镀铜石墨粉的制备研究

表面镀铜的非金属材料是当前功能材料开发的一个热点.利用化学镀的方法在石墨粉的表面进行化学镀铜,通过对化学镀铜沉积速度和镀层表面形貌进行分析,探讨了如何获得表面包覆良好的镀层.石墨粉表面化学镀铜工艺可以分为表面预处理、化学镀和性能测试三大步骤.研究重点放在化学镀施镀步骤上,对化学镀铜的影响因素进行了研究,得出最佳的镀铜工艺配方,并将此配方应用于实际,得到了色泽光亮、分散性好的石墨镀铜粉.     

非均匀沉淀法制备Cu包覆ZrW2O8复合粉体的研究

通过分部固相法制备ZrW2O8粉体。以ZrW2O8、CuSO4·5H2O（分析纯）和无水Na2CO3（分析纯）为原料，采用非均匀沉淀法制备了Cu包覆ZrW2O8复合粉体，并利用XRD、SEM、EDS测试手段，分析包覆粉的物相和形貌，研究了反应液浓度、表面活性剂、反应液滴加速度等反应条件对包覆效果的影响。研究表明：通过非均匀沉淀法可以制备Cu包覆ZrW2O8复合粉体，其关键是控制反应液的浓度和滴加速度，同时，不同分子量的表面活性剂对包覆前驱体的分散性影响很大．     

化学镀铜聚酯微粉的表面形态和导电性能

通过化学镀方法,制备了一种镀铜的聚酯微米级粉体,利用X射线衍射仪和热台光学显微镜对其表面成分和形貌进行了研究,该粉体在25℃~300℃内具有较好的热稳定性。将镀铜聚酯微粉与环氧树脂共混制备导电胶,其导电性能测试结果表明,用硬脂酸包覆处理的镀铜聚酯粉体抗氧化性好,添加质量分数为50%的硬脂酸处理镀铜聚酯微粉制备的导电胶体积电阻率为1.6×10-3Ω.cm,在25℃~120℃之内其体积电阻率变化在20%以下,是一种较好的常温导电填料。     

A study on the bactericidal properties of Cu-coated carbon nanotubes

A Cu layer was coated on carbon nanotubes (CNTs) by ion beam-assisted deposition (IBAD). Standard agar dilution method was used to evaluate the bactericidal rate against E. coli and S. aureus bacteria. The structure and chemical states of the Cu-coated CNTs were investigated by scanning electron microscopy (SEM) and X-ray photoelectron spectroscopy (XPS). The results show that the Cu-coated CNTs possess a very high bactericidal rate. In comparison with the Cu-coated pyrolytic carbon sample, the Cu-coated CNTs show much stronger bactericidal property.     

激光熔覆Cu包SiCp/Ni35覆层组织及磨损性能

目的研究Cu包SiC_p/Ni35激光熔覆层的显微组织、物相及其在25℃和600℃下的摩擦机理。方法采用化学镀的方法在SiC_p表面包覆一层Cu,并用激光熔覆的方法在H13钢表面制备了Cu包SiC_p增强Ni35熔覆层。用XRD、OM、SEM和EDS对熔覆层的物相、组织和成分进行了分析,用显微硬度计测试了熔覆层的显微硬度,用高温磨损试验机测试了熔覆层在常温、高温下的耐磨性能。结果熔覆层由基相γ-Ni(Fe)固溶体、增强相M7C3以及硼化物、硅化物和石墨构成。熔覆层的显微硬度和常温摩擦性能较H13钢显著提高,而其高温摩擦性能较H13钢基体提高较少。结论 SiC_p化学包覆Cu能减缓激光熔覆过程中SiC_p的分解,但分解速度还是过快。常温磨损时,高硬度碳化物和硅化物的覆层提高了材料的耐磨性能。高温下模具钢表面形成致密的氧化物薄膜,起到减磨降摩的作用,而高温下覆层无法形成致密氧化膜,导致其耐磨性能弱于常温。     

Solid State Reaction Preparation of LiFePO4/（C ＋ Cu） Cathode Material and Its Electrochemical Performance

Cu-C co-coated LiFePO4 （LiFePO4/（C ＋ Cu）） cathode material was successfully prepared through solid state reduction reaction. The optimized additive amount of CuO was determined by electrochemical test of series content-dependent samples. Electrochemical performances of LiFePO4/（C ＋ Cu） cathode material were investigated. Crystalline structure, morphology and electrochemical performance of the samples were characterized by X-ray diffraction, scanning electron microscopy （SEM）, transmission electron microscopy （TEM）, energy dispersive spectroscopy （EDS）, charge-discharge tests and AC impedance techniques. Results showed that crystal structure of the bulk material was not destroyed after Cu particles distributed on the surface of LiFePO4/C. With 5 wt% CuO additive, the LiFePO4/（C ＋ Cu） cathode material showed improved electrochemical performance especially at high rates and low temperature. At 25 ℃ and 0.1 C current rate, specific capacity of the Cu-coated sample reaches 161.3 mA h/g. The result was 47 mA h/g higher than that of the un-coated one. At -20 ℃, the discharge capacity of Cu-coated materials was 113.4 mA h/g at 0.1 C rate and 83.8 mA h/g at 5 C rate, which reached about 70% of that at room temperature, respectively.     

简化预处理辅助化学镀制备Cu包覆TiC复合粉末

研究了一种简化预处理辅助化学镀工艺制备Cu包覆TiC复合粉末.利用场发射扫描电子显微镜和能谱仪分析了原始TiC粉末,预处理之后的TiC粉末,Cu包覆TiC复合粉末的表面形貌和成分,同时也阐述了Cu镀层的生长机理.结果表明,经过简化预处理之后的TiC出现了很多表面缺陷,Cu能够均匀的包覆在TiC颗粒表面.其生长机理如下:经过预处理之后的TiC出现很多表面缺陷,成为化学镀过程中的活性点;化学镀过程中,Cu在TiC表面的各个缺陷处形核长大;Cu与Cu之间相互接触相互作用形成密集的网状结构最终形成致密的Cu镀层.