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排序方式: 共有205条查询结果,搜索用时 78 毫秒
1.
W. J. PLUMBRIDGE Y. KARIYA 《Fatigue & Fracture of Engineering Materials & Structures》2004,27(8):723-734
With continuing miniaturisation, increased performance demands and the requirement to remove lead from solder alloys, the challenges to structural integrity and reliability of electronic equipment are substantial and increasing. This paper outlines typical features in electronic equipment of which the structural integrity community may be generally unaware. Potential failure modes in service are described, and the problems of scale and material characteristics are considered. Progress in the application of fracture mechanics to the life prediction of interconnections is reviewed. The limited evidence available suggests that the crack growth resistance of silver‐containing lead‐free solders is superior to that of the traditional Sn‐37Pb under cycle‐controlled conditions but there is no difference when time‐dependent conditions prevail. In several respects, it is contended that the electronics sector is faced with challenges at least equivalent to those encountered in gas turbines and nuclear power generation. 相似文献
2.
The Sn−Ti−Zn ternary phase diagram has been constructed using the CALPHAD technique. The Ti−Zn binary system phase boundaries
were determined using differential scanning calorimetry and the solid-liquid diffusion couples method. In addition, the formation
energy of some stoichiometric compounds was obtained using first-principle band energy calculations. For the ternary system,
some alloys were prepared by equilibration at 600 or 700 °C, and the compositions of the precipitates were analyzed using
electron probe microanalysis. Thermodynamic assessment of the Ti−Zn and Sn−Ti−Zn systems was performed based on the experimental
information and by adopting reported values of the thermodynamic properties of the Sn−Zn and Sn−Ti binary systems. Microstructural
observation showed that Sn3Ti5Zn12 exists in the ternary system. Seven types of invariant reaction on the Sn-rich liquidus surface of the ternary system are
predicted by the phase diagram calculations. The ternary eutectic point falls at 0,0009 mass% Ti and 8.69 mass% Zn, at T=192.40°C, which is slightly lower than the calculated eutectic point of Sn−Zn binary alloy (T=192.41°C). Based on these results, a nonequilibrium solidification process using the Scheil model was simulated.
This paper was presented at the International Symposium on User Aspects of Phase Diagrams, Materials Solutions Conference
and Exposition, Columbus, Ohio, 18–20 October, 2004. 相似文献
3.
Z. Moser W. Gąsior K. Bukat J. Pstruś R. Kisiel J. Sitek K. Ishida I. Ohnuma 《Journal of Phase Equilibria and Diffusion》2006,27(2):133-139
Maximum bubble pressure, dilatometric, and meniscographic methods were used in the investigations of the surface tension,
density, wetting time, wetting force, contact angle, and interfacial tension of liquid alloys of Sn−Ag−Cu eutectic composition
with various additions of Bi. Density and surface tension measurements were conducted in the temperature range 250–900 °C.
Surface tensions at 250 °C measured under a protective atmosphere of Ar−H2 were combined with data from meniscographic studies done under air or with a protective flux. The meniscographic data with
a nonwetted teflon substrate provided data on interfacial tension (solder-flux), surface tension in air, and meniscographic
data with a Cu substrate allowed determinations of wetting time, wetting force, and calculation of contact angle. The calculated
wetting angles from meniscographic studies for binary Sn−Ag eutectic and two ternary Sn−Ag−Cu alloys were verified by separate
measurements by the sessile drop method under a protective atmosphere with a Cu substrate. Additions of Bi to both ternary
alloys improve the wettability and move the parameters somewhat closer to those of traditional Sn−Pb solders. 相似文献
4.
为了研究低银无铅焊点界面金属间化合物(IMC)的形成与演变,以低银无铅焊点Sn-Ag-xCu-Bi-Ni/Cu为研究对象,研究了钎料中Cu质量分数对界面IMC厚度、形貌和成分的影响.实验结果表明,随着钎料中Cu质量分数的增加,回流焊后焊点IMC层厚度变薄,IMC晶粒尺寸增大,IMC晶粒形貌由颗粒状转变为棱柱状以及鹅卵石状,同时界面IMC成分发生由(Cu,Ni)6Sn5向Cu6Sn5的转变.高温时效后,界面IMC层厚度增长.当钎料中Cu质量分数超过1%时,时效后生成较厚的Cu3Sn化合物层,对焊点可靠性不利.钎料中Cu质量分数应控制在1%以下. 相似文献
5.
6.
In对Sn-8Zn-3Bi无铅钎料润湿性的影响 总被引:4,自引:1,他引:4
首先采用铺展法测试了Sn-8Zn-3Bi-(0~5)In钎料合金的铺展性.结果表明,少量In的加入提高了钎料的润湿性.当In含量达到0.5%时(质量分数,下同),钎料在铜基底上的铺展面积最大.采用气泡最大压力法对Sn-8Zn-3Bi-(0~1.5)In钎料熔体进行了表面张力测试.加入0.5%的In大大降低了Sn-8Zn-3Bi钎料熔体的表面张力,但进一步增加In的含量导致熔体表面张力增大.最后采用润湿平衡法对上述钎料进行了润湿力测试.结果表明0.5%In的加入使合金的润湿力达到最大,其原因是钎料/铜界面的界面张力减小. 相似文献
7.
8.
《Materials Science & Technology》2013,29(8):752-759
The interaction of pure zinc and Zn–4Al, Zn–15Al (wt-%) solder alloys with aluminium has been investigated. Two different experimental techniques were used: (i) the aluminium samples soldering and (ii) the holding of liquid solder alloys inside the hollow in an aluminium base. The aluminium content was determined in samples after contact with aluminium at various temperatures and various holding times. It is shown that in soldered seams and solder alloys that had been held inside the aluminium base, the content of the aluminium was higher than at the points on the liquidus line on the Zn–Al equilibrium phase diagram at the corresponding temperatures and increases along with an increase in the holding time. This was apparently due to isothermal solidification. 相似文献
9.
Sung K. Kang Donovan Leonard Da-Yuan Shih Lynne Gignac D. W. Henderson Sungil Cho Jin Yu 《Journal of Electronic Materials》2006,35(3):479-485
The near-ternary eutectic Sn-Ag-Cu alloys have been identified as leading Pb-free solder candidates to replace Pb-bearing
solders in microelectronic applications. However, recent investigations on the processing behavior and solder joints reliability
assessment have revealed several potential reliability risk factors associated with the alloy system. The formation of large
Ag3Sn plates in Sn-Ag-Cu joints, especially when solidified in a relatively slow cooling rate, is one issue of concern. The implications
of large Ag3Sn plates on solder joint performance and several methods to control them have been discussed in previous studies. The minor
Zn addition was found to be effective in reducing the amount of undercooling required for tin solidification and thereby to
suppress the formation of large Ag3Sn plates. The Zn addition also caused the changes in the bulk microstructure as well as the interfacial reaction. In this
paper, an in-depth characterization of the interfacial reaction of Zn-added Sn-Ag-Cu solders on Cu and Au/Ni(P) surface finishes
is reported. The effects of a Zn addition on modification of the interfacial IMCs and their growth kinetics are also discussed. 相似文献
10.
电子封装焊点可靠性及寿命预测方法 总被引:16,自引:2,他引:14
高功率、高密度、小型化是现代电子封装结构的基本特征,软焊料是电子封装中应用最广的连接材料,一个焊点的破坏往往导致整个封装结构的失效。软钎料的无铅化是目前发展的重要趋势。针对目前所开发的无铅焊料,文中介绍电子封装结构中焊点的破坏行为和焊点寿命预测的基本方法。 相似文献