Influences of chip serration on micro-topography of machined surface in high-speed cutting

Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study.     

DSP--数字化时代的基因芯片

DSP是当今发展最为迅速的和最有发展前景的技术之一。与普通CPU和MCU相比 ,DSP在数字信号处理方面有着无可比拟的优势 ,特别适合网络、通信、控制等需要进行大量数字信号处理的应用场合。今天DSP已经成为通信、计算机、网络、工业控制以及家用电器等电子产品中不可或缺的基础器件 ,DSP在通信、计算机、网络、工业控制以及消费类电子产品等领域有着非常广泛的应用 ,本文阐述了DSP的特点、应用和市场以及DSP技术的发展前景。     

嵌人式与独立存储器设计上的差异分析和研究

进入21世纪,随着集成电路的发展,SoC(System on Chip)片上系统应运而生。而作为SoC重要组成部分的嵌入式存储器,在SoC中所占的比重正逐步增加,并起着越来越重要的作用,那么嵌入式存储器与独立的存储器芯片在设计上存在着哪些差异?对此本文将以NOR型闪存为例在制造工艺的选取、衍生产品的设计、功耗与噪声、后端功能仿真、测试与修复等方面进行分析和研究。     

USB总线接口芯片CH371及其应用

CH371是一种新型USB通用总线接口芯片。利用该芯片可在不了解任何USB协议或固件程序甚至驱动程序的情况下，轻松地将并口或串口产品升级到USB接口。文中介绍了该接口芯片的主要特点和引脚功能，给出了CH371与其它总线进行接口的几种应用电路，同时给出了CH371与MCS-51单片机的接口程序。     

DS1620实现的X射线采集板温度自动控制

DR是目前非常先进的X射线成像技术，将其X射线采集板工作温度控制在最佳工作范围可采集更好的图像。本系统采用PC和单独控制双模块分别控制温度，利用半导体传感器DS1620进行四路温度采集，通过单片机和PC串口通信，用PC通过半导体制冷芯片来控制X射线采集板的工作温度，在通信故障时也可以通过单独控制模块来控制采集板的温度。     

单片机控制泄漏电流测试仪

以8031单片机为核心的泄漏电流测试仪的硬件结构和软件设计。     

多处理器芯片体系结构研究

随着超大规模集成电路工艺和超级计算技术的发展，作者认为在单个芯片内集成多处理器系统将成为可能。本文详细讨论了多处理器芯片的分类和结构，着重阐述了同构型多处理器芯片的主要研究方向，并对同构型多处理器的可行性作出了分析。     

长安之星车用空调放大器的反求设计

长安之星空调放大器所具有延时启动、温度控制、过热保护、加速切断、点火控制以及转速控制等功能.该放大器以进口空调放大器为原型,通过其原理、结构及功能的分析,对软件和硬件分别进行反求设计,研制开发出能替代原产品的新产品.该产品硬件采用MDT2005单片机作核心控制,温度和水温采集用LM324实现模数转换,发动机转速经过两级滤波、降压后,再进入LM324作波形整理.MDT2005的8位计数器采用递增方式计数,当计至FFH时自动复零,并重新开始计数,一直循环.程序设计以循环方式与分支处理方式相结合,以实现空调放大器的各种控制功能与技术指标.     

集成光学干涉仪光纤陀螺

简述了集成光学干涉仪光纤陀螺（ＦＯＧ）的技术优势、发展概况和采用的技术途径，介绍了适用于不同技术条件要求的三种多功能集成光学芯片结构和相应的信息处理方法。简要地概括了目前国外ＦＯＧ的发展水平。     

A new Thermo-viscoplastic Material Model for Finite-Element-Analysis of the Chip Formation Process

A new material model for describing the thermo-viscoplastic flow behavior of workpiece material in metal cutting is presented. In order to express the complex flow behavior which depends on the local strain, strain rate and temperature, a new methodology for sequential formulation is proposed. The material parameters which are achieved by using the flow stress data available at low strain rates are enhanced by matching the results of the experimental investigations and finite element simulations of the orthogonal cutting process. As a result, a material model which has a wide validity range of strain, strain rate and temperature is established.