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排序方式: 共有166条查询结果,搜索用时 15 毫秒
1.
Shubneesh Batra Nanseng Jeng Akif Sultan Kyle Picone Surya Bhattacharya Keun-Hyung Park Sanjay Banerjee David Kao Monte Manning Chuck Dennison 《Journal of Electronic Materials》1993,22(5):551-554
When dopants are indiffused from a heavily implanted polycrystalline silicon film deposited on a silicon substrate, high thermal
budget annealing can cause the interfacial “native” oxide at the polycrystalline silicon-single crystal silicon interface
to break up into oxide clusters, causing epitaxial realignment of the polycrystalline silicon layer with respect to the silicon
substrate. Anomalous transient enhanced diffusion occurs during epitaxial realignment and this has adverse effects on the
leakage characteristics of the shallow junctions formed in the silicon substrate using this technique. The degradation in
the leakage current is mainly due to increased generation-recombination in the depletion region because of defect injection
from the interface. 相似文献
2.
Rui Morimoto Chisato Yokomori Akiko Kikkawa Akira Izumi Hideki Matsumura 《Thin solid films》2003,430(1-2):230-235
In this paper, bulk-Si metal–oxide–semiconductor field effect transistors (MOSFETs) are fabricated using the catalytic chemical vapor deposition (Cat-CVD) method as an alternative technology to the conventional high-temperature thermal chemical vapor deposition. Particularly, formation of low-resistivity phosphorus (P)-doped poly-Si films is attempted by using Cat-CVD-deposited amorphous silicon (a-Si) films and successive rapid thermal annealing (RTA) of them. Even after RTA processes, neither peeling nor bubbling are observed, since hydrogen contents in Cat-CVD a-Si films can be as low as 1.1%. Both the crystallization and low resistivity of 0.004 Ω·cm are realized by RTA at 1000 °C for only 5 s. It is also revealed that Cat-CVD SiNx films prepared at 250 °C show excellent oxidation resistance, when the thickness of films is larger than approximately 10 nm for wet O2 oxidation at 1100 °C. It is found that the thickness required to stop oxygen penetration is equivalent to that for thermal CVD SiNx prepared at 750 °C. Finally, complementary MOSFETs (CMOSs) of single-crystalline Si were fabricated by using Cat-CVD poly-Si for gate electrodes and SiNx films for masks of local oxidation of silicon (LOCOS). At 3.3 V operation, less than 1.0 pA μm−1 of OFF leakage current and ON/OFF ratio of 107–108 are realized, i.e. the devices can operate similarly to conventional thermal CVD process. 相似文献
3.
Marc Bescond Jean-Luc Autran Nicolas Cavassilas Daniela Munteanu Michel Lannoo 《Journal of Computational Electronics》2004,3(3-4):393-396
A program to numerically simulate point defects in nanowire metal-oxide-semiconductor field-effect transistors is described. The simulation scheme is based on the non-equilibrium Green’s function method self-consistently being obtained via the resolution of 3D Poisson’s equation. A tight-binding hamiltonian is used and the point defect is characterized by a macroscopic coulombic tail treated in the mode-space approach, plus a short range on-site perturbation potential energy, treated exactly. The effect on internal quantities and on the transistor characteristics is studied as a function of the strength and the location of the defect potential. Subthreshold current is found to vary in a factor 10 according to the position of the impurity.Also With Institut Universitaire De France (IUF). 相似文献
4.
M. V. Fischetti S. E. Laux P. M. Solomon A. Kumar 《Journal of Computational Electronics》2004,3(3-4):287-293
We review briefly some aspects of the history of Monte Carlo simulations of electronic transport in semiconductors. In the early days their heavy computational cost rendered them suitable only to study problems of pure physics, as simpler models provided the answers necessary to design ‘electrostatically good’ devices. Now that scaling has taken another meaning (i.e., looking for alternative materials, crystal orientations, device geometries, etc.), Monte Carlo simulations may gain popularity once more, since they allow an efficient and reliable evaluation of speculative ideas. We show examples of both aspects of the results of Monte Carlo work. 相似文献
5.
A 2D analytical model for transconductance, Sub-threshold current and Sub-threshold swing for Triple Material Surrounding Gate MOSFET (TMSG) is presented in this paper. Based on the solution of two dimensional Poisson equation, the physics based model of sub-threshold current of the device is derived. The model also includes the effect of gate oxide thickness and silicon thickness on the sub-threshold swing characteristics. Transconductance to drain current ratio of the triple material surrounding gate is calculated since it is a better criterion to access the performance of the device. The effectiveness of TMSG design was scrutinized by comparing with other triple material and dual material gate structures. Moreover the effect of technology parameter variations is also studied and proposed. This proposed model offers basic guidance for design of TMSG MOSFETs. The results of the analytical model are compared with the MEDICI simulation results thus providing validity of the proposed model. 相似文献
6.
7.
A. Asenov J.R. Watling A.R. Brown D.K. Ferry 《Journal of Computational Electronics》2002,1(4):503-513
As MOSFETs are scaled to sub 100 nm dimensions, quantum mechanical confinement in the direction normal to the silicon dioxide interface and tunnelling (through the gate oxide, band-to-band and from source-to-drain) start to strongly affect their characteristics. Recently it has been demonstrated that first order quantum corrections can be successfully introduced in self-consistent drift diffusion-type models using Quantum Potentials. In this paper we describe the introduction of such quantum corrections within a full 3D drift diffusion simulation framework. We compare the two most popular quantum potential techniques: density gradient and the effective potential approaches, in terms of their justification, accuracy and computational efficiency. The usefulness of their 3D implementation is demonstrated with examples of statistical simulations of intrinsic fluctuation effects in decanano MOSFETs introduced by discrete random dopants. We also discuss the capability of the density gradient formalism to handle direct source-to-drain tunnelling in sub 10 nm double-gate MOSFETS, illustrated in comparison with Non-Equilibrium Green's Functions simulations. 相似文献
8.
在亚50nm的MOSFET中,沿沟道方向的量子力学效应严重影响了器件性能.基于WKB理论,考虑MOSFET中该效应对垂直沟道方向上能级的影响,引入了其时阈值电压的修正.继而对沟道方向的子带作了抛物线近似并进行了数值拟合,从而建立了一个考虑量子力学效应的全解析模型.由此模型可以得到二维量子力学修正和沟道长度以及其它器件参数的关系.与数值模拟结构比较可以得出如下结论:在亚50nm的MOSFET中,量子力学效应引入了阈值电压的修正是不可忽略的.且此全解析模型精度令人满意. 相似文献
9.
10.
Leonardo Gomez Michael Canonico Meekyung Kim Pouya Hashemi Judy L. Hoyt 《Journal of Electronic Materials》2008,37(3):240-244
Ultrathin strained-Si/strained-Ge heterostructures on insulator have been fabricated using a bond and etch-back technique.
The substrate consists of a trilayer of 9 nm strained-Si/4 nm strained-Ge/3 nm strained-Si on a 400-nm-thick buried oxide.
The epitaxial trilayer structure was originally grown pseudomorphic to a relaxed Si0.5Ge0.5 layer on a donor substrate. Raman analysis of the as-grown and final transferred layer structures indicates that there is
little change in the strain in the Si and Ge layers after layer transfer. These ultrathin Si and Ge films have very high levels
of strain (∼1.8% biaxial tension and 1.4% compression, respectively), and are suitable for enhanced-mobility field-effect
transistor applications. 相似文献