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1.
The probing of the micromechanical properties within a two‐dimensional polymer structure with sixfold symmetry fabricated via interference lithography reveals a nonuniform spatial distribution in the elastic modulus “imprinted” with an interference pattern in work reported by Tsukruk, Thomas, and co‐workers on p. 1324. The image prepared by M. Lemieux and T. Gorishnyy shows how the interference pattern is formed by three laser beams and is transferred to the solid polymer structure. The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern.  相似文献   
2.
The 193 nm photochemistry of (aminoethylaminomethyl)phenethylsiloxane (PEDA) self‐assembled monolayers (SAMs) under ambient conditions is described. The primary photodegradation pathways at low exposure doses (< 100 mJ cm–2) are benzylic C–N bond cleavage (ca. 68 %), with oxidation of the benzyl C to the aldehyde, and Si–C bond cleavage (ca. 32 %). Amine‐containing photoproducts released from the SAM during exposure remain physisorbed on the surface, where they undergo secondary photolysis leading to their complete degradation and removal after ca. 1200 mJ cm–2. NaCl(aq) post‐exposure rinsing removes the physisorbed materials, showing that degradation of the original PEDA species (leaving Si–OH) is substantially complete after ca. 450 mJ cm–2. Consequently, patterned, rinsed PEDA SAMs function as efficient templates for fabrication of high‐resolution, negative‐tone, electroless metal and DNA features with good selectivity at low dose (i.e., ca. 400 mJ cm–2) via materials grafting to the intact amines remaining in the unirradiated PEDA SAM regions.  相似文献   
3.
Integrated optical sensor chips suitable for high-resolution pH measurements are presented. The pH-sensitive swelling of a polymer membrane is detected by refractometry using a compact multi-channel sensor module. The signal transduction is achieved by means of chirped grating couplers which allow simple yet high functionality sensor modules to be built. The experiments have been performed with high sensitivity replicated polycarbonate TiO2 waveguide sensor chips coated with an ultrathin photopatterned hydrogel membrane having functional groups which reversibly change from the neutral state to a charged state upon acidification. A resolution δpH <±1.1×10−4 in terms of the pH (at pH 7.5) has been obtained in a dual-channel module with size 10×10×10 cm3.  相似文献   
4.
An epoxy‐based negative‐tone photoresist, which is known as a suitable material for high‐aspect‐ratio surface micromachining, is functionalized with red‐light‐emitting CdSe@ZnS nanocrystals (NCs). The proper selection of a common solvent for the NCs and the resist is found to be critical for the efficient incorporation of the NCs in the epoxy matrix. The NC‐modified resist can be patterned by standard UV lithography down to micrometer‐scale resolution, and high‐aspect‐ratio structures have been successfully fabricated on a 100 mm scaled wafer. The “as‐fabricated”, 3D, epoxy‐based surface microstructures show the characteristic luminescent properties of the embedded NCs, as verified by fluorescence microscopy. This issue demonstrates that the NC emission properties can be conveniently conveyed into the polymer matrix without deteriorating the lithographic performance of the latter. The dimensions, the resolution, and the surface morphology of the NC‐modified‐epoxy microstructures exhibit only minor deviations with respect to that of the unmodified reference material, as examined by means of microscopic and metrologic investigations. The proposed approach of the incorporation of emitting and non‐bleachable NCs into a photoresist opens novel routes for surface patterning of integrated microsystems with inherent photonic functionality at the micro‐ and nanometer‐scale for light sensing and emitting applications.  相似文献   
5.
Photosensitivity, as evident in permanent changes in refractive index and volume upon light exposure, is observed in a germanium‐doped methacrylate hybrid material (hybrimer) and found to depend on the wavelength of the UV light. Exposure to short‐wavelength UV illumination (220–260 nm) results in very high photosensitivity with changes in refractive index (Δn ≈ 0.0164) and film thickness (Δt ≈ –40 %) that are mainly a result of photopolymerization and Ge‐related densification. In contrast, the hybrimer is hardly photosensitive to light in the long UV‐wavelength range (350–390 nm). Direct photopatterning of a single circle on the hybrimer film creates a concave lens‐like topography upon illumination with UV light of short wavelength and a convex lens‐like one upon illumination with UV light of long wavelength.  相似文献   
6.
Naphthalene (Nap)-containing poly(diphenylacetylene)s with different spacer lengths (-{C6H5CC[C6H4O(CH2)mO-Nap]}n-; P1(m), m = 4, 6, 8) are synthesized. The monomers are prepared by etherifications of 1,m-dibromoalkanes with 1-naphthol and 1-(4-hydroxy)phenyl-2-phenylacetylene and are polymerized by TaCl5-n-Bu4Sn and WCl6-Ph4Sn catalysts. Whereas the tantalum-based catalyst gives insoluble products in low yields, the tungsten-based catalyst furnishes soluble polymers with high molecular weights (Mw up to 5.0 × 104) in satisfactory yields (up to 62%). The structures and properties of the polymers are characterized and evaluated by IR, NMR, TGA, UV, PL, and EL analyses. All the polymers are thermally stable: while the polymers lose 5% of their weights at ∼420 °C under nitrogen, no decreases in molecular weights are found after they have been annealed at 200 °C for 2 h in air. When their THF solutions are photoexcited, the polymers emit strong green lights with high efficiencies (up to 98%). No significant shifts in the photoluminescence spectra are observed when the polymers are cast into thin solid films, suggestive of little involvement of aggregative or excimeric emission. A multilayer EL device with a configuration of ITO/P1(8):PVK/BCP/Alq3/LiF/Al is constructed, which emits a green light of 520 nm with a maximum external quantum efficiency of 0.16%. The spectral stability is outstanding: no recognizable change is observed in the EL spectrum when the device current is raised. Irradiation of a film of P1(8) through a mask photooxidizes and quenches the emission of the exposed regions, resulting in the formation of two-dimensional luminescent photopatterns.  相似文献   
7.
The elastic and plastic properties within a two‐dimensional polymer (SU8) structure with sixfold symmetry fabricated via interference lithography are presented. There is a nonuniform spatial distribution in the elastic modulus, with a higher elastic modulus obtained for nodes (brightest regions in the laser interference pattern) and a lower elastic modulus for beams (darkest regions in the laser interference pattern) of the photopatterned films. We suggest that such a nonuniformity and unusual plastic behavior are related to the variable material properties “imprinted” by the interference pattern.  相似文献   
8.
In order to modify the output characteristics of organic light‐emitting devices (OLEDs), the optical properties of an active layer within the device are patterned without introducing any thickness modulation. For this purpose a new conjugated copolymer, which serves as a hole‐transporting material and at the same time can be index patterned using UV techniques, is synthesized. Poly(VC‐co‐VBT) (VC: N‐vinylcarbazole; VBT: 4‐vinylbenzyl thiocyanate) is prepared by free‐radical copolymerization of VC and VBT. The material contains photoreactive thiocyanate groups that enable altering of the material's refractive index under UV illumination. This copolymer is employed as a patternable hole‐transporting layer in multilayer OLEDs. Refractive‐index gratings in poly(VC‐co‐VBT) are inscribed using a holographic setup based upon a Lloyd mirror configuration. The fourth harmonic of a Nd:YAG (YAG: yttrium aluminum garnet) laser (266 nm) serves as the UV source. In this way 1D photonic structures are integrated in an OLED containing AlQ3 (tris(8‐hydroxyquinoline) aluminum) as the emitting species. It is assured that only a periodical change of the refractive index (Δn = 0.006 at λ = 540 nm) is generated in the active material but no surface‐relief gratings are generated. The patterned devices show more forward‐directed out‐coupling behavior than unstructured devices (increase in luminosity by a factor of five for a perpendicular viewing direction). This effect is most likely due to Bragg scattering. For these multilayer structures, optimum outcoupling was observed for grating periods Λ ~ 390 nm.  相似文献   
9.
Heterostructured polymer Langmuir-Blodgett (LB) film prepared by using poly(N-dodecylacrylamide-co-t-butyl 4-vinylphenyl carbonate) (p(DDA-tBVPC53)) and poly(N-neopentyl methacrylamide-co-9-anthrylmethyl methacrylate) (p(nPMA-AMMA10)) polymer LB films which can act as photogenerator layers were investigated. Patterns with a resolution of 0.75 μm were obtained on heterostructured polymer LB films composed of 4 layers of p(nPMA-AMMA10) LB film (top layers) and 40 layers of p(DDA-tBVPC53) LB film (under layers) on a silicon wafer by deep UV irradiation followed by development with 1% tetramethylammonium hydroxide aqueous solution. The sensitivity of the heterostructured polymer LB films was improved without loss of the resolution compared with p(DDA-tBVPC53) LB film. The etch resistance of the heterostructured polymer LB films was sufficiently good to allow patterning of a copper film suitable for photomask fabrication.  相似文献   
10.
在焊点间距和焊球尺寸进一步微型化、芯片面积进一步增大趋势的推动下,器件的可靠性也正在被推向尽头。以致不采用应力缓冲再分布层就越来越难以保障可靠性的实现。因此,提供一种即具有高性能又便于工艺加工的单一材料便成为材料供货商的追求目标。在封装领域所期盼的这些要求中,DowCorningCorp.正在开发一族可制做图形的硅酮基材料。这族材料由一系列的旋涂型光学作图材料以及第二系列的丝网印刷材料组成。此材料除了具有封装用途的性质之外,还具有类似的低潮湿摄取、高温稳定性、良好的电气性能及对普通材料的最佳附着力。  相似文献   
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