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1.
This paper presents a fast distance relay for series compensated transmission lines based on the R–L differential-equation algorithm using the theory of equal transfer process of transmission lines. The measuring distances based on the proposed algorithm can fast approach the actual value of fault distance when a fault occurs in front of the series capacitor. When a fault occurs behind of the series capacitor, the fault loop, including the series capacitor, does not match the R–L transmission line model, so the measuring distances fluctuate severely. Based on this, the relative position of the fault with respect to the series capacitor can be judged effectively according to the fluctuation range of the measuring distances, and the accurate fault location can be obtained fast. A variety of PSCAD/EMTDC simulation tests show that the new relay has fast operating speed and high accuracy when applied to the long series compensated transmission lines.  相似文献   
2.
在分析传统单片机教学存在问题的基础上,提出面向工程应用,聚焦企业需要,构建能力递进、面向应用的内容体系,搭建资源共享、实践创新、师生互动的自主学习平台,组建培养兴趣,突出技能的“双师型”教学团队,实践表明,在传授知识的同时,能有效提升学习兴趣,优化人才素质结构。  相似文献   
3.
《Ceramics International》2022,48(14):20237-20244
Composite anode materials with a unique architecture of carbon nanotubes (CNTs)-chained spinel lithium titanate (Li4Ti5O12, LTO) nanoparticles are prepared for lithium ion capacitors (LICs). The CNTs networks derived from commercial conductive slurry not only bring out a steric hindrance effect to restrict the growth of Li4Ti5O12 particles but greatly enhance the electronic conductivity of the CNTs/LTO composites, both have contributed to the excellent rate capability and cycle stability. The capacity retention at 30 C (1 C = 175 mA g?1) is as high as 89.7% of that at 0.2 C with a CNTs content of 11 wt%. Meanwhile, there is not any capacity degradation after 500 cycles at 5 C. The LIC assembled with activated carbon (AC) cathode and such a CNTs/LTO composite anode displays excellent energy storage properties, including a high energy density of 35 Wh kg?1 at 7434 W kg?1, and a high capacity retention of 87.8% after 2200 cycles at 1 A g?1. These electrochemical performances outperform the reported data achieved on other LTO anode-based LICs. Considering the facile and scalable preparation process proposed herein, the CNTs/LTO composites can be very potential anode materials for hybrid capacitors towards high power-energy outputs.  相似文献   
4.
The present work reports the realization of an analog fractional‐order phase‐locked loop (FPLL) using a fractional capacitor. The expressions for bandwidth, capture range, and lock range of the FPLL have been derived analytically and then compared with the experimental observations using LM565 IC. It has been observed that bandwidth and capture range can be extended by using FPLL. It has also been found that FPLL can provide faster response and lower phase error at the time of switching compared to its integer‐order counterpart. Copyright © 2014 John Wiley & Sons, Ltd.  相似文献   
5.
Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study.  相似文献   
6.
(1-x)Sr0.7Pb0.15Bi0.1TiO3-xBi4Ti3O12 ((1-x)SPBT-xBIT, x = 0-0.125) bulk ceramics were developed and calcined via the solid-state method, aimed at the application of pulsed power capacitors. The phase structures, temperature stability, hysteresis loop, and discharge properties were systematically investigated. Considering both the temperature stability and dielectric properties, 0.925SPBT-0.075BIT bulk ceramics with a capacitance variation satisfying the X7R specification were developed for pulsed power capacitors. The energy storage density was 0.252 J/cm3, and the ceramics showed high temperature stability at 80 kV/cm. The discharge current waveforms of the 0.925SPBT-0.075BIT ceramics were recorded. A high discharge power density of approximately 1.01 × 108 W/kg with an 8 Ω load resistor and short discharge period of 84 ns were achieved at 50 kV/cm. The good temperature stability properties and high power density show that the 0.925SPBT-0.075BIT ceramics are well suited for pulsed power capacitors with a wide temperature range.  相似文献   
7.
2.5GHz低相位噪声CMOS LC VCO的设计   总被引:5,自引:2,他引:3  
张海清  章倩苓 《半导体学报》2003,24(11):1154-1158
用0 .35μm、一层多晶、四层金属、3.3V的标准全数字CMOS工艺设计了一个全集成的2 .5 GHz L C VCO,电路采用全差分互补负跨导结构以降低电路功耗和减少器件1/ f噪声的影响.为了减少高频噪声的影响,采用了在片L C滤波技术.可变电容采用增强型MOS可变电容,取得了2 3%的频率调节范围.采用单个16边形的对称片上螺旋电感,并在电感下加接地屏蔽层,从而减少芯片面积,优化Q值.取得了在离中心频率1MHz处- 118d Bc/ Hz的相位噪声性能.电源电压为3.3V时的功耗为4 m A.  相似文献   
8.
串行16位DAC转换芯片在流量手操器中的应用   总被引:2,自引:0,他引:2  
本文介绍串行16位D/A转换芯片MAX541及其与AT89C52单片机的接口电路、相应的转换子程序,并给出其在过程流量手操器中的应用。  相似文献   
9.
新型的芯片间互连用CMOS/BiCMOS驱动器   总被引:5,自引:2,他引:3  
从改善不同类型 IC芯片之间的电平匹配和驱动能力出发 ,设计了几例芯片间接口 (互连 )用 CMOS/Bi CMOS驱动电路 ,并提出了采用 0 .5 μm Bi CMOS工艺 ,制备所设计驱动器的技术要点和元器件参数。实验结果表明所设计驱动器既具有双极型电路快速、大电流驱动能力的特点 ,又具备 CMOS电路低压、低功耗的长处 ,因而它们特别适用于低电源电压、低功耗高速数字通信电路和信息处理系统。  相似文献   
10.
半导体芯片的检测是芯片生产企业生产过程中的重要环节,芯片在检测过程中,由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。本文介绍了利用双探边器解决由于硅圆片结构所造成的漏测的有效办法及具体操作方法。  相似文献   
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