Non-contact handling in microassembly: Acoustical levitation

Microassembly is currently of the utmost importance in industry. Nevertheless, the classical assembly processes are no longer usable for very small components, typically ranging from 10  m to 10 mm, since usually neglected surface forces disturb the handling task by inducing adhesion between the component and the gripper. A promising alternative to tackle surface forces consists in levitating the handled component. The various advantages of this contactless handling method are reviewed here and justify the choice of this approach. Consequently, the numerous physical principles suitable for contactless handling are briefly described together with their limitations. The evaluation shows that acoustic levitation is best fitted in the case of microassembly. A classification of literature applications is presented hereafter with special focus on acoustic levitation. Finally, the most common models of acoustical levitation are inspected in a general way. The described models come within the scope of non-linear acoustics.     

微装配技术的发展现状

微器件的装配并不是一个新兴的领域 ,但随着微加工技术、显微技术和集成电路技术的发展 ,微装配概念发生了根本性的变化 ,产品的范围和应用领域被拓宽 ,出现了许多新的技术 ,它的发展是与微机电系统 (MEMS)、纳米技术 (Nanotechnology)密切相关的。本文对微装配技术的发展现状进行了综述 ,介绍了微装配的特点和使用的许多新技术     

Development of a piezoelectric polymer-based sensorized microgripper for microassembly and micromanipulation

This paper presents the design, fabrication, and calibration of a piezoelectric polymer-based sensorized microgripper. Electro discharge machining technology is employed to fabricate the superelastic alloy-based microgripper. It was experimentally tested to show the improvement of mechanical performance. For integration of force sensor in the microgripper, the sensor design based on the piezoelectric polymer polyvinylidene fluoride (PVDF) film and fabrication process are presented. The calibration and performance test of the force sensor-integrated microgripper are experimentally carried out. The force sensor-integrated microgripper is applied to fine alignment tasks of micro opto-electrical components. Experimental results show that it can successfully provide force feedback to the operator through the haptic device and play a main role in preventing damage of assembly parts by adjusting the teaching command.The authors wish to thank Mr. Sang-Min Kim for technical assistance. This work was supported by the 21st Centurys Frontier R&D Projects, under the contract number MS-02–324–01, sponsored by the Ministry of Science and Technology, Korea.     

Microassembly of micropeg and -hole using uncalibrated visual servoing method

In order to achieve high performance visual servoing, substantial efforts must be made for the calibration of intrinsic parameters of the camera and the transformation matrix as well. In order to avoid the tedious and difficult calibration work, a Kalman filtering-based estimation algorithm is proposed to estimate the composite image Jacobian or the homogeneous transformation matrix on-line, which can reduce the influence of noise. Using the estimated Jacobian matrix, a PD visual controller is used to make features converge to desired values with satisfactory dynamic performance, without a priori knowledge of the kinematic structure and system parameters. The proportional and differential gains are tuned using a genetic algorithm to obtain optimal controller parameters. A series of experiments are performed on peg and hole assembly to investigate the feasibility and effectiveness of this method.     

微组装电路的设计特点与制造技术

分析了国内微组装电路的发展现状，深入探讨了微 组装电路的设计特点和结构工艺制造技术，提出了发展微组装电路物途径。     

微装配的若干关键技术

随着微机电系统的快速发展,对微装配技术的需求日益迫切。详细地综述了近年来微装配技术发展的几个主要方面,包括微装配机理、视觉伺服微装配的结构、微夹持器等等。最后对微装配的发展方向进行了讨论。     

九十年代电子封装技术展望

高度发达的信息社会急需先进的电子封装技术，本文概述了电子封装技术的现状和发展趋势。从芯片级封装、一级封装、封装和基板的连接以及二级封装几个方面重点介绍了封装中的先进技术。     

表面安装器件及其国内外发展状况

表面安装器件是当前世界上正在普及推广应用的新型电子器件。其主要特点是体积小、重量轻、能实现工业自动化组装，使用中可靠性高、高频特性好等。本文介绍了ＳＭＤ的历史背景和基本概念，论述了国内外ＳＭＤ的发展状况，并就发展我国的ＳＭＤ产业提出了几点建议。     

Si基微组装技术——薄膜混合IC的一个重要分支

本文描述了Si基微组装技术的目前状况、基本特点和一般制作工艺以及应用概况。阐明了该技术在微电子行业中的重要地位。     

微型组装的级联对数放大器

本文结合对数放大器在雷达接收机中的应用,采用微型组装级联单片对数放大器的方法,来扩大动态范围,提高对数精度,从而获得适当的频带和传输时延。文中列出了微型组装的五级、六级和七级级联对数放大器的测试结果。