排序方式: 共有42条查询结果,搜索用时 15 毫秒
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The popular radio frequency (RF) chip on board (COB) test has gradually taken the place of on-wafer test due to the high efficiency and high power. This paper presents the extended Open-Short-Load (OSL) that is one-port calibration method to verify the error model de-embedding in S parameter measurement. Three-level cascade structure on COBs system error model is proposed and analyzed. Four kinds of calibration plane solutions for de-embedding are verified. At last, on-board calibration (CAL) kits solution is established to decrease the system error to the least value. The maximum error shift can be controlled less than 0.1 dB comparing with the on-wafer test results. In general, the practical application results prove that this method is reasonable and effective and easy to be mastered. 相似文献
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在市场上逐步推广的液晶模块(LCM)生产中,其LCD系列驱动电路的封装工艺主要采用裸芯片的COB(chip on Board)封装方式。文中通过总结自行设计和加工的LCD系列电路在应用厂商批量使用过程中出现的COB封装问题,对COB的工艺流程、COB工艺中的关键工艺——键合以及主要的失效点以及常见的失效原因进行分析,并结合在实际推广过程中问题的解决方法,对LCD系列驱动电路和其他芯片在COB应用中主要出现的键合不良、边缘铝层颜色异常、钝化孔残留、键合参数、COB环境等方面问题加以整理归纳,并提出了可行的解决办法。 相似文献
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介绍了采用图像处理和模式识别的方法对一幅半导体芯片的图像进行焊盘的识别和定位。这一技术可以广泛应用于微电子行业中的芯片封装技术,它的核心是实现了对未封装的半导体芯片上的焊盘进行识别并定位的视觉机器。给出了用计算机对算法进行仿真后的实验结果。 相似文献
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鲜飞 《电子工业专用设备》2002,31(3):131-134
论述了微电子封装技术的现状与未来 ,介绍了微电子封装中几个值得注意的发展动向 ,同时 ,从中可以看出IC芯片与微电子封装技术相互促进 ,协调发展密不可分的关系。 相似文献
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针对集成光源难以实现小发光角的问题,提出了一种大功率COB光源实现窄光束的设计方法。根据COB光源的出射光分布以及预设的光分布范围选用折射-折射(RR)系统。以选定的COB光源的光谱分布及配光曲线为标准建立光源模型,由复合抛物面(CPC)实现朗伯光源60°的聚光之后,再利用光学扩展量守恒以及同步多曲面方法(SMS)求得透镜前后两个曲面轮廓上点的坐标,进行曲线拟合获得轮廓曲线,进而得到透镜的三维模型。采用光学仿真软件对系统进行光线追迹,结果表明:系统在出光口处的发散角控制在30°之内,半光强度角为11.336°,整体光效达到89.398%,效果良好。 相似文献
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Weidong Huang Xuhong Wang Li Wang Mei Sheng Liqiang Xu Frank Stubhan Le Luo 《Journal of Electronic Materials》2004,33(2):101-105
The moisture diffusion in globtop material for a chip-on-board (COB) package coated with SiNx and silicone, respectively, or coated with SiNx plus silicone were measured by embedding a humidity sensor in the globtop and recording the capacitive change in three different
temperature/humidity environments. The experimental results were simulated by Fick’s diffusion law with finite-element method
modeling. The moisture diffusion coefficients and activation energies were calculated to quantitatively compare the moisture-resistance
effects of different coatings. For example, at 85°C/85% RH, the moisture diffusion coefficients for the uncoated reference,
SiNx-coated, silicone-coated, and silicone/SiNx double-layered coated samples are 1E-5, 0.8E-5, 0.7E-5, and 0.2E-5 mm2/s, respectively. The experimental and simulation results show that double-layered coating with silicone/SiNx has excellent moisture-resistance properties because it not only smoothes the steps on a printed circuit board (PCB) but
also keeps the good moisture resistance of the inorganic films. 相似文献
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在COB(Chip On Board)LED光组件制造领域,点胶、测试和补粉关键工艺基本以手工或半自动为主。为了保证COB LED产品质量一致性、提高生产效率,研制了一种COB自动在线点胶测试及补粉一体机,实现点胶、测试、补粉生产工序的自动化生产。阐述了其工艺流程及设计总体方案,提出了荧光粉量修补方法,修正初次点胶量,实现动态调节,减少人工干预。经实验验证,该一体机可以提高点胶工艺的自动化程度,具有运行速度快、可靠性好、性能稳定等特点。 相似文献
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