Growth of sculptured polymer submicronwire assemblies by vapor deposition

We have grown helical nanowire assemblies of parylene C, thereby demonstrating that polymeric sculptured thin films (STFs) can be fabricated by a combination of physical and chemical vapor deposition processes. The deposition method is explained in detail and electron micrographs of 200-400 nm size sculptured thin film of parylene are given. The shapes of the submicron and nanowire assemblies can be engineered so that the polymeric STF acts as a template for preferential attachment of biomolecules.     

沉积压力对Parylene C膜性能的影响

采用X射线衍射(XRD),MOCON透湿仪等研究了不同沉积压力下制备ParyleneC膜的结晶度、水蒸汽透过性、拉伸强度、雾度、透明度随沉积压力的变化规律.结果表明,随着沉积室压力升高,Parylee C膜相对结晶度、透湿性能、拉伸强度、透明度下降,雾度增大.     

两种复合涂层性能的对比研究

用磁控溅射离子镀在试件上先镀一层铝镀层，再真空气相化学沉积一层Parylene（聚对二甲苯）聚合物，与在试件上先真空气相化学沉积一层Parylene聚合物，再磁控溅射离子镀一层铝镀层，两种方法制备出铝加Pary—lene和Parylene加铝的两种复合涂层。本文对这两种复合涂层划痕、磨损实验进行了研究，并运用EDX、SEM形貌等方法进行了复合涂层特性对比分析。得出铝加Parylen和Parylen加铝复合涂层都有低的透湿性，但前种复合涂层较后种复合涂层有较强的防腐、耐磨性和自润滑性能。     

光氧老化的Parylene C膜结构研究

计算了8类不同Parylene C膜光氧老化产物的几何构型、电子结构以及键离解能,并通过热重(TG)和热裂解气相色谱/质谱(PGC/MS)等手段研究了老化样品的热解过程和热解产物.计算结果和实验数据显示,主链上的CH2-CH2链节为整个体系中的薄弱环节,氧化后该链节变得更不稳定,而且氧化后Parylene C膜主链上生成了-OH等含氧基团.     

Organic light emitting devices performance improvement by inserting thin parylene layer

An organic light emitting device (OLED) structure with a thin parylene layer deposited by low-temperature chemical vapour deposition (CVD) at the anode–organic interface was fabricated. Such a structure gives off higher efficiency, a smaller number and smaller size dark non-emissive areas, slower growth rate of the dark areas and a longer device lifetime compared to one without the parylene layer. The parylene modified indium tin oxide (ITO) surface shows an increased work-function and a reduced surface roughness compared to that of the bare ITO surface. The interface optimisation contributes to the device performance improvement.     

Parylene涂覆材料及其应用

介绍了一种热塑性高分子材料派瑞林(Parylene)。首先介绍了不同型号材料的分子结构和Parylene的涂覆过程;接着对其特性进行了较全面阐述,该材料具有良好的物理和机械性能,具有低摩擦系数、优良的耐溶剂性能和耐酸碱特性等突出特点,并将其综合性能和其他常用涂层性能进行了比较。介绍了Parylene涂层在MEMS领域、电子行业、医疗器械以及文物保护方面的应用,及其在微电子领域的应用前景。     

Preparation and properties of thin parylene layers as the gate dielectrics for organic field effect transistors

We report on the fabrication and characterization of parylene C thin layers for organic electronic devices passivation and gate dielectric of organic field effect transistors (OFETs) development. The investigated thin parylene layers were deposited from the vapour phase in thickness ranging from 3 to 800 nm at room temperature. The thickness and surface morphology of parylene layers were characterized by ellipsometry and AFM technique. The quality of parylene structures were analysed by X-ray reflectivity and diffraction as well as micro-Raman spectroscopy. The measurements confirmed perfect homogeneity and structural properties of parylene layers. Two types of pentacene OFETs were prepared on the silicone dioxide and parylene surface with bottom contact structures. The results demonstrated that using parylene, as the gate dielectric layer is an effective method to fabricate OFETs with improved electric characteristics.     

Parylene coatings on stainless steel 316L surface for medical applications — Mechanical and protective properties

The mechanical and protective properties of parylene N and C coatings (2-20 μm) on stainless steel 316L implant materials were investigated. The coatings were characterized by scanning electron and confocal microscopes, microindentation and scratch tests, whereas their protective properties were evaluated in terms of quenching metal ion release from stainless steel to simulated body fluid (Hanks solution). The obtained results revealed that for parylene C coatings, the critical load for initial cracks is 3-5 times higher and the total metal ions release is reduced 3 times more efficiently compared to parylene N. It was thus concluded that parylene C exhibits superior mechanical and protective properties for application as a micrometer coating material for stainless steel implants.     

硅烷偶联剂KH550对Parylene C膜与金属铝基体结合强度的影响

采用拉开法分析了KH550(γ-氨丙基三乙氧基硅烷)偶联剂浓度对Parylene C膜与金属铝基体间结合强度的影响,采用拉曼光谱(Raman)和红外光谱(FT-IR)分析了偶联剂在膜和基体间的作用机理。研究结果表明,使用10%的KH550偶联剂可提高Parylene C膜与铝基体的结合强度到7.5MPa。其增强作用机理为KH550偶联剂的烷氧基团水解后,-Si-OH与基体的Al-O键发生化学作用生成-Si-O-Al键,-NH2能与Parylene C膜分子间形成氢键,从而使Parylene C膜与金属铝之间产生化学键桥连。     

镁合金抗腐蚀复合表面处理工艺技术

镁合金由于具有优良的性能而广泛应用于航空、航天、兵器、汽车、电子等领域的结构件中,是武器装备减重的理想材料,但其较差的抗腐蚀性能又使其推广应用受到限制.根据镁合金的腐蚀类型及原理,提出了阳极氧化与派拉纶(Parylene C)的表面处理复合工艺途径和方法,并对工艺制备样品进行了测定.结果表明:采用阳极氧化与派拉纶的复合工艺技术,可提高其耐蚀性,耐盐雾能力达到48 h,满足军用电子产品环境适应性要求.