Atomic-scale friction control by vibration using friction force microscope

Manipulation of friction at the nanoscale has been traditionally approached by chemical means (lubrication). Recent friction force microscopy (FFM) experiments demonstrated that it can be done mechanically by applying vibration to accessible elements of the system. This paper provides analytic understanding on why vibration can reduce friction based on a 1D model imitating the FFM tip moving on a substrate. Open-loop stability is first studied, and a feedback vibration control is then designed using the accessible variable. Comparing to the open-loop system, friction force is significantly reduced in the closed-loop system. Numerical simulations show satisfactory performances.     

纳米样板的制备及其精度分析

介绍了纳米样板的研究现状及制备工艺，特别对扫描探针显微镜(SPM)表面局域氧化反应工艺进行了详述；分析了原子力显微镜(AFM)探针诱导局域氧化工艺的原理及其影响参数，原理为高度局域化的电化学反应，影响参数包括探针上所施加的电压、扫描速度、探针曲率半径、相对湿度以及氧化物厚度等；用该方法分别制备了5条栅线和7条栅线的一维纳米结构样板，并对7条栅线的纳米结构样板的精度和不确定度影响因素进行了分析。     

Multi-scale characteristics of magnesium potassium phosphate cement modified by metakaolin

Workability and early-ages mechanical properties are important indicators of magnesium potassium phosphate cement (MKPC) as a repair material. The effect of metakaolin (MK) on the setting time, fluidity and early-ages strength of MKPC paste was studied, and its influence mechanism was analyzed through pore structure, microstructure and nanomechanical properties. The results show that 10% and 20% of MK prolong the setting time of MKPC paste, but excessive MK shortens the setting time of MKPC paste. Meanwhile, incorporating MK reduces the fluidity of MKPC paste, and the early-ages strength of MKPC specimens increases when the substitution ratio of MK is 10%. When 10% of MK is incorporated to the MKPC paste, the 30-d shrinkage of the sample is only 69% of the control group. Meanwhile, a proper amount of MK can improve the pore structure of the MKPC specimen and make its microstructure denser by generating amorphous aluminosilicate phosphate gel. It is observed from the nano-scale characteristics that incorporating 10% MK can reduce the content of pore phase and unreacted MgO phase, and increase the volume fraction of hydration products.     

硅灰石与纳米MoS2对丙烯酸酯橡胶摩擦磨损性能的影响

采用无转子硫化仪、环-块式摩擦试验机、电子和光学显微镜等分析表征手段,考察了硅灰石及其与纳米二硫化钼(MoS2)并用对丙烯酸酯橡胶(ACM)摩擦磨损性能的影响。结果表明,随着硅灰石用量的增加,改性ACM硫化胶的摩擦因数逐渐降低,而磨损体积呈现出先降低后升高的趋势;当硅灰石用量为35 phr时,硫化胶具有较小的摩擦因数和最好的耐磨性。在35 phr硅灰石改性ACM基础上添加1 phr纳米MoS2时,硫化胶的摩擦因数和磨损体积分别下降到0.4和1.54 mm3,表现出最低的摩擦因数和磨损体积,同时还保持较好的硫化和力学性能。纳米MoS2与硅灰石并用改性ACM时,硫化胶表现出轻微的磨粒磨损特征,磨损面平整光滑,形成的转移膜薄且完整均匀。     

聚苯乙烯的刚性无机粒子增韧

讨论了刚性无机粒子在增韧聚苯乙烯塑料中的增韧机理、影响因素及其应用。通过讨论得出结论,无机纳米粒子的出现,将会大大促进无机刚性粒子在塑料增韧方面的应用。     

Electrochemical corrosion behavior of nickel coating with high density nano-scale twins (NT) in solution with Cl

In this work, a nickel coating with high density nano-scale twins (NT) was synthesized on Q235 steel by using pulsed electrodeposition technique. The effects of NT structure on pitting corrosion resistance and semi-conducting properties of passive films formed on pure Ni in borate buffer solution with chloride ions were investigated by the potentiodynamic polarization measurements and capacitance measurements. The results indicated that the passive films formed on NT coatings showed higher pitting corrosion resistance and a bi-layer semi-conducting structure distribution, comparing with those formed on industrial electrodeposited (IE) nickel. The passive films are p-type semi-conductors at low potentials, but they show an n-type semi-conductor behavior at high potentials. It demonstrated that NT structure decreased vacancy diffusion velocity and slowed down the growth of passive films consequently. This led to the enhancement of pitting resistance for NT nickel.     

元素迁移的模拟模型实验

从野外不同地质体上，观察到地壳中元素是以纳米微粒状态被上升气流迁移的。为了进一步研究，设计了模拟以上升气流通过矿层、矿层加盖及围岩的模型层。实验结果显示，在模型中上升气流迁移的粒子仍是纳米微粒，并且采样片上含量也是随时间积累而增加。当有水层和玻璃盖层时，部分元素仍能穿透盖层，部分元素迁移受阻挠。纯扩散实验说明纯扩散迁移也存在，不过迁移量很小。列出模型实验中用扫描探针显微术观察到的纳米微粒照片。     

Frequency properties of on-die power distribution network in VLSI circuits

The local voltage fluctuations in the supply and ground grids triggered by on-die logic cell switching in VLSI devices have been experimentally studied. The results show that these fluctuations have a resonant-like form i.e., the on-die power grid should be described as an RLC circuit. The studies reveal that the active element (i.e., CMOS logic cell) affects the frequency properties of power supply and ground grids during its switching (as opposed to before or after switching). It is demonstrated that the frequency properties of the both grids are inter-related via the interconnecting active elements.     

Fatigue strength of the Cu/Si interface in nano-components

The fracture behavior of the Cu/Si interface in a nano-cantilever specimen with a 200 nm-thick Cu film (Specimen-200), which possesses a nanometer-scale strain-concentrated region, is examined under a cyclic bending load. The fatigue strength is around GPa level owing to the high yield stress of the Cu nano-film and the deformation constraint associated with the neighboring hard materials. The S-N curve shows clear dependence of fatigue life on the applied stress in the high-stress range, Δσ. Specimens with a 20 nm-thick Cu film (Specimen-20) are also investigated for comparison. The stress range in the fatigue fracture of Specimen-20 is higher than that of Specimen-200 for the same fatigue life. However, there is good coincidence in the Δσ/σ_s (σ_s: strength in monotonic load) vs. N_f (number of cycles to fracture) at high Δσ. The S-N curves suggest the existence of a fatigue threshold (Δσ_w) at low Δσ. The ratio of fatigue limit to the fracture stress in a monotonic loading, Δσ_w/σ_s, is large compared with the magnitude of bulk metal, which suggests the brittle behavior of the interface. Moreover, the fatigue limits have good coincidence with their yield stresses.     

Nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process

The nano-scale metallization of Au on flexible polyimide substrate by reversal imprint and lift-off process was investigated. The nano-scale mold was fabricated; the anti-adhesion property of nanometer-size Si-mold was improved and the surface free energy was calculated with the contact angle measurement. The ∼150 nm width Au nano-wires were successfully fabricated on Si and on flexible polyimide substrate with the proposed process. The PMMA thickness dependent trend with reversal imprinting and Au nano-wires lift-off results were also investigated by SEM analysis.