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1.
The eutectic 80Au/20Sn solder alloy is widely used in high power electronics and optoelectronics packaging. In this study, low cycle fatigue behavior of a eutectic 80Au/20Sn solder alloy is reported. The 80Au/20Sn solder shows a quasi-static fracture characteristic at high strain rates, and then gradually transforms from a transgranular fracture (dominated by fatigue damage) to intergranular fracture (dominated by creep damage) at low strain rates with increasing temperature. Coffin-Manson and Morrow models are proposed to evaluate the low cycle fatigue behavior of the 80Au/20Sn solder. Besides, the 80Au/20Sn solder has enhanced fatigue resistance compared to the 63Sn/37Pb solder. 相似文献
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The In-Sn-Ni alloys of various compositions were prepared and annealed at 160°C and 240°C. No ternary compounds were found;
however, most of the binary compounds had extensive ternary solubility. There was a continuous solid solution between the
Ni3Sn phase and Ni3In phase. The Sn-In/Ni couples, made of Sn-In alloys with various compositions, were reacted at 160°C and 240°C and formed
only one compound for all the Sn-In alloys/Ni couples reacted up to 8 h. At 240°C, Ni28In72 phase formed in the couples made with pure indium, In-10at.%Sn and In-11at.%Sn alloys, while Ni3Sn4 phase formed in the couples made of alloys with compositions varied from pure Sn to In-12at.%Sn. At 160°C, except in the
In/Ni couple, Ni3Sn4 formed by interfacial reaction. 相似文献
5.
YOSHIHARU KARIYA TADATOMO SUGA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):413-419
This paper details the deformation mechanism and low‐cycle fatigue life of eutectic solder alloys at high temperature (around 0.8Tm). Grain boundary sliding generally nucleates a wedge‐type cavity that reduces the low‐cycle fatigue life of metals. In this study, grain boundary sliding has promoted intergranular failure contributing to the reduction in fatigue life of Sn–Ag–Cu alloy. However, grain boundary sliding has exerted no deleterious effects on fatigue resistance of eutectic Pb–Sn and Bi–Sn alloys. The phase boundary sliding with very fine microstructure induces exceptional ductility in these alloys leading to superior low‐cycle fatigue endurance for theses eutectic Pb–Sn and Bi–Sn alloys. 相似文献
6.
T. YAMAMOTO M. IWATA M. SAKANE Y. TSUKADA H. NISHIMURA 《Fatigue & Fracture of Engineering Materials & Structures》2007,30(5):376-386
This paper describes the creep‐fatigue life of Sn–8Zn–3Bi under push–pull loading. Creep‐fatigue tests were carried out using Sn–8Zn–3Bi specimens in fast–fast, fast–slow, slow–fast, slow–slow and hold–time strain waveforms. Creep‐fatigue lives in the slow–slow and hold‐time waveforms showed a small reduction from the fast–fast lives but those in the slow–fast and fast–slow waveforms showed a significant reduction from the fast–fast lives. Conventional creep‐fatigue life prediction methods were applied to the experimental data and the applicability of the methods was discussed. Creep‐fatigue characteristics of Sn–8Zn–3Bi were compared with those of Sn–3.5Ag and Sn–37Pb. 相似文献
7.
本文介绍印制板液态感光阻焊油墨的工艺流程、工艺控制,并对生产中较常出现的几种质量问题进行讨论,进而提出解决措施。 相似文献
8.
低熔封接玻璃组成及其发展 总被引:25,自引:2,他引:23
综述了低熔封接玻璃的组成特点,给出了大量低熔玻璃组成实例,批出了低熔封接玻璃的封接低温化和无铅化发展方向,磷酸盐玻璃是首选组成之一。新的制备工艺和新的玻璃形成体系将对封接玻璃发展起着十分重要的作用。 相似文献
9.
The reaction between the Sn-Ag-Cu solders and Ni at 250°C for 10 min and 25 h was studied. Nine different Sn-Ag-Cu solders,
with the Ag concentration fixed at 3.9 wt.% and Cu concentrations varied between 0.0–3.0 wt.%, were used. When the reaction
time was 10 min, the reactions strongly depended on the Cu concentration. At low-Cu concentrations (≦0.2 wt.%), only a continuous
(Ni1−xCux)3Sn4 layer formed at the interface. When the Cu concentration increased to 0.4 wt.%, a continuous (Ni1−xCux)3Sn4 layer and a small amount of discontinuous (Cu1−yNiy)6Sn5 particles formed at the interface. When the Cu concentration increased to 0.5 wt.%, the amount of (Cu1−yNiy)6Sn5 increased and (Cu1−yNi6)6Sn5 became a continuous layer. Beneath this (Cu1−yNiy)6Sn5 layer was a very thin but continuous layer of (Ni1−xCux)3Sn4. At higher Cu concentrations (0.6–3.0 wt.%), (Ni1−xCux)3Sn4 disappeared, and only (Cu1−yNiy)6Sn5 was present. The reactions at 25 h also depended strongly on the Cu concentration, proving that the strong concentration
dependence was not a transient phenomenon limited to a short reaction time. The findings of this study were rationalized using
the Cu-Ni-Sn isotherm. This study shows that precise control over the Cu concentration in solders is needed to produce consistent
results. 相似文献
10.
综述了环氧树脂基的PCB与无铅化组装的兼容性问题。经过大量试验表明,常规的FR-4基材和双氰胺固化的高Tg基材是不能满足无铅化组装要求的,而采用酚醛固化的中等-Tg的环氧树脂基材是可能成为无铅化组装用基材的。同时,PCB制造过程也起着重要的作用。PCB设计和再(回)流焊的加热梯度也影响着无铅化的性能。 相似文献