共面波导有限金属厚度效应的研究

用保角变换法对共面波导金属厚度效应进行了理论分析，编制了相应的计算机程序，给出了数值解，并对此进行了多元曲线拟合，导出了考虑金属厚度后的形状比k、有效介电常数、特征阻抗、损耗的闭定表达式。用此修正表达式求得特征阻抗及损耗的数值解，并与K．C．格普塔的修正值及实验测量值进行了详细比较，结果表明此修正公式与实验值相符较好。     

Probing nanomechanical properties of nickel coated bacteria by nanoindentation

As a powerful method for the study of mechanical properties at micro-/nanoscale, nanoindentation was applied to measure the hardness and elastic modulus of bacteria-templated metallic nanomaterials for the first time. Based on the morphological characterization by Atomic Force Microscopy (AFM) and Transmission Electron Microscopy (TEM), nanoindentation testing results showed that after coating with nickel via electroless chemical plating, the elastic modulus and hardness of bacterial cells were increased about 17 times and 50 times, respectively, indicating a great improvement in mechanical properties. This study would lay a forceful mechanical foundation for a better and general understanding of this kind of biotemplated metallic nanomaterials, which showed potential applications in nanoelectronics, nanomagnetism and nanomechanics.     

A novel technique for fabrication of metallic structures on polyimide by selective electroless copper plating using ion implantation

The successful use of palladium ion implantation into polyimide to seed an electroless plated film of copper on the polyimide surface is reported. Polyimide (Hitachi PIX 3400) was implanted with palladium ions to doses of 1.5 × 10¹⁵ − 1.2 × 10¹⁷ ions cm⁻² using a MEVVA ion implanter. The implanted ions acted as sites for nucleation of copper film. A copper film was then deposited on implanted polyimide using a commercial electroless plating solution. The ion energy was kept low enough to facilitate a low critical ‘seed’ threshold dose that was measured to be 3.6× 10¹⁶ Pd ions cm⁻². Test patterns were made using polyimide to study the adaptability of this technique to form thick structures. Plated films were studied with optical microscopy, Rutherford Backscattering Spectrometry (RBS) and Profilometry. The adhesion of films was qualitatively assessed by a ‘scotch tape test’. The film growth (thickness) was observed to be linear with plating time. A higher implantation dose led to greater plating rates. The adhesion was found to improve with increasing dose.     

Stretchable Gold Tracks on Flat Polydimethylsiloxane (PDMS) Rubber Substrate

A process to fabricate stretchable gold tracks on silicone rubber substrates is studied by XPS, static water contact angle measurement, AFM, and SEM. The process involves several steps: removing uncured oligomers by hexane Soxhlet extraction; pre-stretching the substrate; activating the strained silicone surface by an oxygen plasma treatment; coating the strained substrate with 5 nm titanium and 80 nm gold layers; and finally releasing the sample. The plasma treatment creates a thin brittle silica-like layer that temporarily increases the substrate's surface energy. Indeed, the plasma treatment is followed by a hydrophobic recovery. As a consequence, the delay between plasma treatment and metal deposition has to be reduced as much as possible. The silica-like layer can be nicely observed after release. The entire process allows us to obtain stretchable metallized samples that remain conductive even after an excessive deformation leading to electrical failure.     

Surface Preparation of Aluminum Nitride for Metallization: Effect of Temperature on Surface Reactivity

The current aqueous cleaning step in the surface preparation of aluminum nitride (AlN) prior to metallization causes performance and reliability issues for the substrates used for microelectronic packaging due to surface reactions. These issues limit the use of AlN and its replacing of BeO, an environmentally hazardous material currently used. The aim of this investigation was to determine the effects of different solutions on the surface of AlN substrates under varying conditions at times up to 2419.2 ks (28 days). Concentration of the solutions, temperature, and immersion time were varied for the AlN samples in the solutions. Both elevated temperatures (50°C and 90°C) and low temperatures (5°C) were investigated.

Four general types of behavior were observed: minor changes in average surface roughness and microstructure, linear change in average surface roughness and pitted grains, nonlinear change in average surface roughness and product formation on AlN surface, and miscellaneous change in average surface roughness with surface product formation.

The surface roughening kinetics were very complex due to changes in both the reaction product morphology and reaction mechanism with temperature, solvent, and pH for a specific solvent. Minor changes in average surface roughness and microstructure were observed for HCl pH = 5, H₂ SO₄ pH = 5, NaOH pH = 8, NaOH pH = 10, NaOH pH = 12, deionized water and Alfred tap water at 5°C, HCl pH = 3 and oleic acid at 50°C and citric acid and oleic acid at 90°C. Linear changes in average surface roughness and pitted grains were observed for HCl pH = 2 and H₂SO₄ pH = 3 at 50°C and HCl pH = 2, H₂SO₄ pH = 3, and deionized water at 90°C. Non-linear change in average surface roughness and product formation on AlN surface was observed for HCl pH = 5, NaOH pH = 8 and Alfred tap water at 50°C and HCl pH = 5 and H₂SO₄ pH = 2 at 90°C. Miscellaneous changes in average surface roughness with surface product formation were observed for H₂SO₄ pH = 2, H₂SO₄ pH = 5, NaOH pH = 10, NaOH pH = 12, citric acid, Micro-90 and deionized water at 50°C and HCl pH = 3, H₂SO₄ pH = 5, NaOH pH = 8, NaOH pH = 10, NaOH pH = 12, Micro-90 and Alfred tap water at 90°C.     

Microstructural evolution during the brazing of Al2O3 ceramic to kovar alloy by sputtering Ti/Mo films on the ceramic surface

Alumina (Al₂O₃) ceramics were metallized by magnetron sputtering Ti/Mo bilayer films on the surface with a subsequent high temperature sintering and were brazed to Kovar alloy (Fe-Ni-Co) using Ag-Cu eutectic alloy. The Ti/Mo metallization film and the brazing seam microstructures were investigated and the correlation between the Al₂O₃/Kovar joining strength and the microstructures of the brazing seam was discussed. The results show that the joining strength is related to the thickness of the Ti/Mo adhension layer which depends on the holding time during brazing. The mutual diffusion of the elements at the interface firstly increases the thickness of the adhension layer as the holding time increases and the Mo film acts as a barrier layer to block the diffusion of Ti atoms into the seam. The optimal brazing joining strength of 72.6±5.0 MPa could be achieved at a brazing temperature of 810 °C for 14 min However, if the holding time is further prolonged, Mo atoms will diffuse into the (Ni, Cu) solid solution, resulting in the diffusion of Ti atoms and the adhension layer becoming indistinguishable. Therefore, the intermetallic Ni₃Ti forms in the seam and the titanium oxide changes from TiO to Ti₂O₃ or Ti₃O₅, which leads to the joint strength decreasing.     

利用原料1生产金属化阳极板试验研究

本文介绍了利用原料1在合金硫化炉进行金属化阳极板试验的过程。通过在合金硫化炉中进行原料1硫化、吹炼等试验过程,达到提镍降硫的目的。并在试验过程中摸索出了生产金属化阳极板的关键参数,同时对金属化阳极板中化学成分、镍直收率、钴直收率等关键指标进行了分析,为金属化阳极板的工业化生产提供了理论依据。     

碳化硅肖特基器件多层金属化技术研究

碳化硅作为近年来迅速发展起来的一种宽禁带半导体材料,具有宽禁带、高击穿电场、高载流子饱和漂移速率、高热导率、高功率密度等优点,是制备大功率、高温、高频器件的理想材料.欧姆接触的实现是碳化硅器件制造工艺的关键.为保证欧姆接触的低接触电阻和高稳定性,基于对碳化硅材料金属化技术的理论分析,进行大量工艺实验,调整工艺参数,并进...     

金属化竹纤维的8mm微波干扰性能研究

为研制一种轻质毫米波干扰材料,试验以化学镀的方式对竹纤维进行表面金属化改性(镀覆的金属为铜和镍);并检测了金属化竹纤维的8mm波衰减性能.测试结果显示金属化竹纤维的8mm波衰减性能较好:20mg镀铜竹纤维可衰减17.5dB,30mg镀镍竹纤维可衰减24.2dB.化学镀工艺对金属化竹纤维的衰减性能有一定影响,在相同工艺下所制备试样的8mm波衰减分贝值随测试用量的增加而增加.试验结果表明金属化竹纤维可望成为一种新型毫米波干扰材料.     

某高铁铝土矿石铝铁分离试验

大量高铁铝土矿因氧化铁含量高、矿物嵌布关系复杂而处于待开发状态。为确定四川某高铁铝土矿的高效开发利用方案,对还原焙烧—弱磁选提铁—铝溶出的铝铁高效分离回收工艺中主要影响因素——焙烧制度、焙烧产物磨矿细度及弱磁选磁场强度进行了单因素条件试验。结果表明,在还原焙烧试样粒度为0.18~0 mm、配碳系数为2.0、焙烧温度为1 350℃、焙烧时间为20 min、焙烧产物磨矿细度为-0.074 mm占91%、弱磁选磁场强度为60kA/m情况下,可取得铁品位为89.83%、铁回收率为84.08%的金属铁粉,Al2O3浸出率为69.35%,较好地实现了铝、铁分离。