排序方式: 共有12条查询结果,搜索用时 15 毫秒
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EMC材料特性对SCSP器件应力及层裂的影响 总被引:1,自引:1,他引:0
利用动态机械分析仪测定环氧模塑封(EMC)材料的粘弹特性数据,使用有限元软件MSCMarc分别模拟了EMC材料粘弹性、随温度变化的弹性以及恒弹性三种情况下,SCSP器件在–55~+125℃的等效应力分布及界面层裂。结果表明:125℃和–55℃时最大等效应力分别出现在恒弹性模型、粘弹性模型顶层芯片的悬置区域;将EMC材料视为恒弹性性质时等效应力比粘弹性时大了15.10MPa;–55℃时EMC材料粘弹性模型中裂纹尖端的J积分值比恒弹性模型增长了45%左右,容易引起分层裂纹扩展。 相似文献
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提出了一个细观力学模型,该模型同时考虑了热膨胀和蒸汽膨胀对叠层芯片尺寸封装(SCSP)中芯片黏结层变形的影响.当初始温度确定时,由该模型可求得给定温度下芯片黏结层内部的蒸汽压力和孔隙率,从而判断芯片黏结层在焊接回流时的可靠性.当温度从100℃升高到250℃时,芯片黏结层的饱和蒸汽压、等效弹性模量及孔隙率分别从0.10 ... 相似文献
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叠层芯片封装元件热应力分析及焊点寿命预测 总被引:1,自引:1,他引:0
研究了温度循环载荷下叠层芯片封装元件(SCSP)的热应力分布情况,建立了SCSP的有限元模型。采用修正后的Coffin-Masson公式,计算了SCSP焊点的热疲劳寿命。结果表明:多层芯片间存在热应力差异。其中顶部与底部芯片的热应力高于中间的隔离芯片。并且由于环氧模塑封材料、芯片之间的热膨胀系数失配,芯片热应力集中区域有发生脱层开裂的可能性。SCSP的焊点热疲劳寿命模拟值为1 052个循环周,低于单芯片封装元件的焊点热疲劳寿命(2 656个循环周)。 相似文献
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Ad Hoc networking is a rather old technology that is gaining new momentum in the research community. It is still an area under development and there are several proposals for the technology regarding routing protocols, addressing, interoperability, etc. Because of the extreme conditions where Ad Hoc networks should operate, it is envisioned that in medium to large scale networks, a hybrid proactive and reactive routing mechanism should be used. Therefore, considering the proactive routing protocols as the most suitable protocol for certain topologies in Ad Hoc networks, this paper proposes a specific layered structure to enable both technologies in a seamless manner. This approach supports both reactive (e.g., AODV, DSR) and proactive link state (e.g., OLSP) protocols. The proposed layered structure divides the routing problem into different parts, where one module performs the routing algorithm, another module takes care of replicating and synchronizing the routing tables, and a third one evaluates the routing information for triggering hand-over signals to the upper layers. The overall responsibility for selecting the appropriate routing schema and for initiating the roaming process resides on a proposed Context Sensitive Roaming Layer. This paper describes the interface and the functions implemented by the Roaming Layer. The paper also analyses replication using the Server Cache Synchronization Protocol (SCSP). Finally, the last part of the paper describes the demand for Ad Hoc networks, which is driven by applications supported with an appropriate billing or bonus mechanism. 相似文献
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为了减少枯燥和耗时的训练进程和提高脑机接口系统的分类率,将半监督学习运用到了运动想象脑电的分类中,提出了一种基于分段重叠共空间模式的自训练算法,将分段重叠共空间模式作为特征提取算法,使用少量标记的数据进行学习,然后使用置信度评估准则从未标记样本中挑选信息量大的样本来提高线性判别分类器的性能。提出的算法在少量标记样本和大量未标记样本的帮助下,能够获得比基于共空间模式作为特征提取的自训练算法和基于滤波带宽共空间模式作为特征提取的自训练算法有更好的分类效果。使用2005 BCI竞赛的数据集Iva来证明算法的有效性,结果表明了提出的算法能有效提高运动想象脑电的分类率。 相似文献
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