Sealing behaviour of glass-based composites for oxygen transport membranes

In this study, seven different filler materials in different proportions were added to a Ba-Ca-Si glass matrix “H” to investigate new sealant with higher thermal expansion coefficient (CTE) value and good sealing performance for application in oxygen transport membrane (OTM). SrTi_0.75Fe_0.25O_3-δ (STF25) was used as an OTM, and the sealing partners were ferritic steel Aluchrom and pre-oxidized Aluchrom. Compatibility tests were carried out to investigate the feasibility of the composites. Higher CTE values were found in dilatometer tests on composite samples by adding 40 wt% Ag (HAg40) and 30 wt% Ni-Cr (HNC30). Gas-tightness measurements of sandwiched samples produced appropriate helium leakage rates in the range of 10^?6 mbar·l·s^?1. Sealing behaviour of sealants HAg40 and HNC30 were investigated by joining STF25 and as-delivered/pre-oxidized Aluchrom together. Scanning electron microscopy (SEM) on cross-sections of the joints revealed a homogeneous microstructure and good adherence of the glass sealants to support metals and STF25.     

Numerical simulations of specimen size and mismatch effects in ductile crack growth - Part II: Near-tip stress fields

The effect of ductile crack growth on the near tip stress field in two different specimen geometries has been investigated. For homogeneous specimens it is observed that the peak stress level increases with ductile crack growth. The effect is most pronounced up to about 1 mm of crack growth. For low and intermediate hardening there is a significant effect of specimen size on the stress level. In case of mismatch in yield stress, the simulations show that the increase in stress level in the material with the lower yield stress is of a similar magnitude as is the case for stationary cracks. In case of ductile crack growth deviation from the original crack plane occurs, the highest stresses are still found close to the interface, and not in front of the current crack tip.     

Development of a gap searching program for automotive body assemblies based on a decomposition model representation

Automobiles, aircraft, and ships require tremendously many parts to be assembled. For developing such large assemblies, most companies accelerate the design process by having many design engineers in different functional or sectional design groups working concurrently. However, interferences and gaps can be found when the parts and sub-assemblies of different design groups are to be assembled. These error cause design changes and additional repair processes, resulting in an unexpected increase in costs and time delays. While the interference problem has been resolved by digital mockup and concurrent engineering methodology, many cases of the gap problem in the automotive industry have been covered by temporary treatments when the gaps are small enough to be filled with sealants. This kind of fast fix can cause leakage into the engine chamber and passenger cabin when the gap size is too big for filling or when the sealant gets old, which can turn fatal. With this research, we have developed a program to automatically find gaps between the parts of an assembly so that design engineers can correct their designs before the manufacturing stage begins. By using the method of decomposition model representation, the program can visualize gaps between complex car body parts as well as estimate their volumetric information. It can also automatically define the boundary between a gap and the exterior space. Although we have reviewed the benefits of the program by applying it to car development, it can also be applied to aircraft and ship designs comprising several parts.     

一种用于高T;无卤覆铜板的含氮酚醛树脂的制备方法

文章涉及一种新型含氮树脂的制备方法,替代传统的含氮树脂,使用溶剂充分溶解,作为含磷树脂的固化剂,可用于无卤覆铜板的生产,所得覆铜板的性能均一,T;180 ℃以上,耐热性T288 ℃约为10 min。     

Peer-exchange schemes to handle mismatch in peer-to-peer systems

A self-organizing peer-to-peer system is built upon an application level overlay, whose topology is independent of an underlying physical network. A well-routed message path in such systems may result in a long delay and excessive traffic due to the mismatch between logical and physical networks. In order to solve this problem, we present a family of Peer-exchange Routing Optimization Protocols (PROP) to reconstruct the overlay. It includes two policies: PROP-G for generic condition and PROP-O for optimized one. Both theoretical analysis and simulation experiments show that these two protocols greatly reduce the average latency of the overlay and achieve a better logical topology with low overhead. Their overall performance can be further improved if combined with other recent approaches. Specifically, PROP-G can be easily applied to both structured and unstructured systems without the loss of their primary characteristics, such as efficient routing and anonymity. PROP-O, on the other hand, is more efficient, especially in a heterogenous environment where nodes have different processing capabilities.

Study on residual stress in viscoelastic thin film using curvature measurement method

Using LSM (laser scanning method), the radius of curvature due to thermal deformation in polyimide film coated on Si substrate is measured. Since the polyimide film shows viscoelastic behavior, i.e., the modulus and deformation of the film vary with time and temperature, we estimate the relaxation modulus and the residual stresses of the polyimide film by measuring the radius of curvature and subsequently by performing viscoelastic analysis. The residual stresses relax by an amount of 10% at 100°C and 20% at 150°C for two hours.     

Advanced methods for mechanical and structural characterization of nanoscale materials for 3D IC integration

Managing the emerging internal mechanical stress in chips, particularly if they are 3D stacked, is a key task to maintain performance and reliability of microelectronic products. Hence, a strong need of a physics-based simulation methodology emerges. This physics-based simulation, however, requires material parameters with high accuracy. A full-chip analysis can then be performed, balancing the need for local resolution and computing time. The key for an efficient simulation of a 3D stacked IC is a comprehensive database with material properties for multiple scales of the affected materials. Therefore, effective “composite-type” material data for several regions of interest are needed. Advanced techniques to measure FEA- and design-relevant properties such as adhesion properties and effective CTE values are presented.     

Multipass rolling of aluminium alloys: finite element simulations and microstructural evolution

Abstract

Use of numerical predictive methods such as finite element analysis is becoming progressively more common for modelling industrial hot metal working and forming processes. These tools are used not only to predict the thermomechanical behaviour of metals but increasingly to predict microstructural changes by linking them to physical models of recrystallisation and textural evolution. This paper describes the development and application of a fully integrated model for the prediction of thermomechanical and microstructural behaviour during multipass hot rolling of aluminium alloy AA 3104. Finite element code ABAQUS/standard has been used in the work and the process is modelled assuming plane strain conditions. It is shown that for this alloy the static recrystallisation which occurs during interpass cooling does not significantly influence the thermomechanical response during subsequent rolling passes.     

Accounting for variability in the design of circuits with organic thin-film transistors

We experimentally verify that the methodology to account for local parameter variations and transistor mismatch known in Si CMOS technologies can be transposed to organic thin-film transistor technologies, and we present a design case that makes use of design for variability. Transistor parameter variation decreases with the square root of the transistor footprint. As a consequence, Monte Carlo simulations which take this effect into account can be executed to better predict the final circuit yield. The design case in this work is an 8-bit, organic RFID transponder chip. The yield prediction by simulations corresponds to the finally observed circuit yield.     

高体积比SiC_p/6013Al复合材料反应熔渗制备与热学性能

采用反应熔渗法在低压力下制备高体积比SiCp/Al复合材料 ,并研究其热学性能。临界熔渗压力与SiC颗粒尺寸及反应程度有关。Al熔体在无压或低压力下能渗入SiC预成形坯 ,制备出组织均匀的高体积比SiCp/Al复合材料 ,SiC颗粒体积分数约 5 0 %。界面反应对SiCp/Al复合材料的CTE的影响很小 ,但会降低SiC/Al的界面传热系数 ,影响材料的导热性能。降低熔渗温度和缩短保温时间可缓减界面反应程度 ,提高复合材料的热学性能 ,CTE在 10× 10 - 6 /K以下 ,复合材料的导热系数达到 164(W·m- 1 ·K- 1 )。