Chemische Zusammensetzung und Mikrostruktur polymerabgeleiteter Gläser und Keramiken im System Si–C–O. Teil 2: Charakterisierung der Gefügeausbildung mittels hochauflösender Durchstrahlungselektronenmikroskopie und Feinbereichsbeugung

Chemical Composition and Microstructure of Polymer‐Derived Glasses and Ceramics in the Si–C–O System. Part 2: Characterization of microstructure formation by means of high‐resolution transmission electron microscopy and selected area diffraction Liquid or solid silicone resins represent the economically most interesting class of organic precursors for the pyrolytic production of glass and ceramics materials on silicon basis. As dense, dimensionally stable components can be cost‐effectively achieved by admixing reactive filler powders, chemical composition and microstructure development of the polymer‐derived residues must be exactly known during thermal decomposition. Thus, in the present work, glasses and ceramics produced by pyrolysis of the model precursor polymethylsiloxane at temperatures from 525 to 1550 °C are investigated. In part 1, by means of analytical electron microscopy, the bonding state of silicon was determined on a nanometre scale and the phase separation of the metastable Si–C–O matrix into SiO₂, C and SiC was proved. The in‐situ crystallization could be considerably accelerated by adding fine‐grained powder of inert fillers, such as Al₂O₃ or SiC, which permits effective process control. In part 2, the microstructure is characterized by high‐resolution transmission electron microscopy and selected area diffraction. Turbostratic carbon and cubic β‐SiC precipitate as crystallization products. Theses phases are embedded in an amorphous matrix. Inert fillers reduce the crystallization temperature by several hundred °C. In this case, the polymer‐derived Si–C–O material acts as a binding agent between the powder particles. Reaction layer formation does not occur. On the investigated pyrolysis conditions, no crystallization of SiO₂ was observed.     

体制制度科技——我局发展历程的几个回顾和今后改革的断想

回顾了体制、制度的改革和科学技术的发展给十局带来的巨大变化，就十局当前改革任务从理顺产权关系、进一步完善内部治理结构、继续深化三项制度改革、实施科教兴局战略等四个方面提出了看法和意见。     

Homogenization of hardness distribution and distortion in high pressure gas quenching

Quenching with gases rather than oil or other liquid media has the advantages of reducing the risks concerning health and environment, while simultaneously homogenizing the quenching results and minimizing distortion due to a wide range of possible process parameter variations and the pure convective heat transfer. In this contribution, a coupled solution for increasing homogenization of quenching results within high pressure gas quenching will be presented. In the first stage, an experimental test facility was set up for flow investigations and in the second stage a numerical simulation model was generated. The numerical and experimental results of the flow through the chamber were compared for several boundary conditions. Finally, after complete verification of the simulation, the model may be used to assist in parameter variation for optimization of homogeneous high pressure gas quenching.     

浅谈下一代网络（NGN）

计算机网络的发展日新月异。下一代计算机网络（NGN）的探讨、研究已经成为当前的潮流。下一代网络是目前电信、互联网运营商和设备厂商都在讨论的热点技术，国内外许多网络运营商都在探讨，并正在或考虑建设试验网进行更深入的研究。本文介绍了NGN的定义、主要特点、分层结构和关键技术。     

Characteristics and classification of high-current fault arcs on distribution systems

When a fault occurs on transmission or distribution systems due to lightning or overvoltage, often an arc discharge occurs at the fault point. The arc discharge, which is caused by a fault current, has a high current, high temperature, strong light emission, etc., thus it sometimes causes heavy damages to electric power equipment. The arc discharge is influenced by the conditions around the arcs, i.e., gas, insulation materials, gap length, weather, etc. Also, the arc voltage along the arc column indicates the characteristics of the arc. If the voltage waveforms of the arcs caused by the fault on transmission or distribution systems are classified, it is possible to find the location and the equipment where the fault occurred. In this paper, the arc voltage data in 6-kV class XLPE cables and 6-kV class overhead lines are analyzed and an artificial neural network method is applied to classify the arc voltage waveforms. The results obtained from the six artificial neural networks developed show that the artificial neural network method is effective for classification of arc voltage waveforms if adequate input parameters are selected.     

Psychological Bulletin's top 10 "hit parade."

Examined the 10 most cited articles published in the Psychological Bulletin over the past 4 decades. Seven of the 10 articles were methodologically oriented. A survey of the authors revealed that highly cited articles have an important message that goes beyond momentary fads, are broad in topic and intended audience, accessible, and well written. (PsycINFO Database Record (c) 2010 APA, all rights reserved)     

6，7-二氢-5H-环戊烷并[b]吡啶

6,7-二氢-5H-环戊烷并[b]吡啶主要用于药物、杀菌剂和抗菌剂的研究,也被广泛应用于制备植物保护剂和合成树脂、防老剂以及塑料制品等。目前因其被作为第四代抗生素头孢匹罗的侧链而成为研究者竞相开发的热点。6,7-二氢-5H-环戊烷并[b]吡啶有实用价值的合成方法主要有N-羟基邻苯二甲酰胺法、丙烯醛法和己二酸二乙酯法。丙烯醛法中6,7-二氢-5H-环戊烷并[b]吡啶的收率为87.4%,具有较好的开发前景。     

Infrared heat treatment of Ti-6Al-4V with electroplated Cu

The objective of this study is to investigate an innovative infrared (IR) technique to enhance adhesion of electroplated copper (Cu) on Ti-6Al-4V without dichromate dipping. The ultimate goal is to develop a Cu coating process on Ti-6Al-4V without hazardous hexavalent chromium (Cr) solution treatments. Cu coatings of around 50 μm were electroplated on Ti-6Al-4V specimens at a current density of 0.03 A/cm² in an acidic Cu solution. To improve adhesion of coatings, IR heat treatments were performed on the Cu-coated samples at different temperatures and durations: 860 °C for 600 s and 875 °C for 20–120 s. This process was accomplished in an attempt to replace the use of dichromate dipping before electroplating. For samples heat treated at 860 °C, no bonding existed, even after 600 s. It is believed that solid-state diffusion prevailed at 860 °C and that 600 s was not enough for sufficient diffusion to occur. Adhesion was poor when samples were heat treated at 875 °C for 20 s. Excellent adhesion was observed when the heat treatment holding time was increased to 40 s. For 90 s, the surface appearance of coatings partially changed from Cu-colored to a grayish color. There was no Cu left on the surface after a 120 s heat treatment. From optical microscopic observations on sample cross sections, an interlayer between the Cu and Ti-6Al-4V formed when heat treated at 875 °C for 40 s and longer. The interlayer thickness increased as the holding time increased, until depletion of Cu. The sheet resistivity of coated specimens was on the order of pure Cu for samples heat treated at 875 °C and less than 90 s. During the 875 °C heat treatment, the following occurred: solid-state diffusion of Cu in Ti-6Al-4V, formation of eutectic solutions, dissolution of Cu and Ti-6Al-4V into the liquid phase, and the formation of intermetallic compounds. The lowest eutectic temperature of 875 °C played a key role in this innovative process of Cu coating on Ti-6Al-4V. This paper was presented at the 2nd International Surface Engineering Congress sponsored by ASM International, on September 15–17, 2003, in Indianapolis, Indiana and appears on pp. 403–10 of the Proceedings.