高密度互连印制板

本文阐述了RCC材料与化学蚀刻法制作高密度互连印制板的工序和详细方法,意在探寻最为经济、简单而又行 之有效的工艺。     

4H-SiC无线无源高温压力传感器设计

高温压力传感器研制的主要目的是解决高温恶劣环境下的压力测量问题,SiC是制造高温压力传感器的理想材料,结合薄膜技术与陶瓷厚膜技术,提出了一种新型的4H-SiC无线无源电容式高温压力传感器设计方案。应用Ansys有限元分析软件进行仿真,600℃时灵敏度为2.65 MHz/bar,说明传感器在高温下具有较高的灵敏度,对制备过程中的关键工艺——SiC深刻蚀进行了验证,刻蚀深度达到124μm,满足传感器制备要求。     

The Effect of Aluminum Ions on the DC Etching of Aluminum Foil

A study has been made of the electrochemical etching of 99.99% aluminum foils at a current density of 50 mA cm^–2in AlCl₃–HCl solutions (1 m Cl^–) at 80 °C. The solutions were made by dissolving metallic aluminum into 1m HCl solution, to give a Cl^– concentration of 1 m. The number density of etch tunnels and the homogeneity of tunnel length decreased, and the mean pit size and its standard deviation increased with increasing Al³⁺ concentration. The results were discussed based on potential transients at a current density of 50 mA cm^–2, current–potential curves at a scan rate of 10 m Vs^–1 and electrochemical impedance spectra.     

等离子硅刻蚀及其工艺参数的多尺度优化

用CFD-ACE+和CFD-TOPO分别对容性耦合等离子体反应腔室放电和等离子硅刻蚀过程进行仿真,讨论不同射频电压和腔室条件对等离子体特性的影响.结果表明:随着射频电压的升高,离子的通量增大;在低射频电压时,离子通量随腔室压强的升高而减小,而在高射频电压时趋势则相反.用Kriging模型对影响刻蚀形貌的参数(腔室压强和射频电压)进行优化,结果表明该优化方法可以为工艺条件相近的刻蚀机设备的设计提供参考.     

Low-Cost,High-Speed Domain Refinement without Damage to Insulative Coatings

Rolling large- diameter hardened steel balls over the surface of high- permeability grain- oriented electri-cal steel allows lines of plastic deformation to be laid down. Choice of proper Young’s modulus and ball diameter enables artificial grain boundaries to be created, producing appropriate domain refinement and loss reduction.     

Magnetic field-assisted photochemical machining (MFAPCM) of SS316L

In this paper, a new technique of photochemical machining (PCM) process has been described. The objective of this study is to investigate the effect of applying a magnetic field on the PCM of AISI 316?L stainless steel. The experiments were planned and conducted using a Full Factorial Design (FFD) approach. The control parameters selected were magnetic field, temperature, concentration and time. The analysis of the results shows significant improvement in the etch rate due to the application of a magnetic field. The highest etch rate was achieved at a concentration of 700?g/l, at the temperature of 60°C in a static magnetic field. The improvement of the etch rate is 2.5 times with the application of magnetic field as compared to the conventional PCM process.     

高纯度纳米碳管的低温合成

以甲醇为碳源，在负载于CaO上的Co催化剂的催化作用下，利用微波等离子体化学气相沉积法低温合成了较高纯度的纳米碳管。经分析认为，等离子体中因甲醇裂解产生的氧离子及含氧基团对无定形碳具有很强的选择性刻蚀能力，为低温合成纳米碳管时提高其纯度创造了条件。     

浅析余热锅炉循环水加药处理

转炉烟道冷却壁经常开裂 ,据分析 ,开裂的主要原因为 :水质、水处理系统及其运行过程中在锅炉系统的内部产生点蚀及局部结垢后 ,部位具有较高的热阻 ,锅炉管外壁温度不均匀 ;同时 ,冷却壁急冷急热现象频繁 ,容易在冷却壁的最薄弱处产生裂纹。处理方式为在锅炉系统中增设加药计量泵 ,连续定量加入除氧缓蚀剂及阻垢剂 ,避免锅炉管内结垢及产生点蚀 ,进而避免了锅炉管外壁温度不均匀现象的产生 ,从根本上解决了烟道冷却壁经常开裂的问题     

Virtual metrology modeling of time-dependent spectroscopic signals by a fused lasso algorithm

This paper proposes a fused lasso model to identify significant features in the spectroscopic signals obtained from a semiconductor manufacturing process, and to construct a reliable virtual metrology (VM) model. Analysis of spectroscopic signals involves combinations of multiple samples collected over time, each with a vast number of highly correlated features. This leads to enormous amounts of data, which is a challenge even for modern-day computers to handle. To simplify such complex spectroscopic signals, dimension reduction is critical. The fused lasso is a regularized regression method that performs automatic variable selection for the predictive modeling of highly correlated datasets such as those of spectroscopic signals. Furthermore, the fused lasso is especially useful for analyzing high-dimensional data in which the features exhibit a natural order, as is the case in spectroscopic signals. In this paper, we conducted an experimental study to demonstrate the usefulness of a fused lasso-based VM model and compared it with other VM models based on the lasso and elastic-net models. The results showed that the VM model constructed with features selected by the fused lasso algorithm yields more accurate and robust predictions than the lasso- and elastic net-based VM models. To the best of our knowledge, ours is the first attempt to apply a fused lasso to VM modeling.     

Quantitative Evaluation Method for Etch Sidewall Profile of Through‐Silicon Vias (TSVs)

Through‐silicon via (TSV) technology provides much of the benefits seen in advanced packaging, such as threedimensional integrated circuits and 3D packaging, with shorter interconnection paths for homo‐ and heterogeneous device integration. In TSV, a destructive cross‐sectional analysis of an image from a scanning electron microscope is the most frequently used method for quality control purposes. We propose a quantitative evaluation method for TSV etch profiles whereby we consider sidewall angle, curvature profile, undercut, and scallop. A weighted sum of the four evaluated parameters, nominally total score (TS), is suggested for the numerical evaluation of an individual TSV profile. Uniformity, defined by the ratio of the standard deviation and average of the parameters that comprise TS, is suggested for the evaluation of wafer‐to‐wafer variation in volume manufacturing.