Towards a device independent digital image processing software for photoelastic analysis

The application of digital image processing (DIP) techniques to photoelasticity has greatly simplified data reduction and analysis. The softwares reported so far are hardware dependent and hence not portable. A simple PC based device independent software for collection of photoelastic data from digitised fringe patterns is presented. The software is validated by evaluating the near crack tip stress field parameters for a crack subjected to mode I and mode II loadings.