The concept of smartness in cyber–physical systems and connection to urban environment

The next-generation systems are expected to be largely cyber–physical systems (CPSs) that autonomously control physical processes, through sensors and actuators typically in real-time feedback and cooperative control loops distributed among physical and cyber environments. The rapid technological advancements enhance the smartness of these CPSs, pushing their boundaries of performance and efficiency by embedding new information and communication technologies. However, to what extent CPSs should be smarter so that they do not compromise safety and security of safety critical systems? is an open research question. Towards this goal, the purpose of this study is to establish a grounded theory to analyse what makes these systems smart? and eventually, how to find a balance between smartness and safety risks? In this precinct, this article aims to develop a conceptual framework, define the dimensions and derive the characteristics that make CPSs smart. The proposed approach combines an automated informetric and systematic analysis of literature pertinent to the topic of smartness across anthropology, science, engineering and technology. The analysis of a case study building and the discussions presented herein support the connection between the existing understanding of CPSs and smartness offered by the building design approach in urban environment.     

Influences of chip serration on micro-topography of machined surface in high-speed cutting

Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study.     

一款紧凑增强型可变阻抗电磁带隙结构

基于传统AI-EBG结构,提出了一种小尺寸的增强型电磁带隙结构,实现了从0.5~9.4 GHz的宽频带-40 dB噪声抑制深度,且下截止频率减少到数百MHz,可有效抑制多层PCB板间地弹噪声。文中同时研究了EBG结构在高速电路应用时的信号完整性问题,使用差分信号方案可改善信号完整性。     

现场总线漫谈

从现场总线多标准的现状出发，阐述了控制对象多样性与技术多样性之间的必然联系，通过对目前现场总线与传统DCS应用现状的分析，对现场总线的发展和应用前景进行了展望。     

FF现场总线的网段负载能力的设计及计算

从生产安全运行的管理要求；电压压降和电流的限制及信号的衰减；网络运行时间的要求；系统设计的影响；备用能力的考虑等各个方面，结合上海赛科聚苯乙烯项目的具体设计，分析隔爆条件下FF现场总线的H1网段负载能力的设计，以供大家探讨。     

墙体裂缝的成因及防治

介绍了墙体裂缝的种类，从地基不均匀下沉、温度变化等方面分析了引起墙体裂缝的原因，介绍了墙体裂缝的预防措施和治理措施，以有效控制墙体裂缝的危害程度。     

双排桩门架—锚杆新型组合支护体系的应用研究

本文分析了双排桩门架支护结构的受力机理。针对工程实际进行变形分析,提出增设锚杆形成锚杆———双排桩门架式组合支护体系的方法,并与监测数据对比、验证。     

对CFG桩质量缺陷的探讨

根据具体工程的概况及水文地质条件，分析了CFG桩在地下水位出现大面积缩颈现象和复合地基载荷试验达不到设计要求的原因，并介绍了地基补强措施，以满足工程质量的要求。     

一种估算单桩经济直径的方法

在滩海油田开发过程中,经常需要设立立管桩,在环境荷载的作用下,立管桩顶部会发生位移,较大的位移对立管及栈桥的安全很不利,因此需要合理确定单桩的直径。埕岛油田在确定单桩直径时引入了经济直径的概念,文章对经济直径的原理进行了分析,给出了桩顶位移和桩径经济指数计算公式,并举例进行了计算,得出了桩径与桩顶位移及桩径经济指数的关系曲线, 进而求得经济桩径的取值范围。文章还对该方法的优缺点进行了分析。     

控制爆破在复杂基坑开挖中的应用

在紧邻厂房中控室的基坑开挖中，根据复杂环境条件与施工要求，采用浅孔微差爆破并通过选取合理开沟掏槽位置来控制最小抵抗线方向以及控制一次最大起爆药量等措施，达到了控制飞石、降低爆破地震的效果，保证了爆破质量与爆破安全，提高了施工效率。