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Xiaorong Zhao Hongjin Zhu Peizhong Shi Chunpeng Ge Xiufang Qian Honghui Fan Zhongjun Fu 《计算机、材料和连续体(英文)》2019,60(1):133-145
With the rapid development of ultra-wideband communications, the design requirements of CMOS radio frequency integrated circuits have become increasingly high. Ultra-wideband (UWB) low noise amplifiers are a key component of the receiver front end. The paper designs a high power gain (S21) and low noise figure (NF) common gate (CG) CMOS UWB low noise amplifier (LNA) with an operating frequency range between 3.1 GHz and 10.6 GHz. The circuit is designed by TSMC 0.13 μm RF CMOS technology. In order to achieve high gain and flat gain as well as low noise figure, the circuit uses many technologies. To improve the input impedance matching at low frequencies, the circuit uses the proposed T-match input network. To decrease the total dissipation, the circuit employs current reused technique. The circuit uses he noise cancelling technique to decreases the NF. The simulation results show a flat S21>20.81 dB, the reverse isolation (S12) less than -48.929 dB, NF less than 2.617 dB, the minimum noise figure (NFmin)=1.721 dB, the input return loss (S11) and output return loss (S22) are both less than -14.933 dB over the frequency range of 3.1 GHz to 10.6 GHz. The proposed UWB LNA consumes 1.548 mW without buffer from a 1.2 V power supply. 相似文献
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级联型低噪声放大器设计和优化的研究 总被引:1,自引:0,他引:1
文章详细分析了共源共栅级联型低噪声放大器的优化设计方法。文章首先简要的介绍共源共栅MOSFET低噪声放大器优化设计步骤。在此基础上,通过分析整个级联型低噪声放大器的密勒效应对优化设计的影响,进一步提出了对共栅级MOSFET的沟道宽度优化的必要性。最后,文章以一个工作于2.4GHz,0.5gm工艺的低噪声放大器设计为例,证实了前面理论分析的正确性,并根据低噪声放大器的主要设计指标给出了共源共栅结构下共栅级MOSFET的沟道宽度的优化方法。 相似文献
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This paper presents a capacitor cross-coupled gm-boosting scheme for differential implementation of common-gate transimpedance amplifier (CG-TIA). A differential transimpedance amplifiers (DTIA) is designed by this scheme using two modified floating-biased CG stage with improved low corner frequency. Despite conventional methods for single-ended to differential conversion that increase the power and the noise for the same gain, the new DTIA gives a higher gain and hence reduces the input-referred noise power. Design of the DTIA circuit using 0.13 μm CMOS technology illustrates near 1.7 dB improvement in the circuit sensitivity and 5.2 dB enhancement in transimpedance gain compared to its single-ended counterpart. Operation at very low frequencies and stable dc coupling to photodiode are other features of the proposed DTIA. 相似文献
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