Soft sensor for real-time cement fineness estimation

This paper describes the design and implementation of soft sensors to estimate cement fineness. Soft sensors are mathematical models that use available data to provide real-time information on process variables when the information, for whatever reason, is not available by direct measurement. In this application, soft sensors are used to provide information on process variable normally provided by off-line laboratory tests performed at large time intervals. Cement fineness is one of the crucial parameters that define the quality of produced cement. Providing real-time information on cement fineness using soft sensors can overcome limitations and problems that originate from a lack of information between two laboratory tests. The model inputs were selected from candidate process variables using an information theoretic approach. Models based on multi-layer perceptrons were developed, and their ability to estimate cement fineness of laboratory samples was analyzed. Models that had the best performance, and capacity to adopt changes in the cement grinding circuit were selected to implement soft sensors. Soft sensors were tested using data from a continuous cement production to demonstrate their use in real-time fineness estimation. Their performance was highly satisfactory, and the sensors proved to be capable of providing valuable information on cement grinding circuit performance. After successful off-line tests, soft sensors were implemented and installed in the control room of a cement factory. Results on the site confirm results obtained by tests conducted during soft sensor development.     

水泥浆失水制约下套管与井眼间隙的研究

通过对水泥浆失水规律的室内试验分析以厦对注水泥顶替过程中水泥浆失水桥堵套管与井眼间隙问题的研究，建立了顶替过程中滤失层不发生水泥浆失水而桥堵环形空间的临界失水量计算模型，提出了调配水泥浆失水性能和确定合理套管井眼间隙的具体方法，对注水泥现场施工和井身结构设计具有一定的指导意义。     

一种可替代漂珠的低密度材料

漂珠低密度水泥浆由于密度低、强度高、体系稳定而在油田低压易漏层及低压油气层长封固段固井作业中获得了广泛的应用。但近年来,由于漂珠的产量越来越少,油田低成本要求急需开发代替漂珠的新型减轻材料,以满足配制低密度水泥浆的需求。开发了BCL-10S低密度混合减轻材料,其物化性能与漂珠相当,用它作减轻剂配制的低密度水泥浆性能与用漂珠作减轻剂配制的低密度水泥浆性能相媲美,并已经在长庆油田获得了应用。     

乐滩灌区输水隧洞穿合山煤矿采空区处理设计

分析了乐滩灌区工程北干渠溯河隧洞段长约1.06 km穿合山煤矿采空区的地质情况.借鉴高速公路煤矿采空区的成功处理经验,通过科学分析,对采空区变形和区域内覆岩的稳定性做了评价,论述了输水线路穿采空区段采取全充填压力注浆法的工程处理方法.     

水泥砂浆衬里在输水钢管内壁防腐中的应用

结合工程实例,阐述了在输水水质腐蚀性不大的情况下,输水钢管的内壁防腐采用水泥砂浆衬里的必要性和优点,并介绍了设计要点和安装施工注意事项。     

粉煤灰超细玻珠复配轻集料在固井低密度水泥浆中的作用

阐述了粉煤灰超细玻珠复配轻集料在固井低密度水泥浆中对其流变性能、强度、质量均匀性以及密度的影响和作用机理。表明该复配轻集料可以明显改善水泥浆的流动性、保水性以及水泥与高效外加剂的相容性,水泥石抗压和抗折强度有显著改善,水泥浆具有良好的质量均匀性,用该集料配制的超低密度水泥浆能满足固井要求,并由此提高固井的经济性。     

Transport of a surface-applied corrosion inhibitor in cement paste and concrete

Surface-applied corrosion inhibitors are a kind of repair material and usually contain an aminoalcohol and a component forming a salt with the aminoalcohol. According to the manufacturers, this type of inhibitor penetrates very rapidly into concrete; however, the transport mechanisms have not been sufficiently investigated so far. The major part of the study therefore focused on the transport of the ingredients of an inhibitor in cement paste and concrete, which contained an aminoalcohol and a phosphorous compound. It has been shown that the latter forms an insoluble calcium salt in the environment of cement and precipitates quantitatively. It is thus unable to penetrate from the outside into the alkaline concrete zone and cannot develop its inhibiting effect there. The aminoalcohol, on the other hand, is not bound by cement, but remains largely dissolved in the pore liquid, thus providing optimal conditions for high mobility. The analysis of the transport mechanisms involved has revealed that diffusion in the dissolved state is by far the most efficient transport mechanism. While basically the transport of the aminoalcohol via the gaseous phase is possible, it does play an inferior role only. Surprisingly, the substance had hardly been absorbed by concrete by capillary suction, but at first remained close to the concrete surface.     

An investigation into the effect of various chemical and physical treatments of a South African phosphogypsum to render it suitable as a set retarder for cement

The work describes various physical and chemical treatments to eliminate the deleterious effects of impurities in phosphogypsum on the delayed setting time and impaired strength development behaviour of cement to which it was added as a set regulator. The physical treatments included washing, milling, and ultrasonic treatment of the material, while the chemical treatments dealt with acidic and basic additions to the phosphogypsum during the washing stage. It was found that chemical treatment with a milk of lime solution, which is often recommended in literature, was ineffective in reducing set retardation. Treatment with ammonium hydroxide or sulphuric acid was more effective in this regard. Intergrinding phosphogypsum with slaked lime improved its effectiveness in reducing set retardation, but the use of unslaked lime was less effective and also resulted in marked reductions in compressive strengths. A combined treatment of wet milling phosphogypsum with a lime slurry in a ball mall was derived from these experiments and is recommended for full-scale plant applications.     

Characterization and optimization of copper chemical mechanical planarization

The feature scale planarization of the copper chemical mechanical planarization (CMP) process has been characterized for two copper processes using Hitachi 430-TU/Hitachi T605 and Cabot 5001/Arch Cu10K consumables. The first process is an example of an abrasive-free polish with a high-selectivity barrier slurry, while the second is an example of a conventional abrasive slurry with a low-selectivity barrier slurry. Copper fill planarization has been characterized for structures with conformal deposition as well as with bumps resulting from bottom-up fill. Dishing and erosion were characterized for several structures after clearing. The abrasive-free polish resulted in low sensitivity to overpolish and low saturation levels for dishing and erosion. Consequently, this demonstrated superior performance when compared to the International Technology Roadmap for Semiconductors (ITRS) 2000 roadmap targets for planarization. While the conventional slurry could achieve the 0.13-μm technology node requirements, the abrasive-free polish met the planarization requirements beyond the 0.10-μm technology node.