groove grinding. However, few reports explaining the non-uniform contact are available. This article explores the mechanisms of the non-uniform contact during ELID groove grinding. Experiments on the non-uniform contact between bearing raceway and grinding wheel have been carried out under different conditions. The results show that non-uniform contact exists in ELID groove grinding process and it exerts influence on the profile of the raceway surface. Non-uniform contact influences the Rsk and Rku value all the time, but it influences the Ra value occasionally. Improvement strategies of eliminating the non-uniform contact are also discussed based on the experimental study.     

Microstructures and mechanical properties of B4C-TiB2-SiC composites fabricated by ball milling and hot pressing

B₄C-TiB₂-SiC composites were fabricated via hot pressing using ball milled B₄C, TiB₂, and SiC powder mixtures as the starting materials. The impact of ball milling on the densification behaviors, mechanical properties, and microstructures of the ceramic composites were investigated. The results showed that the refinement of the powder mixtures and the removal of the oxide impurities played an important role in the improvement of densification and properties. Moreover, the formation of the liquid phases during the sintering was deemed beneficial for densification. The typical values of relative density, hardness, bending strength, and fracture toughness of the composites reached 99.20%, 32.84?GPa, 858?MPa and 8.21?MPa?m^1/2, respectively. Crack deflection, crack bridging, crack branching, and microcracking were considered to be the potential toughening mechanisms in the composites. Furthermore, numerous nano-sized intergranular/intragranular phases and twin structures were observed in the B₄C-TiB₂-SiC composite.     

One-step scalable preparation of graphene nanosheets and high-thermal-conductivity flexible graphene films

It is well known that graphene nanosheets (GNSs) have many excellent properties. However, it has been a difficult thing to exfoliate graphite into GNSs in a controllable and scalable manner. In this research, a new strategy named xylitol-assisted ball milling exfoliation (XABME) was developed for the scalable preparation of GNSs. The experimental results characterized by a series of measurements showed that GNSs were successfully exfoliated by the XABME strategy. The structure of the prepared nanosheets was featured by large lateral size and ultra-small thickness. Furthermore, the prepared GNSs easily achieved high production yield (≈54%). Lastly, the as-obtained GNSs and cellulose nanofibers (CNF) were compounded to form some nanomaterial films. The prepared films exhibited excellent flexibility and higher thermal conductivity, with the in-plane thermal conductivity of 90 wt% GNS film (8.0 W/(m·K)) being 11.4 times higher than that of the film without GNSs. This shows that GNSs could effectively enhance the thermal conductivity of the CNF matrix and indicate that these prepared films have great potentials in the thermal management of portable mobile devices.     

Modeling and simulation of a fully air swept ball mill in a raw material grinding circuit

A raw material grinding circuit was modeled using plant data. Samples were collected from around the circuit and, following a crash stop, from inside the mill. The size distributions of the samples were determined down to a few microns. Using the data from inside the mill a modeling approach, based on perfect mixing, was developed. The modelling approach implicitly assumes that the mixture of feed materials broken is homogenous from the breakage point of view. The air classification around the circuit was modeled using the efficiency curve approach. In order to measure the success of the method the circuit performance was predicted by simulation studies while it was operating at different conditions. The results were then compared with the measured data. It is concluded that modeling gives a useful quantitative indication of what may occur in fully air swept mills.     

贵冶二期闪速炉失重给料螺旋运行实践

本文介绍了贵冶失重给料螺旋的性能、生产准备、点检维修、技术攻关、缺陷改进。     

金线断口的分析

运用扫描电子显微镜技术，对金线断口观察分析，讨论金线在拉伸过程中断裂时断口形貌及断裂的原因，发现，断裂是由于金锭中的气体和杂质引起的，并提出改进生产工艺的意见。     

面阵列封装器件的贴装技术

面阵列封装器件在电子产品中的使用率逐年上升，如何实现其高速贴装是影响生产线效率的重要因素。从不同的角度论述了面阵列封装器件实现高速贴装的手段与技术。     

采用氮气氛保护的再流焊接技术

叙述了先进再流焊接技术的新发展,描述了提高BGA再流焊接效果的工艺要点,优化倒装芯片再流焊接和固化的新方法。最后,讲述了先进的降低氮消耗量的方法即:通过最大限度地提高潜在收益,以促进再流焊接技术的发展,以此来满足装配厂商的需要。     

抗弹陶瓷的犁削机理和自锐作用研究

研制了铬刚玉抗弹陶瓷，其抗弹能力比标准均质钢有很大的提高，通过分析讨论，其主要抗弹机制为犁削机理和自锐作用。     

螺旋挤压机设计的改进

介绍了热压型焦工艺设备螺旋挤压机设计改进情况。