碲镉汞外延晶膜的不稳定性

利用变温和变磁场霍尔测试对在空气室温环境长期存放的碲镉汞液相处延晶膜作了定期的检测，结果表明，晶膜的电学性质随时间有明显的改变，本文采用非均匀晶膜的层状模型对晶膜的不稳定性作了详细的分析。     

InGaAsP／InP PFBH激光器

采用Ｎ－ＩｎＰ衬底研制ＩｎＧａＡｓＰ／ＩｎＰ激光器和ＤＦＢ激光器在国内已报导过多次，本文介绍用Ｐ－ＩｎＰ衬底研制ＩｎＧａＡｓＰ／ＩｎＰ平面埋层异质结构激光器和ＤＦＢ－ＰＦＢＨ激光器，同时利用晶体生长和晶向的依赖关系，改进埋区的结构，使器件最高激射温度大于１００℃。     

LPE生长外延片超薄有源层结构的SEM研究

通过对液相外延（LPE）生长的外延片不同处理方法的研究，摸索出一条利用扫描电子显微镜（SEM）来观测有源区厚度的有效方法──蒸金法，最优可观察有源区厚度20nm，对设计厚度为18nm结构来说[1]，这是一种便利而有效的观察手段。     

高功率1.55μm半导体激光器

1 .55μm半导体激光器有很多突出的优点 ,但普通的双异质结激光器功率小 ,且对温度很敏感。本文将大光腔结构形式引入 1.55μmGaInAsP/InP半导体激光器中 ,用液相外延技术研制成功了脉冲峰值功率超过 2W的 1.55μmGaInAsP/InP半导体激光器。普通双异质结构激光器特征温度T0 为 50～ 70K[1] ;而本文研制的大光腔结构为 10 0～ 140K。激光器的寿命超过 10 0 0h     

Progress in CdZnTe substrate producibility and critical drivers of IRFPA yield originating with CdZnTe substrates

With the goal of maximizing the yield of infrared focal plane arrays (IRFPAs), Santa Barbara Research Center’s (SBRC) Infrared Materials Producibility Program (IRMP) has focused on assessing and improving the quality, yield, and throughput of CdZnTe substrates. A baseline detector lot was fabricated to identify the critical drivers of IRFPA yield coming from the substrates and to evaluate the quality and yield of the current vendor base for CdZnTe substrates. Substrate induced defects and impurities that can potentially affect device performance and operability were carefully mapped out in detail on 44 × 67 mm² size substrates, received from IRMP substrate vendors as well as SBRC. This paper will report on the correlations found between this substrate characterization data base and the IRFPA level defect distributions. Key results from these correlation studies are: (1) extended defects found on the substrates with the Nakagawa etch correlated well with responsivity reduction in the final IRFPA; (2) cross-hatch patterns that were evident in the responsivity map correlated well with similar features seen by x-ray topography on LPE double layers; and (3) a possible correlation of device performance (leakage current at 78K) with copper and lithium impurities in the substrate. Recent initiatives toward improving the quality and yield of the substrate growth process have focused on improving purity in the pre-growth charge preparation, modification of growth parameters to reduce defects and scaling up of the vertical Bridgman growth process from its current 67 mm diameter boule size to 92 mm diameter boules. Promising initial results from the large diameter boule growth process will be shown. The 92 mm diameter CdZnTe boule (6 kg charge) shows two predominant single crystal grains encompassing 75% of boule volume. Defect characterization of boules grown under baseline and modified conditions is discussed.     

HgCdTe液相外延材料组分分布的红外透射光谱评价技术

对红外透射光谱法测定HgCdTe液相外延材料纵向组分分布技术进行了深入的研究.红外透射光谱的理论计算采用了王庆学提出的组分分布模型,并考虑了光穿越组分梯度区时产生的干涉效应.通过测量同一样品在不同外延层厚度下的一组红外透射光谱,该方法的有效性得到了实验验证.进一步对组分模型中参数(即外延总厚度、组分互扩散区厚度、材料表面组分和HgCdTe层组分梯度)的拟合方法进行了讨论,并确定了各拟合参数的拟合精度.结果显示,该方法可作为测定HgcdTe液相外延材料组分特性的一种有效的测试评价技术.     

Inductively coupled plasma etching for large format HgCdTe focal plane array fabrication

Inductively coupled plasma (ICP) using hydrogen-based gas chemistry has been developed to meet requirements for deep HgCdTe mesa etching and shallow CdTe passivation etching in large format HgCdTe infrared focal plane array (FPA) fabrication. Large format 2048×2048, 20-μm unit-cell short wavelength infrared (SWIR) and 2560×512, 25-μm unit-cell midwavelength infrared (MWIR) double-layer heterojunction (DLHJ) p-on-n HgCdTe FPAs fabricated using ICP processing exhibit >99% pixel operability. The HgCdTe FPAs are grown by molecular beam epitaxy (MBE) on Si substrates with suitable buffer layers. Midwavelength infrared detectors fabricated from 4-in. MBE-grown HgCdTe/Si substrates using ICP for mesa delineation and CdTe passivation etching demonstrate measured spectral characteristics, RoA product, and quantum efficiency comparable to detectors fabricated using wet chemical processes. Mechanical samples prepared to examine physical characteristics of ICP reveal plasma with high energy and low ion angle distribution, which is necessary for fine definition, high-aspect ratio mesa etching with accurate replication of photolithographic mask dimensions.     

碲镉汞液相外延薄膜的应力研究

用X射线衍射方法对液相外延(LPE)技术生长的碲镉汞(MCT)外延薄膜和CdTe衬底进行了观察与分析。研究表明:MCT薄膜中存在着不同程度的应力,主要表现为晶格的扭曲(300″～1200″范围),这种扭曲致使外延膜双晶回摆曲线宽化,宽化值为100″～150″,外延膜的晶格扭曲与CdTe衬底的不完整性有对应关系。研究还表明:LPE的生长条件对外延膜中的晶格扭曲也有较大影响。本文还讨论了CdTe衬底晶格扭曲形成的因素并探究了减少外延膜晶格扭曲的方法。     

Investigation of HgCdTe p-n device structures grown by liquid-phase epitaxy

The microstructure of p-n device structures grown by liquid-phase epitaxy (LPE) on CdZnTe substrates has been evaluated using transmission electron microscopy (TEM). The devices consisted of thick (∼21-μm) n-type layers and thin (∼1.6-μm) p-type layers, with final CdTe (∼0.5 μm) passivation layers. Initial observations revealed small defects, both within the n-type layer (doped with 8×10¹⁴/cm³ of In) and also within the p-type layer but at a much reduced level. These defects were not visible, however, in cross-sectional samples prepared by ion milling with the sample held at liquid nitrogen temperature. Only isolated growth defects were observed in samples having low indium doping levels (2×10¹⁴/cm³). The CdTe passivation layers were generally columnar and polycrystalline, and interfaces with the p-type HgCdTe layers were uneven. No obvious structural changes were apparent in the region of the CdTe/HgCdTe interfaces as a result of annealing at 250°C.     

管道3LPE防腐蚀层补口失效原因及建议

根据调研,管道3LPE补口失效主要以密封失效和底漆失效为主,分析了其失效的主要原因;针对失效的原因,提出了五种热收缩带补口技术的改进措施。同时,面对热收缩带不可避免的失效问题,通过调研多个现场开挖验证实例,分析并对比了多种新型3LPE补口技术的应用及检测结果。有助于全面认识热收缩带补口技术,并为后续管道工程中3LPE防腐蚀层补口方法的选择和改进提供多种思路。