2.3–21 GHz broadband and high linearity distributed low noise amplifier

This paper focuses on the design of a 2.3–21 GHz Distributed Low Noise Amplifier (LNA) with low noise figure (NF), high gain (S₂₁), and high linearity (IIP3) for broadband applications. This distributed amplifier (DA) includes S/C/X/Ku/K-band, which makes it very suitable for heterodyne receivers. The proposed DA uses a 0.18 μm GaAs pHEMT process (OMMIC ED02AH) in cascade architecture with lines adaptation and equalization of phase velocity techniques, to absorb their parasitic capacitances into the gate and drain transmission lines in order to achieve wide bandwidth and to enhance gain and linearity. The proposed broadband DA achieved an excellent gain in the flatness of 13.5 ± 0.2 dB, a low noise figure of 3.44 ± 1.12 dB, and a small group delay variation of ±19.721 ps over the range of 2.3–21 GHz. The input and output reflection coefficients S₁₁ and S₂₂ are less than −10 dB. The input compression point (P_1dB) and input third-order intercept point (IIP3) are −1.5 dBm and 11.5 dBm, respectively at 13 GHz. The dissipated power is 282 mW and the core layout size is 2.2 × 0.8 mm².     

Compiler compatible 5.66 Mb/mm2 8T 1R1W register file in 14 nm FinFET technology

1-read/1-write (1R1W) register file (RF) is a popular memory configuration in modern feature rich SoCs requiring significant amount of embedded memory. A memory compiler is constructed using the 8T RF bitcell spanning a range of instances from 32 b to 72 Kb. An 8T low-leakage bitcell of 0.106 μm² is used in a 14 nm FinFET technology with a 70 nm contacted gate pitch for high-density (HD) two-port (TP) RF memory compiler which achieves 5.66 Mb/mm² array density for a 72 Kb array which is the highest reported density in 14 nm FinFET technology. The density improvement is achieved by using techniques such as leaf-cell optimization (eliminating transistors), better architectural planning, top level connectivity through leaf-cell abutment and minimizing the number of unique leaf-cells. These techniques are fully compatible with memory compiler usage over the required span. Leakage power is minimized by using power-switches without degrading the density mentioned above. Self-induced supply voltage collapse technique is applied for write and a four stack static keeper is used for read Vmin improvement. Fabricated test chips using 14 nm process have demonstrated 2.33 GHz performance at 1.1 V/25 °C operation. Overall V_min of 550 mV is achieved with this design at 25 °C. The inbuilt power-switch improves leakage power by 12x in simulation. Approximately 8% die area of a leading 14 nm SoC in commercialization is occupied by these compiled RF instances.     

Small‐Sized High‐Power PIN Diode Switch with Defected Ground Structure for Wireless Broadband Internet

This letter presents a small‐sized, high‐power single‐pole double‐throw (SPDT) switch with defected ground structure (DGS) for wireless broadband Internet application. To reduce the circuit size by using a slow‐wave characteristic, the DGS is used for the quarter‐wave (°/4) transmission line of the switch. To secure a high degree of isolation, the switch with DGS is composed of shunt‐connected PIN diodes. It shows an insertion loss of 0.8 dB, an isolation of 50 dB or more, and power capability of at least 50 W at 2.3 GHz. The switch shows very similar performance to the conventional shunt‐type switch, but the circuit size is reduced by about 50% simply with the use of DGS patterns.     

SOI光电子集成

SOI（Silicon-on-Insulator)光电子集成已成为十分引人注目的研究课题，其工艺与CMOS工艺完全兼容，可以实现低成本的SOI基整片集成光电子回路。本文综述了近几年来SOI集成光电子器件的发展以及一些最新的研究进展，着重分析几种最新型光无源器件的工作原理和结构，包括SOI光波导、SOI光波导耦合器、SOI光波导开关、相位阵列波导光栅（PAWG）、基于SOI的光探测器等，并介绍了中国科学院半导体所集成光电子国家重点实验室的研究进展。     

宽带DDS跳频源设计

直接数字合成（DDS）简单可靠、控制方便，具有很高的频率分辨率，高速转换，非常适合快速跳频的要求。在对DDS基本原理进行了简要介绍和分析后，提出宽带跳频源设计方案。     

一个基于PE分层技术的电子政务网络平台

电子政务网络建设的主要目标就是建立一个开放的、基于标准的统一网络平台，并在该平台上实现政府不同部门之间的信息交换和资源共享，同时保证各部门信息的独立和安全。通过介绍电子政务网络建设中的主流技术——MPLSVPN，提出了一种基于该技术原理的PE分层技术，详细讨论了基于该分层技术的电子政务网络平台的实现过程和主要技术，并对其性能参数进行了测试与分析。     

CMOS光接收机主放大器设计

利用CMOS工艺设计一种用于SDH STM 4速率级(622 Mb/s)光纤用户网的光接收机放大电路。此电路由输入/输出缓冲、主放大单元、偏置补偿电路4部分组成。通过直接耦合技术提高增益,降低功耗;利用有源电感负载提高系统带宽。采用商用SmartSpice电路仿真软件和CSMC HJ 0.6μm工艺参数对该电路进行仿真。结果表明,该电路在5 V工作电压下中频增益为81 dB,3 dB带宽为470 MHz。     

采用RF2607的WLAN自动增益控制设计

介绍了宽动态变化范围的新型可变增益放大器RF2607的特性、功能,给出了利用RF2607设计无线局域网(WLAN)通信中自动增益控制部分的实用电路.     

5Gb/s 0.25μm CMOS限幅放大器

采用TSMC 0.25μm CMOS技术设计实现了高速低功耗光纤通信用限幅放大器.该放大器采用有源电感负载技术和放大器直接耦合技术以提高增益,拓展带宽,降低功耗并保持了良好的噪声性能.电路采用3.3V单电源供电,电路增益可达50dB,输入动态范围小于5mVpp,最高工作速率可达7Gb/s,均方根抖动小于0.03UI.此外核心电路功耗小于40mW,芯片面积仅为0.70mm×0.70mm.可满足2.5,3.125和5Gb/s三个速率级的光纤通信系统的要求.     

宽工作电压范围单电源CMOS误差放大器

采用0.8μm标准数字CMOS工艺(VTN0=0.836V,VTP0=0.930V),设计并流片验证了具有宽工作电压范围(3～6V),可作SOC系统动态电源管理芯片内部误差放大器应用的单电源CMOS运算放大器。该误差放大器芯核同时具有适合低电压工作,并对工艺参数变化不敏感的优点。对于相同的负载情况,在3V的工作电压下,开环电压增益AD=83.1dB,单位增益带宽GB=2.4MHz,相位裕量Φ=85.2°,电源抑制比PSRR=154.0dB,转换速率Sr=2.2V/μs;在6V工作电压下,AD=85.1dB,GB=2.4MHz,Φ=85.4°,PSRR=145.3dB,Sr=3.4V/μs。