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InAlSb/InSb薄膜材料的晶体质量会直接影响器件的性能。提高薄膜材料的晶体质量可以有效降低器件的暗电流,提高探测率和均匀性等。主要报道了掺铝锑化铟分子束外延技术的初步研究结果。通过采用多种测试方法对InAlSb分子束外延膜的晶体质量进行了分析,找出了影响晶体质量的因素,提高了InAlSb分子束外延的技术水平。实验结果表明,通过优化生长温度、束流比、升降温速率以及退火工艺等生长条件,可以获得高质量的InAlSb分子束外延膜。 相似文献
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Brian R. Bennett J. Brad Boos Mario G. Ancona N. A. Papanicolaou Graham A. Cooke H. Kheyrandish 《Journal of Electronic Materials》2007,36(2):99-104
Heterostructures for InAs-channel high-electron-mobility transistors (HEMTs) were investigated. Reactive AlSb buffer and barrier
layers were replaced by more stable Al0.7Ga0.3Sb and In0.2Al0.8Sb alloys. The distance between the gate and the channel was reduced to 7–13 nm to allow good aspect ratios for very short
gate lengths. In addition, n+-InAs caps were successfully deposited on the In0.2Al0.8Sb upper barrier allowing for low sheet resistance with relatively low sheet carrier density in the channel. These advances
are expected to result in InAs-channel HEMTs with enhanced microwave performance and better reliability. 相似文献
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接近室温的更高工作温度是第三代红外探测器发展的重要方向。本文论述了用MBE在InSb(100)衬底上外延生长制备P-i-N型三元In1-xAlxSb薄膜合金材料,并通过制备单元器件进行了验证。采用RHEED振荡和X射线双晶衍射对In1-xAlxSb薄膜的Al组分进行了调控和检测。5.3 μm厚薄膜的FWHM≈50 arcsec,Al组分约1.9%。10 μm×10 μm原子力表面粗糙度RMS≈0.6 nm。制备的单元器件获得了预期的理想效果,为下一步面阵焦平面的制备奠定了基础。 相似文献
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