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排序方式: 共有93条查询结果,搜索用时 15 毫秒
1.
When freshly etched samples of various types of copper were exposed in moderately acid, aerated chloride solutions, two phenomena were observed. First the corrosion potential and the pH of the solution decreased over a shorter time, then the potential increased over a long period (600-1500 min), following an s-shaped pattern. Increase in pH during the second stage was avoided using a pH-stat. The corrosion rate increased little or not at all over the entire period. A tentative interpretation of the short-term behaviour is presented with some reservation. The long-term development of the potential suggests phase formation or transformation following the Avrami pattern. By suitable derivations it was possible to fit the development of potentials to the Avrami equation. Subsequent examinations by Auger spectroscopy proved the presence of thin layers of Cu2O on the copper surfaces, increasing in thickness with exposure time. The dissolution kinetics can be described in terms of two parallel electrochemical reactions and a simultaneous non-electrochemical dissolution reaction. 相似文献
2.
Shunpei Yamazaki Takuya Hirohashi Masahiro Takahashi Shunsuke Adachi Masashi Tsubuku Junichi Koezuka Kenichi Okazaki Yohsuke Kanzaki Hiroshi Matsukizono Seiji Kaneko Shigeyasu Mori Takuya Matsuo 《Journal of the Society for Information Display》2014,22(1):55-67
Our crystalline In–Ga–Zn oxide (IGZO) thin film has a c‐axis‐aligned crystal (CAAC) structure and maintains crystallinity even on an amorphous base layer. Although the crystal has c‐axis alignment, its a‐axis and b‐axis have random arrangement; moreover, a clear grain boundary is not observed. We fabricated a back‐channel‐etched thin‐film transistor (TFT) using the CAAC‐IGZO film. Using the CAAC‐IGZO film, more stable TFT characteristics, even with a short channel length, can be obtained, and the instability of the back channel, which is one of the biggest problems of IGZO TFTs, is solved. As a result, we improved the process of manufacturing back‐channel‐etched TFTs. 相似文献
3.
《青岛科技大学学报(自然科学版)》2010,(5)
通过对铭牌字符结构特征和字符之间相对关系的分析,提出基于神经网络和隐马尔可夫模型的激光刻蚀字符的识别方法。提取字符图像中的端点、三叉点和四叉点,对传统三叉点的提取方法进行改进,并利用神经网络的方法计算出对应每个字符的概率值,再根据隐马尔可夫模型计算出状态转移的最大似然,从而识别整个字符串。实验表明上述方法适用于激光刻蚀铭牌字符的识别。 相似文献
4.
Development of flexible displays using back‐channel‐etched In–Sn–Zn–O thin‐film transistors and air‐stable inverted organic light‐emitting diodes
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Mitsuru Nakata Genichi Motomura Yoshiki Nakajima Tatsuya Takei Hiroshi Tsuji Hirohiko Fukagawa Takahisa Shimizu Toshimitsu Tsuzuki Yoshihide Fujisaki Toshihiro Yamamoto 《Journal of the Society for Information Display》2016,24(1):3-11
We developed flexible displays using back‐channel‐etched In–Sn–Zn–O (ITZO) thin‐film transistors (TFTs) and air‐stable inverted organic light‐emitting diodes (iOLEDs). The TFTs fabricated on a polyimide film exhibited high mobility (32.9 cm2/Vs) and stability by utilization of a solution‐processed organic passivation layer. ITZO was also used as an electron injection layer (EIL) in the iOLEDs instead of conventional air‐sensitive materials. The iOLED with ITZO as an EIL exhibited higher efficiency and a lower driving voltage than that of conventional iOLEDs. Our approach of the simultaneous formation of ITZO film as both of a channel layer in TFTs and of an EIL in iOLEDs offers simple fabrication process. 相似文献
5.
Vaibhav Kulshrestha K. Awasthi N. K. Acharya M. Singh Y. K. Vijay 《Bulletin of Materials Science》2005,28(7):643-646
In the present study the polyethersulphone (PES) membranes of thickness (35 ±2) μm were prepared by solution cast method.
The permeability of these membranes was calculated by varying the temperature and by irradiation of α ions. For the variation
of temperature, the gas permeation cell was dipped in a constant temperature water bath in the temperature range from 303–373
K, which is well below the glass transition temperature (498 K). The permeability of H2 and CO2 increased with increasing temperature. The PES membrane was exposed by a-source (95Am241) of strength (1 μ Ci) in vacuum of the order of 10−6 torr, with fluence 2.7 × 107 ions/cm2. The permeability of H2 and CO2 has been observed for irradiated membrane with increasing etching time. The permeability increases with increasing etching
time for both gases. There was a sudden change in permeability for both the gases when observed at 18 min etching. At this
stage the tracks are visible with optical instrument, which confirms that the pores are generated. Most of pores seen in the
micrograph are circular cross-section ones. 相似文献
6.
7.
8.
M.A. Miller M.H. Crawford A.A. Allerman K.C. Cross M.A. Banas R.J. Shul J. Stevens K.H.A. Bogart 《Journal of Electronic Materials》2009,38(4):533-537
Using a two-step method of plasma and wet chemical etching, we demonstrate smooth, vertical facets for use in Al
x
Ga1−x
N-based deep-ultraviolet laser-diode heterostructures where x = 0 to 0.5. Optimization of plasma-etching conditions included increasing both temperature and radiofrequency (RF) power
to achieve a facet angle of 5 deg from vertical. Subsequent etching in AZ400K developer was investigated to reduce the facet
surface roughness and improve facet verticality. The resulting combined processes produced improved facet sidewalls with an
average angle of 0.7 deg from vertical and less than 2-nm root-mean-square (RMS) roughness, yielding an estimated reflectivity
greater than 95% of that of a perfectly smooth and vertical facet. 相似文献
10.
采用带有原位加热装置的SEM对冷轧变形量ε为1.2的IF钢再结晶过程进行了观察,结果表明,当加热温度为该钢的再结晶温度650℃时,该钢再结晶过程受阻,加热过程中试样表面形成蚀沟,并随加热时间延长蚀沟不断加深,而试样表面未发生再结晶现象。对产生该现象的原因进行了深入分析。 相似文献