Fabrication and joining mechanism of Nano-Cu/Si3N4 ceramic substrates

A novel method for fabricating a nano-Cu/Si₃N₄ ceramic substrate is proposed. The nano-Cu/Si₃N₄ ceramic substrate is first fabricated using spark plasma sintering (SPS) with the addition of nanoscale multilayer films (Ti/TiN/Ti/TiN/Ti) as transition layers. The microstructures of the nano-Cu metal layer and the interface between Cu and Si₃N₄ are investigated. The results show that a higher SPS temperature increases the grain size of the nano-Cu metal layer and affects the hardness. The microstructure of the transition layer evolves significantly after SPS. Ti in the transition layer can react with Si₃N₄ and with nano-Cu to form interfacial reaction layers of TiN and Ti–Cu, respectively; these ensure stronger bonding between nano-Cu and Si₃N₄. Higher SPS temperatures improve the diffusion ability of Ti and Cu, inducing the formation of Ti₃Cu₃O compounds in the nano-Cu metal layer and Ti₂Cu in the transition layer. This study provides an important strategy for designing and constructing a new type of ceramic substrate.     

Remarkably enhanced energy storage properties of lead-free Ba0.53Sr0.47TiO3 thin films capacitors by optimizing bottom electrode thickness

The lead-free Ba_0.53Sr_0.47TiO₃ (BST) thin films buffered with La_0.67Sr_0.33MnO₃ (LSMO) bottom electrode of different thicknesses were fabricated by pulsed laser deposition method on a (001) SrTiO₃ substrate. It was found that the roughness of electrode decreases and substrate stress relaxes gradually with the increase of LSMO thickness, which is beneficial for weakening local high electric field and achieving higher E_b. Therefore, the recoverable energy density (W_rec) of BST films can be greatly improved up to 67.3 %, that is, from 30.6 J/cm³ for the LSMO thickness of 30 nm up to 51.2 J/cm³ for the LSMO thickness of 140 nm after optimizing the LSMO thickness. Furthermore, the thin film capacitor with a 140 nm LSMO bottom electrode shows an outstanding thermal stability from 20 °C to 160 °C and superior fatigue resistance after 10⁸ electrical cycles with only a slightly decrease of W_rec below 1.6 % and 3.7 %, respectively. Our work demonstrates that optimizing bottom electrodes thickness is a promising way for enhancing energy storage properties of thin-film capacitors.     

Graphene added multilayer ceramic sandwich (GMCS) composites: Structure,preparation and properties

The multilayer ceramic composites (MLC) consist of two ceramic materials insoluble in each other and sequentially piled in a symmetric manner whereas they can be divided into two groups: multilayer composites with weak interfaces and composites with strong interfaces. The graphene added multilayer ceramic sandwich (GMCS) composite was developed. The multilayer stack of Si₃N₄ with 5 and 30 wt% graphene addition were stratified in sandwich structure. So formed multilayer stacks with 5 and 7 layers were sintered by hot issostatic pressing (HIP). The homogenity of graphene addition, the effect of layered structures and the position of layers with lower and higher graphene content on the final properties were studied.     

A facile co-solvent strategy for preparation of graphene nanoplatelet powder: An industrially viable innovative approach

We report an industrially viable promising approach to produce micrometer-sized multilayer graphene nanoplatelet powder (MGNP) in a scalable quantity via microwave-assisted exfoliation of graphite (MEG) and fragmented into MGNP through liquid-phase exfoliation in the co-solvent mixture by kitchen mixer (KM). KM allows rapid delaminating MEG into MGNP by shear force dominated exfoliation. Majority of MGNPs are with a diameter of few micrometers and thickness is in nanometers. MGNP are crystalline with very limited defects was confirmed by Raman measurements and transmission electron microscopy. This process transforms, more than 86% of graphite flakes into MGNP. This advanced approach opens a new pathway to produce MGNP in bulk quantity as it is feasible, rapid, and cost-effective.     

固体铝电解电容器用导电高分子制备工艺进展

依据近年的相关专利,综述了用于固体铝电解电容器的导电高分子的最新制备工艺,介绍了导电高分子固体铝电解电容器的结构,详细描述了制备导电高分子的两种主要方法——化学聚合和电化学聚合——及其进展历程。介绍了新颖掺杂剂的发现与使用,对各种工艺的特点进行了评述。     

超高压大容量铝电解电容器的研制

分析了大功率设备用超高压大容量铝电解电容器的特点,通过研制工作电解液、制订制作工艺及零部件设计方案,研制出的超高压大容量铝电解电容器具有损耗角正切小(tgδ为0.25)、承受纹波电流能力强(100 Hz,2.12～27.8 A)及寿命长的特点,耐久性达到85℃,5 000 h。     

Integrated Survivability Strategies of IP／GMPLS／Opticai Multi——layer Network

In last decade,due to that the popularity of the internet, data--central traffic kept growing, some emerging networking requirements have been posed on the today‘s telecommunication networks,especially in the area of network survivability. Obviously, as a key networking problem, network reliability will be more and more important. The integration of different technologies such as ATM, SDH, and WDM in multilayer transport networks raises many questions regarding the coordination of the individual network layers.This problem is referred as multilayer network survivability. The integrated multilayer network survivability is investingated as well as the representation of an interworking strategy between different single layer survivability schemes in IP via generalized multiprotocol label switching over ootical netwnrk     

Formation of layered structure on bismuth-borate glass surface

X-ray diffraction analysis shows that the transformation during heat treatment from amorphous to crystalline phases of bismuth-borate glass samples takes place in sequences. After a short heat treatment, 5 min at 550 °C, a layered structure with a preferred orientation of crystallites on the surface is observed. After a long heat treatment, 8 h at the same temperature, normal polycrystalline bulk samples are obtained.     

A XRD study of Co/Au multilayers using a laboratory microdiffractometer

In this paper we show that by the analysis of 2D images collected with a laboratory X-ray microdiffractometer it is possible to non-destructively evaluate the structure, the microstructure, and the preferred orientation of films. In particular, the structural analysis of Co/Au multilayers on Si(1 0 0) deposited at different Ar pressures are reported and discussed.     

提高超小型铝电解电容器生产一次合格率

恰当选择原材料、确保铆接工序质量、重视工作电解液的配比、严控各工序成品率是提高超小型铝电解电容器投入产出一次合格率的关键。以１０Ｖ－４７μＦ（４ｍｍ×７ｍｍ）产品为例，投入产出一次合格率达９４％以上。