Understanding silica-supported metal catalysts: Pd/silica as a case study

Supported metal catalysts, particularly noble metals supported on SiO₂, have attracted considerable attention due to the importance of the silica–metal interface in heterogeneous catalysis and in electronic device fabrication. Several important issues, e.g., the stability of the metal–oxide interface at working temperatures and pressures, are not well-understood. In this review, the present status of our understanding of the metal–silica interface is reviewed. Recent results of model studies in our laboratories on Pd/SiO₂/Mo(1 1 2) using LEED, AES and STM are reported. In this work, epitaxial, ultrathin, well-ordered SiO₂ films were grown on a Mo(1 1 2) substrate to circumvent complications that frequently arise from the silica–silicon interface present in silica thin films grown on silicon.     

纳米技术的研究现状与将来

纳米科学技术将成为２１世纪最重要的高技术之一。纳米技术的最终目标是直接操纵单个原子和分子，制造量子功能器件，从而开拓人类崭新的生产生活模式。文章评述利用电子束、离子束的精细技术和ＳＴＭ原子操纵技术的研究现状，介绍原子层蚀刻，单层抗蚀剂自形成蚀刻，纳米自然蚀刻和电子束全息纳米蚀刻等高技术前沿动态，展望纳米技术的发展前景。     

Surface structure of silver thin films on In2O3:Sn and Al2O 3 †

Surface structure of thin silver films (200 Å) on two technologically important films, indium tin oxide (ITO) and aluminium oxide, has been studied using scanning tunneling microscope. ITO films were prepared by reactive electron beam evaporation. Aluminium oxide films were prepared by oxidizing 2000 Å thick aluminium films evaporated on to H₂ terminated single crystal silicon substrates. The surface structure of silver on ITO and aluminium oxide appeared to be same and was characteristic of Stranski-Krastanov type. The observed asymmetry in the island shape was attributed to the anisotropic nature of the strain fields surrounding the nucleation centres.     

Prediction of evaporation heat transfer coefficient and pressure drop of refrigerant mixtures

A study on the prediction of heat transfer coefficient (HTC) and pressure drop of refrigerant mixtures is reported. HTCs and pressure drops of prospective mixtures to replace R12 and R22 are predicted on the same cooling capacity basis. Results indicate that nucleate boiling is suppressed at qualities greater than 20.0% for all mixtures and evaporation becomes the main heat transfer mechanism. For the same capacity, some mixtures containing R32 and R152a show 8.0–10.0% increase in HTCs. Some mixtures with large volatility difference exhibit as much as 55.0% reduction compared with R12 and R22, caused by mass transfer resistance and property degradation due to mixing (32.0%) and reduced mass flow rates (23.0%). Other mixtures with moderate volatility difference exhibit 20.0–30.0% degradation due mainly to reduced mass flow rates. The overall impact of heat transfer degradation, however, is insignificant if major heat transfer resistance exists in the heat transfer fluid side (air system). If the resistance in the heat transfer fluid side is of the same order of magnitude as that on the refrigerant side (water system), considerable reduction in overall HTC of up to 20% is expected. A study of the effect of uncertainties in transport properties on heat transfer shows that transport properties of liquid affect heat transfer more than other properties. Uncertainty of 10.0% in transport properties causes a change of less than 6% in heat transfer prediction.     

复合射孔枪枪身材料动态本构关系的试验研究

为确定复合射孔枪枪身材料32CrMo4钢在井下高温、高加载率工作环境下的动态性能,利用MTS试验机和分离式Hopkinson冲击压杆装置做了应变率为0.001、1000和3000/s,温度为294、373、473和573K的单轴动态压缩试验,得到32CrMo4钢各组温度及应变率下的流动应力-应变曲线。拟合得到该钢Johnson-Cook本构关系模型所需的5个参数,模型拟合曲线与试验曲线吻合。     

STM tunneling spectroscopy on high Tc superconductors

STM tunneling spectroscopy has been performed on the bulk single crystals of BiSrCaCuO (BSCCO) and the epitaxial thin films of YBaCuO (YBCO) at cryogenic temperatures. The STM images and tunneling spectra observed on the (001) surfaces can be classified into three cases; 1) Atomic image is visible. However, the tunneling spectrum shows semiconducting or smeared superconducting gap structures, depending on the tip-sample distance. 2) Clear atomic image can not be obtained. But, the tunneling spectrum shows flat bottom region with quite low zero bias conductance. 3) Tunneling spectra demonstrate gapless behavior, independent of the tip-sample separation. These observations support the quasi-2D electronic picture in whichs-wave like 2D superconducting layers are coupled with each other through the Josephson effect.     

A complete VARMA modelling methodology based on scalar components

Abstract. This article proposes an extension to scalar component methodology for the identification and estimation of VARMA models. The complete methodology determines the exact positions of all free parameters in any VARMA model with a predetermined embedded scalar component structure. This leads to an exactly identified system of equations that is estimated using full information maximum likelihood.     

节能建筑中人体传热模型和计算公式

讨论人体新陈代谢发热率及其影响因素;论述节能建筑中舒适的环境温度、空气相对湿度、空气流速以及新鲜空气供给量的最佳值范围;同时考虑皮肤和肺部的显热散热和蒸发潜热散热,建立了传热模型,得出了计算公式。     

Design of a high-pressure ebulliometer,with vapor-liquid equilibrium results for the systems CHF2 Cl + CF3 CH3 and CF3 CH2 F + CH2F2

We describe the design and operation of a new high-pressure metal ebulliometer which can operate at pressures to at least 3 MPa in the range 220–400 K. Infinite-dilution activity coefficients are presented for the system CHF₂Cl + CF₃-CH, at 275 K and for the system CF₃-CH₂F + CH₂F₂, at 260, 230, and 300 K. The Wilson activity coellicient model and a virial coefficient model are applied to these systems, and the phase equilibrium conditions are calculated. The results are shown to agree well with predicted and with published measured values. The excess enthalpy is calculated and compared with results from a Peng Robinson equation of state. Vapor densities on the dew curves are given.     

基于ENC424J600的以太网与串行接口转换技术

论述了在STM32系列的MCU上移植TCP/IP协议栈LwIP,并利用新型以太网控制器ENC424J600实现网络数据传输功能。该系统主要完成的功能是接收上位机发送的数据,并将这些数据转换成通用串行接口输出。ENC424J600是Microchip新推出的一款以太网控制器,其速度优于ENC28J60,同时为用户提供两种接口模式。本文介绍了其基于SPI接口模式下的实现过程,详细描述了该网卡驱动的硬件电路和软件流程。