在无铅环境中的热风整平

当电子工业走向无铅焊接的时候,热风焊料整平仍然是继续可焊性保护的优选方法。     

提高焊膏印刷质量的工艺改进

焊膏印刷作为SMT工艺的第一步，其质量好坏对SMT工艺有着重要影响。文章通过对焊膏成分、特性的分析，讨论了印刷中各种工艺参数的正确选择；对焊膏印刷中容易出现的质量问题进行了详细分析，指出了产生问题的原因，提出了改进措施。     

Intermetallic compounds formed at the interface between liquid indium and copper substrates

The interfacial reactions between liquid In and Cu substrates at temperatures ranging from 175°C to 400°C are investigated for the applications in bonding recycled sputtering targets to their backing plates. Experimental results show that a scallop-shaped Cu₁₆In₉ intermetallic compound is found at the Cu/In interface after solder reactions at temperatures above 300°C. A double-layer structure of intermetallic compounds containing scallop-shaped Cu₁₁In₉ and continuous CuIn is observed after the Cu/In interfacial reaction at temperatures below 300°C. The growth of all these intermetallic compounds follows the parabolic law, which implies that the growth is diffusion-controlled. The activation energies for the growth of Cu₁₆In₉, Cu₁₁In₉, and CuIn intermetallic compounds calculated from the Arrhenius plot of growth reaction constants are 59.5, 16.9, and 23.5 kJ/mole, respectively.     

环氧基的PCB对无铅组装的兼容性

综述了环氧树脂基的PCB与无铅化组装的兼容性问题。经过大量试验表明,常规的FR-4基材和双氰胺固化的高Tg基材是不能满足无铅化组装要求的,而采用酚醛固化的中等-Tg的环氧树脂基材是可能成为无铅化组装用基材的。同时,PCB制造过程也起着重要的作用。PCB设计和再(回)流焊的加热梯度也影响着无铅化的性能。     

厚膜混合集成电路常见工艺缺陷及其消除方法

除设计和材料外，工艺和操作对厚膜混合集成电路的质量和性能也有较大的影响。分析了厚膜混合集成电路生产过程中一些常见的工艺缺陷，如线条变形、起泡、阻值不稳、元件受损、锡珠等的产生原因，并提出了相应的消除方法。     

电镀锡机组软熔导电辊脱锡技术研究

粘锡是电镀锡机组软熔导电辊失效的主要原因,应用化学方法脱锡是延长导电辊寿命的重要途径.开发了氢氧化钠(钾)为主要组成,并加入适量亚铅酸钠(钾)和硝酸(亚硝酸)钠配制而成脱锡剂,当脱锡剂温度为40～80℃,导电辊表面温度为40～70℃时,对粘锡导电辊具有很好的脱锡效果.粘锡导电辊脱锡后的表面粗糙度可以恢复到4.0μm以上,导电辊使用寿命提高80%,降低导电辊修复成本90%,并大幅度减少导电辊更换时间,提高电镀锡机组生产作业率.     

Low temperature bonding of LD31 aluminum alloys by electric brush plating Ni and Cu coatings

0Introduction Amongavarietyofbondingtechnologies,vacuum brazinghasbeenwidelyadoptedasareliablemethodfor joiningaluminumcomponents[1],whereintheAl Sialloys systemisrecognizedasthemostpopularfillermetals[2,3]. Althoughasoundjointcanbeachievedforcertainalumi…     

WZ型系列真空铝钎焊炉的研制

简要介绍了WZ型系列真空铝钎焊炉型号，规格等技术参数，并以WZLQH－30型真空铝钎焊炉为例介绍了真空铝钎焊炉的结构及其特点，总结了真空铝钎焊炉设计研究及调试过程中的一些经验体会。     

Analysis of Intermetallic Phases Formed on Surface Vapor Oxidized H13 Hot Work Steels in Molten Aluminum

In this paper, the author dipped surface vapor oxidized H13 steel specimens into 700℃ molten aluminum liquid for a certain period of time. Analyze the intermetallic phases formed on the H13 samples surface with optical microscope and X-ray diffraction method. The observation of immersion test sample's cross-section shows that Fe3O4 film will protect die substrate from molten aluminum erosion. The identification of the intermetallic phases reveals that they consist of 2parts, which is named as the composite layer and the compact layer. Further investigations are made in order to know the phase constituents of the 2 layers, they are Al8Fe2Si (outer composite layer), (AlCuMg) and Al5Fe2 (compact layer),respectively. The experimental results show that on the same specimen, a convex surface with bigger radius of curvature is more likely to be molten and the melting loss speed is also faster than a flat and smooth surface. The thickness of compact layer on a smooth surface is much bigger than that of the convex surface. Therefore, the author supposes the compact layer is favorable in stabilizing the die surface material from further melting loss, as their formation on the die surface, the melting loss speed will decrease.     

SMT建模仿真研究现状及发展

概述了SMT再流焊工艺过程、所用组装件以及形成的焊点3方面的仿真进展，充分展现了计算机模拟在再流焊研究中的重要作用。