Multi-discharge EDM coring of single crystal SiC ingot by electrostatic induction feeding method

A new technique of EDM coring of single crystal silicon carbide (SiC) ingot was proposed in this paper. Currently single crystal SiC devices are still of high cost due to the high cost of bulk crystal SiC material and the difficulty in the fabrication process of SiC. In the manufacturing process of SiC ingot/wafer, localized cracks or defects occasionally occur due to thermal or mechanical causes resulted from fabrication processes which may waste the whole piece of material. To save the part of ingot without defects and maximize the material utilization, the authors proposed EDM coring method to cut out a no defect ingot from a larger diameter ingot which has localized defects. A special experimental setup was developed for EDM coring of SiC ingot in this study and its feasibility and machining performance were investigated. Meanwhile, in order to improve the machining rate, a novel multi-discharge EDM coring method by electrostatic induction feeding was established, which can realize multiple discharges in single pulse duration. Experimental results make it clear that EDM coring of SiC ingot can be carried out stably using the developed experimental setup. Taking advantage of the newly developed multi-discharge EDM method, both the machining speed and surface integrity can be improved.     

锡矿山重复水利用的措施及效果

本介绍了锡矿山前闪星锑业有限责任公司如何加强对关键耗水工序的管理及提高重复水利用率的措施，并对所取得的效果进行了阐述，可供用水大户如何节水以借鉴。     

一个有效的圆片规模布局算法

本文提出了一个圆片规模布局算法，它是国外一个相应算法的改进形式，区别在于利用力定向布局法的方式不同。在相对位置阶段，该算法利用布局的层次特性将需确定所有电路元件相对位置的问题缩减至仅需确定宏电路元件相对位置的问题；在实际位置阶段，采用分治策略和取消前阶段层次划分的方式回避了需确定任意元实际位置的问题．其时间复杂度远低于国外相应算法．     

Early detection of ageing in solder joints through laser probe thermal analysis of the peltier effect

We have recently developed an optical contactless method for testing the quality of solder joints during accelerated thermal cycling ageing processes.¹ The method was based upon the measurement of the dynamic thermal behaviour of the joint to short bursts of Joule heating. It has proved to be efficient in revealing the formation of cracks at the lead-solder interface. We present a method to evaluate ageing at a much earlier stage in the cycling process. We have observed in earlier work,¹ that before cracks appear, structural changes occur in the solder at the lead-solder interface. The thermal response of the solder joint is recorded over time to a Peltier heat perturbation produced by flowing a current pulse through the interface where structural changes occur. The key point in this method is to discriminate the Peltier effect from the Joule thermal response because both effects generate heat. The variation of the early Peltier response in the thermal cycling ageing tests is seen as a quantitative signature of the structural changes in the lead-solder interface.     

对投入与产出优化分析方法的应用探讨

介绍投入与产出优化分析的一些基本概念和计算方法 ,并结合实际 ,举例说明投入与产出的优化分析方法具体应用     

硅片和硅器件工艺中的背面损伤吸除技术

本文介绍了硅片背面的三种主要损伤吸除技术：机械损伤、激光辐照和离子注入技术。对这三种吸除技术的机理、工艺条件、应用情况和近来进展，作了详细的评述。     

An experimental investigation into soft-pad grinding of wire-sawn silicon wafers

Silicon is the primary semiconductor material used to fabricate microchips. A series of processes are required to manufacture high-quality silicon wafers. Surface grinding is one of the processes used to flatten wire-sawn wafers. A major issue in grinding of wire-sawn wafers is reduction and elimination of wire-sawing induced waviness. Results of finite element analysis have shown that soft-pad grinding is very effective in reducing the waviness. This paper presents an experimental investigation into soft-pad grinding of wire-sawn silicon wafers. Wire-sawn wafers from a same silicon ingot were used for the study to ensure that these wafers have similar waviness. These wafers were ground using two different soft pads. As a comparison, some wafers were also ground on a rigid chuck. Effectiveness of soft-pad grinding in removing waviness has been clearly demonstrated.     

Imaging and probing catalytic surface reactions on the nanoscale: Field Ion Microscopy and atom-probe studies of O2–H2/Rh and NO–H2/Pt

We present dynamic studies of surface reactions using video-Field Ion Microscopy (FIM) along with Pulsed Field Desorption Mass Spectrometry (PFDMS). Catalytic water formation is followed using rhodium and platinum 3D field emitter crystals for the oxidation of hydrogen with either oxygen (Rh) or NO (Pt). Strongly non-linear dynamics are observed with nanoscale spacial resolution. For both reactions quasi-oscillatory behaviour exists under certain conditions of temperatures and partial pressures. An influence of the probing electric field is observed and possibly essential in establishing oscillatory behaviour. Local chemical probing of selected surface areas with up to 400 atomic surface sites proves catalytic water formation to take place. Since water ions (H₂O⁺/H₃O⁺) cause image formation of the O₂–H₂ reaction on Rh, respective videos provide space-time resolved information on the catalytically active sites. Atom-probe data also reveal that the surface of the Rh sample reversibly switches from a metallic to an oxidized state during oscillations. As to the NO–H₂ reaction on Pt, fast ignition phenomena are observed to precede wave fronts. After catalytic water formation, NO molecules diffuse into emptied areas and cause high image brightness. Depending on the size of the Pt crystal, the reaction may ignite in planes or kinked ledges along the <100> zone lines. Thus FIM provides clear experimental evidence that kinks are more reactive than steps in the catalytic NO + H₂ reaction. Pt surface oxidation occurs and has probably been underestimated in previous FIM studies.