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排序方式: 共有1316条查询结果,搜索用时 31 毫秒
1.
The smoke suppression of rigid polyurethane foam (RPUF) modified by melamine was investigated based on three sections: the condensed phase, the carbon layer, and the gas phase. In the condensed phase, the results of thermogravimetry, X‐ray photoelectron spectroscopy (XPS) N1S spectrum, and Fourier transform infrared spectroscopy indicated that melamine could suppress the degradation of RPUF by reacting with the aromatic hydrocarbons. It also reduced the smoke generation because the volatilizable aromatic hydrocarbons were the principal smoke precursors in a fire. In the carbon layer, the decrease from 38.50% to 24.76% of the inner layer oxygen content identified by XPS full‐spectrum and C1S spectrum indicated that melamine could prevent oxygen from transferring into the inner foam by the formation of an enhanced surface carbon layer, and the enhanced carbon layer could also block the release of smoke precursors. In the gas phase, the content of total aromatic hydrocarbons declined to 59.12% according to pyrolysis gaseous chromatography mass spectroscopy and indicated that melamine could reduce the smoke precursors. The results of smoke density chamber and cone calorimeter tests revealed that the addition of the melamine could decrease the smoke density of burning RPUF. Copyright © 2014 John Wiley & Sons, Ltd. 相似文献
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Replies to comments by J. Read (see record 2007-07130-012), D. Gleaves et al (see record 2007-07130-013), V. Edwards et al (see record 2007-07130-014), M. Black and R. Black (see record 2007-07130-015), and S. Ullman (see record 2007-07130-016), which raised important points about the authors' original article (see record 2006-03947-003). Those comments extend our thinking about how to ask participants about abuse in an ethical way. Together, the comments point to the importance of researchers examining our own reasons for asking--or not asking--about abuse and of paying attention to how we respond when we ask. (PsycINFO Database Record (c) 2010 APA, all rights reserved) 相似文献
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A trade-off analysis on the cost and system packaging metrics of an electronic product aimed at the commercial/retail industry has been carried out. By comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete components, denser PCB wiring technology, double sided IC package surface mount, surface mount connectors, and improved plastics for the product housing. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies. 相似文献
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A new sulfonated melamine–urea–formaldehyde (MUF) resin of relatively low melamine content, prepared according to a sequential formulation, has been shown to be highly effective when coupled with different natural vegetable tannins to produce leather with the same good characteristics of leather prepared with chrome salts. In particular, the antishrinkage effectiveness of the leather prepared according to the new approach is comparable to that obtained with chrome tanned leathers. The comparison of the traditional leather shrinkage temperatures test method with a new thermomechanical analysis (TMA) test method in tension yields thermograms presenting three major modulus of elasticity (MOE) peaks. These are closely connected to molecular level phenomena determining the shrinkage temperature of leather. The three determining parameters appear to be as follows: (1) The average value of the temperatures at which the three MOE peaks occur: the higher the value of this average, the lower is the shrinkage of leather. (2) The average of maximum MOE values of the TMA peaks: the higher this average is, the better is the leather in regard to antishrinkage effectiveness. This means the leather maximum MOE at each peak is a measure of the resistance to the contraction force induced by heat. (3) The relative intensity of the first TMA peak in relation to the second: the higher the value of the MOE for the first TMA peak is in relation to the second peak, the lower the leather shrinkage appears to be. However, it has not been possible to better define or quantify this latter effect. This new TMA test method in tension has also yielded a mathematical relationship correlating the thermogram peak temperatures and MOE averages with the traditional shrinkage temperature to a high degree of confidence. A previous TMA test method, in compression, has proven to yield more problematic and finally not very reliable results when one needs to apply it to a wide variety of different cases. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 88: 1889–1903, 2003 相似文献
6.
Tangjian Cheng Genpin Lv Yitao Li Hao Yun Lingfei Zhang Yongmao Deng Liping Lin Xiangjun Luo Junmin Nan 《大分子材料与工程》2021,306(7):2100086
The low dielectric polymer films have drawn great attention to the application as the dielectric insulating materials in high-frequency circuit boards, while the weak adhesion to the copper foils and the poor processability resulted from the fluorinated or rigid structures limited their high-frequency application. In this work, the low dielectric and high adhesive polyimide/fluorinated ethylene propylene (PI/FEP) nanocomposite film for high-frequency flexible circuit board application is developed. It is indicated that the fluorocarbon surfactants can significantly improve the dispersion of FEP in PI substrate, and thus, the PI/FEP nanocomposite film exhibits excellent mechanical properties, including the tensile strength increases to 46.6 MPa and the elongation at the break increases to 13.7%. Importantly, at the high-frequency of 10 GHz, the 60 wt% FEP filled PI nanocomposite film displays an ultralow dielectric loss (0.006) and a reduced dielectric constant (2.69). In addition, the high-frequency flexible circuit board with the PI/FEP film as the dielectric insulating layer has a high peel strength of 0.75 N mm−1, indicating this PI/FEP nanocomposite film can meet the requirements of the high-frequency flexible circuit board application. 相似文献
7.
Xiaojie Lv Jingjing Wang Danning Ding Jiaojiao Liang Zhongzheng Zhao Yuan Liang Zhenfei Zhang Chunlin Ye Yuwei Chen Peng Wei Yanping Wang Yong He Yumin Xia 《大分子材料与工程》2021,306(12):2100560
In this study, a kind of imidazole type poly(ionic liquid) ([PEP-MIM]Cl) is synthesized, which can disperse carbon effectively. [PEP-MIM]Cl is used as an intermediate to coat carbon on the poly(acrylic acid)(PAA-co-MBA) via ion exchange to obtain conductive polymer composite (CPC). A series of characterizations are performed. Experiments show that carbon can be coated on the PAA-co-MBA uniformly, and compared with using carbon as filler, this method requires less carbon to achieve good conductive performance. The carbon layer on the polymer's surface is enriched via the swelling-shrinking properties of PAA-co-MBA according to the SEM images. Furthermore, in combination with 3D printing technology, PAA-co-MBA can be designed into different shapes to achieve various functions such as pressure-sensing element. Finally, a new type of CPC named carbon clad polymeric laminate (CCPL) is prepared by using the carbon coating method and 3D printing technology. It has the potential to replace copper clad laminate (CCL) and printed circuit board (PCB), to a certain extent. This technology expands the preparation method and application of the CPC such as flexible and wearable conductive fabrics. 相似文献
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