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相控阵微系统的主要特征是电路与天线的高度融合集成,将三维微纳集成技术和微电子技术紧密地结合在一起,切合相控阵高频化、小型化和低成本的发展需求。本文设计了一款W波段的封装天线相控阵微系统,该相控阵采用硅基三维集成的方式将T/R多功能芯片、天线阵列集成在一个微系统模块中,并详细介绍了基于硅工艺的多功能收发芯片设计和相控阵封装天线设计。给出了相控阵微系统的测试结果。该微系统具有高集成度、高性能、低成本的特点,可以为高速无线通信、高精度探测和成像等应用提供一个较优的技术路径。 相似文献
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Li Li Runbo Ma Xinwei Chen Yanfeng Geng 《International Journal of Electronics》2013,100(12):1743-1751
For antenna-in-package (AiP), the via holes are used to connect the antenna ground and the system ground. In this article, the influence of the via holes on the performance of AiP is investigated and a broadband technique for AiP is proposed. The results indicate both the positions and number of the via holes have impact on the antenna performance. By properly arranging two via holes under the non-radiating edge, a new resonant frequency can be excited. As a result, the bandwidth of AiP can be improved effectively. According to the method, an AiP with a centre frequency of 5.2?GHz is realized. The bandwidth of the presented AiP is 400?MHz and almost doubles that of the ordinary AiPs. 相似文献
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