在手机上应用ALIVH技术

ALIVH板在板层结构和构成材料上和传统的多层板有很大的区别,因此在使用它之前,我们必须要对ALIVH板的特性要十分了解,因此详细介绍了ALIVH技术以及在手机上的应用。     

Reliability with finite buffer size for a multistate manufacturing system with parallel production lines

Abstract

This study examines system reliability for a manufacturing system with parallel production lines by creating a model of a multistate manufacturing system (MMS). System reliability is defined as the probability of demand satisfaction, which reflects the probability that the current capacity state of the MMS can successfully process a given demand. In particular, a buffer station with a finite size is taken into consideration to avoid blockage and starvation in the MMS. To the best of our knowledge, there is no existing research that considers a finite buffer size in a model of an MMS with parallel production lines. This study proceeds through the following phases. (i) In the model construction phase, the amount of input material, workload, and minimal capacity required by each workstation to satisfy a given demand level are studied by flow analysis; subsequently, a buffer usage matrix (BUM) is proposed to calculate buffer reliability. (ii) In the performance evaluation phase, system reliabilities with both infinite and finite buffer sizes are derived in terms of both minimal capacity vector and buffer reliability. (iii) In the case demonstration phase, two examples are utilized to illustrate the proposed method. Results of both examples show that the system reliability is overestimated with an infinite buffer size.     

中国PCB工业的竞争能力

本文短评了中国PCB工业在常规PCB产品的市场竞争优势,但在新一代PCB产品的市场竞争中并不占优势。     

微电子封装材料的最新进展

总结了目前几类关键封装材料的发展现状,包括积层多层板、挠性板、无铅焊料、电子浆料等,指出了发展中存在的主要问题,并对国内外的生产研发情况和未来的发展趋势进行了概述.指出积层多层板和挠性板适应未来三维形式的封装,是21世纪基板材料的主流,其技术走向是进一步简化工艺和降低成本;无铅焊料满足环保要求,但现在成本仍偏高;导电胶可能将成为替代焊接技术的新型低温连接材料.     

封装用积层多层板

该文简要介绍了高密度封装的开发背景、发展趋势和市场,以及在现有积层法技术基础上,开发的超高密度插入基板的制作和特点。     

应用于HDI／BUM技术领域的超薄铜箔

介绍了一种比较新颖的、技术要求比较高的,能广泛应用于HDI技术领域的超薄铜箔,并且通过其在图形电镀中的应用及激光钻孔后的电镀效果研究,可以充分体会到这种铜箔优异的性能。     

积层线路板用紫外光固化油墨

介绍了积层线路板用紫外光固化油墨的组成和特点以及影响积层线路板紫外光固化油墨性能的各种因素,着重介绍了感光树脂、新型引发剂和高性能单体开发的研究进展。