斜缝与Z-pin混合增强泡沫夹层复合材料力学性能实验研究

结合斜缝合增强和Z-pin增强2种方法, 采用混合增强方法制备泡沫夹层结构, 并对这种结构材料的平压、 平拉和剪切力学性能进行了实验研究, 考察了不同混合比例对其力学性能和破坏模式的影响。结果表明, 夹层结构中, 随着Z-pin比例的增加, 压缩强度和模量增大; 随着斜缝合比例的增加, 拉伸强度、模量以及剪切强度增大; 但不同混合增强试样的剪切模量差别不大。      

X状Z-pin增强泡沫夹层结构的剪切性能

通过不同Z-pin角度(15°和25°)和夹芯厚度(8mm和12.7mm)的X状Z-pin增强泡沫夹层材料的剪切性能试验, 与相同材料同尺寸的未增强件进行对比, 考察X状Z-pin对泡沫夹层结构的增强作用。试验结果表明, X状Z-pin增强使材料的剪切强度和刚度都有较大幅度的提高; 同时, Z-pin的加入使该结构具有与传统泡沫夹层材料不同的剪切破坏形式。在此基础上, 结合空间网架结构和等效夹杂方法, 提出了X状Z-pin增强泡沫夹层结构剪切刚度模型, 计算结果与试验值符合良好。结果表明, X状Z-pin增强不仅能大幅度提高泡沫夹层结构的剪切性能, 并具有良好的可设计性, 可以通过改变Z-pin角度和材料等改变其力学性能。      

T型接头蒙皮厚度对Z-pin增强效果的影响

在关于拉脱载荷下Z-pin增强T型接头的有限元模拟方法基础上,通过对2组蒙皮厚度分别为7.2 mm和4.0 mm的试验件的试验结果进行分析,研究了T型接头蒙皮厚度对Z-pin增强效果的影响。结果表明:Z-pin增强效果随着蒙皮厚度的减小而增大。蒙皮厚度大于5 mm,Z-pin不能提高结构的最大承载能力,但可显著提高结构首次掉载后的承载性能,使T型接头在较大的加载位移下仍保持较高的承载能力;无论蒙皮厚薄,结构首次掉载后,各Z-pin增强T型接头可达到的载荷平台是相当的,且该载荷平台随蒙皮的变厚有降低的趋势。      

Experimental study on z-pin bridging law by pullout test

This paper presents an experimental study on the evaluation of bridging law for a z-pin. The relationship between the z-pin bridging force and its displacement was measured by z-pin pullout tests. The tests were carried out using three types of samples with: single small pin; 3 × 3 small-pins (three columns × three rows) and 3 × 3 big-pins. For 3 × 3 small-pins samples, a typical pullout curve with initial bonding, debonding and frictional sliding was obtained. A high peak value of the debonding force was reached before z-pin debonding started. After debonding was initiated, the pullout force dropped rapidly to a lower value, the pins were then pulled out steadily against friction. However, for samples with 3 × 3 big-pins, it was difficult to discern the peak debonding force. The major results of this study are expected to provide a better physical understanding of the mechanics and mechanisms of z-pin bridging, aside from an efficient and accurate methodology to measure the crack-bridging law.     

The strength of composite bonded T-joints transversely reinforced by carbon pins

In this paper, an improved ultrasonically assisted z-pinning (UAZ) process was adopted that uses an acrylic board with holes as a mould to hold the pins instead of a polymer foam carrier. Using the process, 29 carbon/epoxy composite T-joints with three different areal pin densities and three different pin diameters were fabricated and tested in pull-off loading. The test results show that the strength of the composite T-joints can be increased by the z-pinning technique and that it is directly related to the total contact area between the pins and the laminate. The ultimate strength of the joint with a 4.0% pin density and 0.5 mm diameter pins increased by more than 70% compared with the unpinned joints. It was also found that there was a minimum critical condition required for the pins to improve the performance of the joints. In all of the tested joints, the first crack occurred in the intersection region or at the ends of the flanges.     

X-cor夹层结构拉伸模量有限元分析

通过分析X-cor夹层结构中Z-pin端部的细观结构,提出Z-pin端部树脂区椭圆形态的基本假设并建立X-cor夹层结构拉伸模量的有限元模型,利用大型有限元软件ANSYS对其拉伸模量进行了数值计算。研究了Z-pin植入角度、直径和密度的改变对X-cor夹层结构拉伸模量的影响。结果表明:X-cor夹层结构的拉伸模量随Z-pin植入角度增加而减小,随Z-pin直径和密度增加而增加。通过有限元模型的计算,得到了X-cor夹层结构参数对其拉伸模量的影响规律,数值计算结果误差范围是±10%,验证了所提的有限元模型的合理性,说明该模型可用于预测其拉伸模量。     

复合材料微细杆增强复合材料研究进展

纤维增强树脂基复合材料具有轻质高强的特点,但复合材料层合板层间韧性和抗冲击性能差,复合材料微细杆(Z-pin)增强技术极大地改善了这一不足,被广泛应用于各工业制造领域。近年来,Z-pin增强复合材料的制备工艺不断发展,目前主要有热压罐法和超声植入法(UAZ)。Z-pin增强复合材料的层间增韧和抗冲击性能提高效果显著,但其面内拉伸性能、面内压缩性能和疲劳性能稍有下降。文中从Z-pin增强复合材料的性能特点出发,针对其层间韧性、抗冲击性、面内力学性能和疲劳性能进行了综述。指出Z-pin在Ⅰ型断裂模式、Ⅱ型断裂模式和混合断裂模式下的增韧机制;总结了Z-pin在提高复合材料低能量冲击后剩余压缩性能方面的作用;介绍了Z-pin增强复合材料在平面拉伸和压缩载荷下的破坏模式,从纤维损伤角度归纳了其面内拉伸及压缩性能下降的原因;总结了Z-pin增强复合材料在循环压缩载荷下的破坏模式。最后从材料体系和工艺优化两方面出发,为降低纤维损伤提供了建议。对Z-pin增强技术的进一步应用进行了展望。     

Z-pin增强陶瓷基复合材料拉伸和层间剪切性能

研究了Z-pin横向增强平纹编织陶瓷基复合材料的拉伸和层间剪切性能。炭纤维平纹编织物和炭纤维Z-pin制备的预成型体, 通过化学气相渗透(CVI)工艺制成Z-pin增强平纹编织陶瓷基复合材料。通过单轴拉伸试验及加-卸载试验研究材料拉伸力学性能参数及破坏规律。采用双切口压缩试验测试材料的层间剪切强度。结果表明, Z-pin增强平纹编织陶瓷基复合材料拉伸应力-应变曲线具有非线性特性; Z-pin嵌入降低了平纹编织陶瓷基复合材料的拉伸强度, 显著提高了陶瓷基复合材料层间剪切强度, 使原来单纯层间基体与织物表面的脱离转变为Z-pin的剪切破坏和层间基体与织物的脱离双重破坏机理。     

PIP工艺制备2D C/SiC复合材料Z-向穿刺工艺

针对2D C/SiC复合材料存在碳布层间缺乏纤维增强,层间结合较差的问题,提出通过Z-向穿刺工艺提高碳布层间结合,克服材料使用时可靠性不高的问题,并比较了穿刺工艺对复合材料微观结构和力学性能的影响.结果表明,通过Z-向穿刺工艺制得试样2D C/SiC-Z_(pin)的弯曲强度、弯曲模量和剪切强度分别为247.8 MPa、37.8 GPa和32.1 MPa,而未穿刺试样2D C/SiC的弯曲强度、弯曲模量和剪切强度分别只有219.3 MPa、34.4 GPa和23.3 MPa,由此可见,采用Z-向穿刺工艺能明显提高复合材料的力学性能.微观结构分析认为,试样力学性能提高的根本原因在于采用Z-向穿刺纤维加强了碳布层间结合,使材料具有较好的整体性,克服了复合材料层间结合较弱对力学性能带来的不利影响.