Recent advances in isotropic conductive adhesives for electronics packaging applications

Isotropic conductive adhesives (ICAs) have recently received a lot of focus and attention from the researchers in electronics industry as a potential substitute to lead-bearing solders. Numerous studies have shown that ICAs possess many advantages over conventional soldering such as environmental friendliness, finer pitch printing, lower temperature processing and more flexible and simpler processing. However, complete replacement of soldering by ICAs is yet not possible owing to several limitations of ICAs which are mainly related to reliability aspects like limited impact resistance, unstable contact resistance, low adhesion and conductivity etc. Continued efforts for last 15 years have resulted in development of ICAs with improved properties. This review article is aimed at providing a better understanding of ICAs, their principles, performance and significant research and development work addressing the technological utility of ICAs.     

The concept of an endurance limit for adhesive joints

The effect of cyclic stressing on the strength of single lap adhesive joints has been studied and a considerable reduction in strength observed when the maximum stress exceeds about 40% of the ultimate tensile strength, but whether or not a true endurance limit exists is not proven. Fallacies are shown in some of the techniques which have been proposed for studying the fatigue behaviour of adhesive joints.     

Water‐soluble/dispersible cationic pressure‐sensitive adhesives. I. Adhesives from solution polymerization

Pressure‐sensitive adhesives (PSAs) have long been a problem as sticky contaminants for paper recycling mills. The main problem associated with such stickies is that the PSAs in the waste papers deposit on the felts, press rolls, and drying cylinders of paper machines, and this creates problems with paper formation, reducing the paper quality and paper machine runnability. The annual cost of stickies to the U.S. paper industry is estimated to be about $600,000,000–650,000,000. To solve this problem, a series of cationic water‐soluble/dispersible PSAs have been synthesized by the free‐radical solution polymerization of butyl acrylate and [3‐(methacryloylamino)propyl]trimethylammonium chloride in ethanol. The PSA end‐use properties, repulpability in paper recycling, and the effects on the properties of recycled paper products have been studied. The cationic PSAs can be dissolved or dispersed in water if the cationic charge density in the PSA backbone is controlled, and so they do not deposit as stickies during recycling and papermaking processes. Because the PSAs are cationically charged, they can easily be removed from the papermaking system by adsorption onto the negatively charged fibers and fine surfaces. Furthermore, the adsorbed colloidal or dissolved PSAs have little effect on the final paper properties. © 2003 Wiley Periodicals, Inc. J Appl Polym Sci 90: 1624–1630, 2003     

Adhesive Dispensing Process Analysis: Steady-State Dispensing of One-Component Adhesives

The process of dispensing one-component heat-cure adhesives was investigated in order to understand current application processes and to guide new process development. Typical one-component adhesives exhibit non-Newtonian rheological behavior, and hence Newtonian fluid mechanics does not adequately describe the dispensing process. In the present study, the adhesives were modeled as Bingham fluids possessing a yield stress and a steady state viscosity. The model of the dispensing apparatus includes four major flow sections connected in a serial configuration. The fluid mechanics equations derived for Bingham fluids in the individual flow sections were solved by numerical methods in order to understand the interrelationships between the material variables (e.g. yield stress, viscosity, temperature dependencies) and process variables (e.g. pressure, flow geometry, temperature, output). The concept of the model is generic and the details of the model can be modified for any forced-flow adhesive application process.

The adhesive flow properties significantly influence the process output. Dispensing temperature, among the process variables, has the strongest effect on process output. A ± 1.0·C perturbation in the dispensing temperature can cause as much as a 14% variation in the bead size for the range of adhesives studied. Differences in flow characteristics result in differences in processability and non-linear temperature/pressure sensitivity. The non-linear sensitivity can be eliminated by operating the dispensing process isothermally. Finally, the process limits for one-component adhesives, which are susceptible to chemical instability induced by viscous heating during processing, are defined and discussed in terms of a modified Brinkman number that takes into account viscous dissipation, heat conduction and convection, and chemical stability of the material during processing.     

美国对邮票用压敏胶的开发

介绍了美国对邮票用压教胶的开发情况及其在废纸回用过程中的良好表现，     

Perm-Inspired High-Performance Soy Protein Isolate and Chicken Feather Keratin-Based Wood Adhesive without External Crosslinker

Crosslinking modification can effectively improve the water resistance of soy protein isolate (SPI) adhesive, but it often depends on petroleum-based reagents, violating the concept of green environmental protection. Here, inspired by the breaking and recombination of the disulfide bond in the perm process, a high-performance wood adhesive is prepared by incorporation of SPI (modified by sodium sulfite to cleave the disulfide bonds of protein chains) and feather keratin (FK, extracted from waste chicken feathers by breaking the disulfide bond) without using any other crosslinkers. The crosslinking reaction occurs by disulfide bonds derived from the sulfhydryl group of FK and SPI. Thus the wet shear strength of the SPI/FK-20 adhesive is improved from 0.57 to 1.18 MPa, an increment of 107%. This study provides a green strategy to prepare high-performance protein-based adhesive from the waste products-chicken feathers, which will contribute to the development of the environmentally friendly wood adhesive industry.     

丙烯酸树脂在医用黏合剂中的应用

讨论了丙烯酸树脂在医用黏合剂中的应用及进展。     

Copolymerization in UF/pMDI adhesives networks

Kinetic evidence in thermomechanical analysis experiments and carbon‐13 nuclear magnetic resonance spectroscopy (¹³C NMR) evidence indicates that the strength of a joint bonded with UF (urea–formaldehyde)/polymeric 4,4'‐diphenylmethane diisocyanate (pMDI) glue mixes is improved by coreaction of the methylol groups of UF resins with pMDI to form a certain number of methylene cross‐links. The formation of these methylene cross‐links is predominant, rather than formation of urethane bridges which still appear to form but which are in great minority. This reaction occurs in presence of water and under the predominantly acid hardening conditions, which is characteristic of aminoplastic resins (thus, in presence of a hardener). Coreaction occurs to a much lesser extent under alkaline conditions (hence, without UF resins hardeners). The predominant reaction is then different in UF/pMDI adhesive systems than that observed in phenol‐formaldehyde (PF)/pMDI adhesive systems. The same reaction observed for UF/pMDI system at higher temperatures has also been observed in PF/pMDI systems, but only at lower temperatures. The water introduced in the UF/pMDI mix by addition of the UF resin solution has been shown not to react with pMDI to an extent such as to contribute much, if at all, to the increase in strength of the hardened adhesive. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 86: 3681–3688, 2002     

Thermal Shock Failure in Thick Epoxy Coatings

In this paper we describe an apparatus for reproducibly measuring thermal shock resistance of thick polymer layers bonded to metals. The thermal shock behavior is discussed in terms of epoxy samples bonded to an aluminum substrate. It was found that both high resin toughness and low resin thermal expansion coefficient improved thermal shock resistance of thick coatings, but only a sample containing 60wt. % glass beads did not develop a failure crack. Effects of sample thickness, temperature gradient, and resin composition on thermal shock behavior are discussed.     

Study on the synthesis of thiirane

In this study, a thiirane resin was synthesized by the reaction of corresponding epoxy resin with KSCN. The synthetic conditions influencing the conversion of epoxy group were systematically investigated, such as the reaction temperature, reaction media, reaction time and the ratio of KSCN to epoxy group. It was found that the conversion of epoxy group increased with the increasing reaction temperature, improving the solubility of the mediate, extending reaction time, and the enhancing ratio of salt (KSCN) to epoxy group. Wherein, the reaction temperature and the ratio of the KSCN to epoxy group were more effective. For example, when the molar ratio of KSCN to epoxy group was equal to 2.0, the conversion of epoxy group got the maximum value, 0.65. In addition, the hot plate method was used to measure the gelling time of the resultant thiirane resin at different temperatures. It was found that the gelling time was reduced to 47–85% times as the corresponding epoxy resin depending on the conversion of the epoxy group, and the curing activation energy was diminished from 39 kJ/mol of epoxy resin to 17 kJ/mol. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 101: 4023–4027, 2006