Experimental study of crystal anisotropy based on ultra-precision cylindrical turning of single-crystal calcium fluoride

To realize ultimately efficient signal processing, it is necessary to replace electrical signal processing circuits with optical ones. The optical micro-resonator, which localizes light at a certain spot, is an essential component in optical signal processing. Single-crystal calcium fluoride (CaF₂) is the most suitable material for a highly efficient optical micro-resonator. The CaF₂ resonator can only be manufactured by ultra-precision machining processes, because its crystal anisotropy does not allow the application of chemical etching. However, the optical micro-resonator's performance depends definitely on the surface integrity.This study investigated the relationship between surface quality after ultra-precision machining and crystal anisotropy. Firstly, crack initiation was investigated on the (1 0 0), (1 1 0), and (1 1 1) planes using the micro-Vickers hardness test. Secondly, brittle-ductile transition was investigated by orthogonal cutting tests. Finally, cutting performance of cylindrical turning was evaluated, which could be a suitable method for manufacturing the CaF₂ resonator. The most difficult point in cylindrical turning of CaF₂ is that the crystalline plane and cutting direction vary continuously. In order to manufacture the CaF₂ optical micro-resonator more efficiently, analysis was conducted on crack initiation and surface quality of all crystallographic orientations from the perspective of slip system and cleavage.     

冷轧平整机机前甩尾轧制工艺的开发与应用

本文介绍了柳钢冷轧板带厂1550 mm单机架平整机机前甩尾轧制的工艺。改进前轧制每卷钢卷生产效率低,钢卷成材率低,改进后生产效率、成材率明显提高,部分规格的钢卷能实现带尾剪切长度为零。     

Sintering,microstructure, and mechanical properties of vitrified bond diamond composite

The demand for high-performance grinding wheels is gradually increasing due to rapid industrial development. Vitrified bond diamond composite is a versatile material for grinding wheels used in the backside grinding step of Si wafer production. However, the properties of the vitrified bond diamond composite are controlled by the characteristics of the diamond particles, the vitrified bond, and pores and are very complicated. The main objective of this study was to investigate the effects of SiO₂–Na₂O–B₂O₃–Al₂O₃–Li₂O–K₂O–CaO–MgO–ZrO₂–TiO₂–Bi₂O₃ glass powder on the sintering, microstructure, and mechanical properties of the vitrified bond diamond composite. The elemental distributions of the composite were analyzed using electron probe micro-analysis (EPMA) to clarify the diffusion behaviors of various elements during sintering.The results showed that the relative density and transverse rupture strength of the composite sintered at 620 °C were 91.7% and 126 MPa, respectively. After sintering at 680 °C, the glass powder used in this study exhibited a superior forming ability without an additional pore foaming agent. The relative density and transverse rupture strength of the composite decreased to 48.2% and 49 MPa, respectively. Moreover, the low sintering temperature of this glass powder protected the diamond particles from graphitization during sintering, as determined by X-ray diffraction and Raman spectrum. Furthermore, the EPMA results indicate that Na diffused and segregated at the interface between the diamond particles and vitrified bond, contributing to the improved bonding. The diamond particles can remain effectively bonded by the vitrified bond even after fracture.     

Synthesis of Diamond@SiO2@Ag composite materials for high SERS effect

Among various carbon materials, diamond stands out due to excellent physical and chemical properties. In this work, we designed Dia@SiO₂@Ag composites combining diamond micropowder and Ag nanoparticles by a simple chemical method and obtained stable substrate for surface enhanced Raman scattering (SERS) owing to its high surface-to-volume ratio, low density, as well as close bond between diamond and Ag. As-prepared Dia@SiO₂@Ag presented high activity to detect crystal violet and rhodamine 6G molecules, which was demonstrated by significantly enhanced SERS spectra and high enhancement factor values (10⁸-10⁹). Moreover, Dia@SiO₂@Ag also showed desired sensitivity, which was investigated by detection limit. Therefore, our study provided more theoretical support and broadened the functional applications of diamond, particularly in Raman detection.     

Influences of chip serration on micro-topography of machined surface in high-speed cutting

Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study.     

机械-射流破岩耦合特性研究

在现代旋转钻井破碎井底岩石中仍是以机械破岩为主，理论与实践证明，射流辅助破岩是提高钻井破岩效率的重要途径，但它们的耦合特性研究极少。文章基于渗流场与应力场的耦合理论分析，进行了机械与射流破岩耦合特性的实验研究。结果表明：射流压力和水楔作用对岩石渗流场、应力场具有重要作用，耦合作用比非耦合作用的破岩效率有较大幅度的提高。在实验条件下，砂岩的耦合作用提高破岩效率40％左右，灰岩的耦合作用提高破岩效率20％左右。     

基于MODBUS协议的激光雕刻切割系统HMI人机交互设备

近年来,国内激光雕刻切割控制器技术发展迅速,基于PC的传统控制器已相当成熟.为了显著提高工业生产效率,适应工业生产规模扩张的需要以及工业对系统稳定性要求的提高,目前国内几家专业运动控制器厂家已经实现了激光雕刻切割控制器的完全脱机运行.本文针对脱机控制器的需要设计一款人机交互设备,该设备采用AT89C55WD单片机为主控制器,采用标准的MODBUS协议实现HMI与脱机控制器的可靠通讯.     

Simulations of Temperature Field in HFCVD Diamond Films over Large Area

A three-dimensional model was developed to investigate the influence of various hot filaments parameters on substrate temperature fields that significantly affect the nucleation and growth of diamond films over large area by hot-filament chemical vapordeposition (HFCVD). Numerical simulated results indicated that substrate temperature varies as a function of hot filamentsnumber, radius, temperature, emissivity, the distance between filaments, and the distance between substrate and filamentsarrangement plane. When these filaments parameters were maintained at the optimal values, the homogeneous substrate temperature region of 76 mm×76 mm with the temperature fluctuation no more than 5% could be obtained by a 80 mm×80 mmhot filaments arrangement plane. Furthermore, the homogeneous region could be enlarged to 100 mm×100 mm under thecondition of supplementary hot filaments with appropriate parameters. All of these calculations provided the basis for speciallyoptimizing the hot filaments parameters to dep     

Investigation into polishing process of CVD diamond films

A new technique used for polishing chemical vapor deposition (CVD) diamond films has been investigated, by which rough polishing of the CVD diamond films can be achieved efficiently. A CVD diamond film is coated with a thin layer of electrically conductive material in advance, and then electro-discharge machining (EDM) is used to machine the coated surface. As a result, peaks on the surface of the diamond film are removed rapidly. During machining, graphitization of diamond enables the EDM process to continue. The single pulse discharge shows that the material of the coated layer evidently affects removal behavior of the CVD diamond films. Compared with the machining of ordinary metal materials, the process of EDM CVD diamond films possesses a quite different characteristic. The removal mechanism of the CVD diamond films is discussed.