Interfacial microstructure and mechanical properties of Ti3SiC2 ceramic and TC11 alloy joint diffusion bonded with a Cu interlayer

Reliable joints of Ti₃SiC₂ ceramic and TC11 alloy were diffusion bonded with a 50 μm thick Cu interlayer. The typical interfacial structure of the diffusion boned joint, which was dependent on the interdiffusion and chemical reactions between Al, Si and Ti atoms from the base materials and Cu interlayer, was TC11/α-Ti + β-Ti + Ti₂Cu + TiCu/Ti₅Si₄ + TiSiCu/Cu(s, s)/Ti₃SiC₂. The influence of bonding temperature and time on the interfacial structure and mechanical properties of Ti₃SiC₂/Cu/TC11 joint was analyzed. With the increase of bonding temperature and time, the joint shear strength was gradually increased due to enhanced atomic diffusion. However, the thickness of Ti₅Si₄ and TiSiCu layers with high microhardness increased for a long holding time, resulting in the reduction of bonding strength. The maximum shear strength of 251 ± 6 MPa was obtained for the joint diffusion bonded at 850 °C for 60 min, and fracture primarily occurred at the diffusion layer adjacent to the Ti₃SiC₂ substrate. This work provided an economical and convenient solution for broadening the engineering application of Ti₃SiC₂ ceramic.     

Interlayer Engineering of Molybdenum Trioxide toward High‐Capacity and Stable Sodium Ion Half/Full Batteries

Orthorhombic molybdenum trioxide (MoO₃) is one of the most promising anode materials for sodium‐ion batteries because of its rich chemistry associated with multiple valence states and intriguing layered structure. However, MoO₃ still suffers from the low rate capability and poor cycle induced by pulverization during de/sodiation. An ingenious two‐step synthesis strategy to fine tune the layer structure of MoO₃ targeting stable and fast sodium ionic diffusion channels is reported here. By integrating partially reduction and organic molecule intercalation methodologies, the interlayer spacing of MoO₃ is remarkably enlarged to 10.40 Å and the layer structural integration are reinforced by dimercapto groups of bismuththiol molecules. Comprehensive characterizations and density functional theory calculations prove that the intercalated bismuththiol (DMcT) molecules substantially enhanced electronic conductivity and effectively shield the electrostatic interaction between Na⁺ and the MoO₃ host by conjugated double bond, resulting in improved Na⁺ insertion/extraction kinetics. Benefiting from these features, the newly devised layered MoO₃ electrode achieves excellent long‐term cycling stability and outstanding rate performance. These achievements are of vital significance for the preparation of sodium‐ion battery anode materials with high‐rate capability and long cycling life using intercalation chemistry.     

陆西凹陷包日温都断裂构造带岩性油藏研究

为寻找岩性油藏，应用波阻抗反演地震储层预测技术，对包日温都断裂构造带砂体展布情况进行了预测，发现并落实了2个岩性圈闭，由此认为，研究区北部是大型水下扇砂体与半深湖相暗色泥岩交汇之处，有利于形成岩性油藏，这一结论将对今后加强储层预测工作和寻找有利砂体提供借鉴。     

Analysis of the Ductile Strength of Welds Weakened by Notches in Longitudinally Welded Pipes of Large Diameter by the Method of Slip Lines

We study the stressed state of an inhomogeneous welded joint containing an interlayer of a more high-strength material under the action of tensile loads. It is assumed that the contact boundary has a cracklike defect. We deduce analytic dependences of the fracture load on the mechanical inhomogeneity of the joint, thickness of the interlayer, and depth of the defect. The maximum depth of the defect to which the joint is insensitive is established. The proposed theoretical results are innovative and agree with the experimental data obtained for specimens cut out from a pipe of 14KhGS steel.     

用于微波/射频集成电路的一种新型低损耗介质——多孔硅及氧化多孔硅厚膜

提出在单片微波集成电路(MMIC)中用多孔硅/氧化多孔硅厚膜作微波无源器件的低损耗介质膜.研究了厚度为70μm的多孔硅/氧化多孔硅厚膜在低阻硅衬底上的形成,这层厚膜增加了衬底的电阻率,减少了微波的有效介质损耗.通过测量在低阻硅衬底上形成的氧化多孔硅厚膜上的共平面波导的微波特性,证明了在低阻硅衬底上用厚膜氧化多孔硅可以提高共平面传输线(CPW)的微波特性.     

Adhesion studies of diamond-like carbon films deposited on Ti6Al4V substrate with a silicon interlayer

Diamond-like carbon (DLC) films have proven quite advantageous in many tribological applications due to their low friction coefficient, their extreme hardness, and more recently their high adherence on different substrate materials. However, for many applications, DLC films as thick as 2 μm are required, which cause high residual stress. In order to overcome this problem, this study observed the behavior of different thicknesses of silicon interlayer between DLC films and Ti6Al4V substrates. The study also analyzed the relation of growth parameters to the mechanical properties of DLC films. Silicon and DLC films were grown by using a rf-PECVD at 13.56 MHz with silane and methane atmospheres, respectively. The contribution of an interlayer thickness to the adhesion between the DLC films and Ti6Al4V substrate was evaluated by using a micro-scratch technique. The hardness and friction coefficient were evaluated by using microindentation and lateral force microscopy (LFM), respectively. Raman scattering spectroscopy was used to characterize the film quality. A correlation was found between the intrinsic stress and adhesion of DLC film and the parameters of the silicon interlayer growth. The addition of a silicon interlayer successfully reduced intrinsic stress of the films, even as measured by using a perfilometry technique.     

印尼某火电厂Ａ２—Ａ４区人工边坡失稳机制研究

以印尼某火电厂涉外项目Ａ２—Ａ４区的问题人工边坡为研究对象,通过现场地勘、实际变形失稳过程、数值模拟等方法综合研究了该地人工边坡失稳机制。在此基础上,探讨了边滑坡加固措施的作用效果及合理性。所得主要结论:Ａ２—Ａ４区人工边坡变形失稳机制主要为软弱地层（煤层）切穿暴露所造成的组合滑移以及坡体沿土岩分界面所造成局部变形,变形破坏模式接近圆弧滑动,人工边坡中的软弱夹层是导致边坡失稳的主控因素;Ａ２、Ａ４区综合考虑桩锚＋坡面锚杆的方式进行加固,煤层和全风化泥岩及上部土层内的组合变形没有发展贯通趋势,边坡整体安全。Ａ３区在加固作用下存在沿二级坡脚＋煤层＋全风化泥岩＋上部土层内越顶组合滑移风险以及基坑开挖造成基坑侧壁坍滑风险,需要引起重视并加强监测。     

Study on diffusion welding SiCp/ZL101 with Cu interlayer

Through the vacuum diffusion welding SiCp/ZL101 aluminum with Cu interlayer,the effect of welding parame-ter and the thickness of Cu on the welded joint property was investigated,and the optimal welding parameters were putforward at the same time.The microstructure of joint was analyzed by means of optical-microscope,scanning electron mi-croscope in order to study the relationship between the macro-properties of joint and the microstructure.The results showthat diffusion welding with Cu interlayer could be used for welding aluminum matrix composites SiCp/ZL101 successfully.     

掺杂石墨/Cu钎焊接头残余应力的分布特征及中间层的作用

利用有限元方法,模拟分析了掺杂石墨/Cu钎焊接头残余应力的分布特征。分析结果表明,对接头有害的较大残余应力分布在石墨棱角距离焊缝约0.8mm处的狭小区域;降低连接温度、减少连接时间及增加钎焊压力均有利于减小接头残余应力,优化接头的界面应力状态;中间层的加入在一定程度上缓和了接头的残余应力。从缓和效果来看,Cu比Mo作中间层好,而Cu/Mo复合中间层的缓和效果最好,是较理想的中间层材料。     

Friction welding of TiAl intermetallics and structural steel by applying Inconel 718 as interlayer

0IntroductionInterlayer metal is usually introduced while solidwelding heterogeneous metals with different chemical com-ponents and microstructures[1-3].The diffusion activationenergy(DAE)in both sides of interlayer and base metalcould be affected by the …