ZrO_2（Y－TZP）－Si_3N_4复合材料中抑制ZrN生成研究

研究了气氛加压烧成ＺｒＯ２（Ｙ－ＴＺＰ）－Ｓｉ３Ｎ４复合材料中抑制ＺｒＮ生成工艺问题，相组成分析表明：无论添加２０ｗｔ％工业ＺｒＯ２或者Ｙ－ＴＺＰ（３ｍｏｌ％Ｙ。Ｏ。）的氯化硅复合材料，在低于１８５０℃，３ＭＰａｋ气压力下烧成，表面无ＺｒＮ生成．通过加入有效的烧结助剂（Ｙ。Ｏａ＋ＡＩ。Ｏｓ）、增加埋粉中ＳＩＯ分压以及增加保护气氛氮气压力，适当的烧成条件等工艺措施可有效地抑制ＺｒＮ的生成．实验还证实了ＺｒＮ很容易氧化，含有ＺｒＮ的ＺｒＯ。（Ｙ－ＴＺＰ）－ＳｉｓＮ。复合材料试样经９００℃，０．ｓｈ热处理已粉碎性裂开．     

Sliding wear behaviour of ZrN and (Zr, 12 wt% Hf)N coatings

In the present study, the sliding wear resistances of ZrN and (Zr, 12 wt% Hf)N coatings deposited on a hardened AISI D2 tool steel by arc-physical vapor deposition (PVD) technique were examined by a ball-on-disc wear tester. Alloying of ZrN coating with 12 wt% Hf did not change the hardness significantly, but achieved an improvement on adhesion strength and dry sliding wear resistance against steel (AISI 52100-55HRC) and Al₂O₃ balls.     

Ti／ZrN／瓷界面微观结构和力学性能

通过磁控溅射法在纯钛表面溅射了一层ZrN涂层,研究了Ti/ZrN/瓷界面组织和力学性能.结果表明,Ti/瓷界面由富含Ti,Si,O元素的反应层和钛表面氧化层组成.钛表面溅射ZrN涂层后,Ti/瓷界面的连接转变为Ti/ZrN/瓷界面的连接,ZrN涂层能有效地防止钛表面生成过厚的氧化层.Ti/ZrN/瓷结合强度为29.2MPa,与Ti/瓷结合强度23.5MPa相比,提高了24.3%.     

CrN/ZrN纳米多层膜的合成及其结构和性能的研究

利用非平衡直流磁控双靶溅射在不同的基底转速(4～11r/min)和不同反应气体流量下制备一系列的具有纳米周期的CrN/ZrN多层膜.利用X射线衍射,俄歇电子能谱,X射线光电子能谱表征了薄膜的成分和结构,利用纳米力学测试系统以及摩擦磨损仪测量了薄膜的机械性能和摩擦磨损性能,分析了基底的转速、反应气体的种类及流量对薄膜结构与机械性能和摩擦磨损性能的影响.结果表明在氮中混入适量氨气条件下合成的具有小纳米周期的多层膜,其硬度可达32 GPa,磨损率可低到0.3865×10-5mm3/Nm,明显优于单质薄膜.低角度XRD分析证明了薄膜的多层结构.     

Synthesis of nanoscale multilayered ZrN/W coatings by ion beam assisted deposition

ZrN/W multilayered coatings with different modulation periods at the nanoscale have been synthesized at different N+ beam bombarding energies using IBAD. Various characterization techniques such as XRD, AES, nano indenter and profiler were employed to investigate the influence of modulation period and bombarding energy on microstructure and mechanical properties of the coatings. The results showed that all superlattice coatings had better mechanical properties than the monolithic ZrN and W coatings. At an optimal condition with 300 eV N+ beam bombarding energy and 8―9 nm modulation period, XRD pattern possessed a sig- nificantly structural mixture of strong ZrN (111), W (110), as well as weak ZrN (220) textures in the multilayered coating. The optimal condition resulted in higher hardness (26 GPa), elastic modulus (310 GPa) and fracture resistance of the coat- ing than other conditions.     

TaC_p增强YG11C合金表面改性工艺及性能研究

选用自制烧结的YG11C/TaC_p硬质合金作基体,介绍了采用电弧离子镀在试样上沉积TiN、TiCN和ZrN涂层的工艺.利用维氏硬度计、扫描电子显微镜、X射线衍射仪表征了涂层的力学性能和组织结构.通过比较切削实验中刀具的磨损性,得出涂层刀具有更好的耐磨性能.研究表明,电弧离子镀TiN等涂层能使硬质合金刀具获得更好的使用性能.     

Influence of growth rate on the structural and morphological properties of TiN, ZrN and TiN/ZrN multilayers

The effect of the deposition rate on the structural and morphological properties of TiN and ZrN single layers and TiN/ZrN multilayers deposited by radiofrequency reactive magnetron sputtering has been studied. The total pressure was kept constant and the growth rate variation was obtained by small difference of nitrogen concentration in the fed gas. The decreasing deposition rate results in a structural change in the thin films from (111) orientation to (100) one. As consequence the surface morphology becomes smoother. Films roughness is strongly related with texture and it decreases with an increase in the (100) X-ray diffraction line intensity. In order to achieve a clear interpretation of our experimental results, the ratio between the N⁺ ions of the plasma and the atoms number reaching the substrate was considered. At high deposition rate with respect to the N⁺ concentration, the chemical potential of transition metal on (100) growth surface is higher than (111) one favouring the (111) orientation of the films. On the contrary, when the growth rate is low with respect to the nitrogen concentration, the chemical potential of transition metal on (111) growth surface is higher than the (100) one leading to a preferential growth in the (100) direction.     

Stress evolution in magnetron sputtered Ti-Zr-N and Ti-Ta-N films studied by in situ wafer curvature: Role of energetic particles

Stress evolution during reactive magnetron sputtering of binary TiN, ZrN and TaN thin films as well as ternary Ti-Zr-N and Ti-Ta-N solid-solutions was studied using real-time wafer curvature measurements. The energy of the incoming particles (sputtered atoms, backscattered Ar, ions) was tuned by changing either the metal target (M_Ti = 47.9, M_Zr = 91.2 and M_Ta = 180.9 g/mol), the plasma conditions (effect of pressure, substrate bias or magnetron configuration) for a given target or by combining different metal targets during co-sputtering. Experimental results were discussed using the average energy of the incoming species, as calculated using Monte-Carlo simulations (SRIM code). In the early stage of growth, a rapid evolution to compressive stress states is noticed for all films. A reversal towards tensile stress is observed with increasing thickness at low energetic deposition conditions, revealing the presence of stress gradients. The tensile stress is ascribed to the development of a ‘zone T’ columnar growth with intercolumnar voids and rough surface. At higher energetic deposition conditions, the atomic peening mechanism is predominant: the stress remains largely compressive and dense films with more globular microstructure and smooth surface are obtained.     

高速钢表面真空电弧沉积ZrN薄膜的组织与性能研究

通过试验研究了在高速钢表面真空电弧沉积ZrN薄膜的组织与性能 ,分析了真空度和偏压条件对ZrN薄膜显微结构及性能的影响