Intelligent cooling structure design of "Z-pins like" silicon rods to enhance the ablation resistance of C/C-ZrC-SiC composites above 2500 °C

In order to improve the ablation resistance of C/C-ZrC-SiC composites by reducing the damage of the protective oxide layer, novel "Z-pins like" silicon rods, which were designed and fabricated by liquid phase sintering, were utilised as a dissipative agent. The microstructure evolution and thermal dissipation behaviour were investigated after ablating above 2500 °C for 300 s. After the "Z-pins like" silicon rods were implanted, the anti-ablative property of the C/C-ZrC-SiC composites was drastically improved by the dissipative thermal protection mechanism. The linear ablation rate of the "Z-pins like" silicon rod-reinforced C/C-ZrC-SiC composite was -0.28 μm/s, which is 112.72% lower than the unmodified composite. Additionally, the actual ablative temperature dropped approximately 357 °C, which enabled abundant SiO₂ to remain in the ablation centre. Furthermore, a dense SiO₂-rich oxide layer with a low oxygen diffusion coefficient is formed that covers the entire ablative surface.     

Novel one-step formed composite reinforcement of "Spider web like" SiCnw networks and "Z-pins like" SiC rods for ablation resistance improvement of C/C-ZrC-SiC

A novel composite reinforcement with horizontal multilayer "Spider web like" SiC nanowire networks and vertical interconnected "Z-pins like" SiC rods was designed and prepared by facile one-step figuration. The linear ablation rate of "Spider web like" SiC nanowire networks and "Z-pins like" SiC rods collectively reinforced C/C-ZrC-SiC composites at 2610 ± 20 ℃ was 0.4 ± 0.03 μm/s with a 74.19 % reduction. The improved ablation resistance was attributed to a denser gradient oxide layer composed of central ZrO₂ layer, transitional ZrO₂-SiO₂ layer and marginal SiO₂ layer generated under the initial sticky net effect from SiCnw networks and subsequent oxide compensation from "Z-pins like" SiC rods.     

Predicting mode-II delamination suppression in z-pinned laminates

A finite element model for predicting delamination resistance of z-pin reinforced laminates under the mode-II load condition is presented. End notched flexure specimen is simulated using a cohesive zone model. The main difference of this approach to previously published cohesive zone models is that the individual bridging force exerted by z-pin is governed by a specific traction-separation law derived from a unit-cell model of single pin failure process, which is independent of the fracture toughness of the unreinforced laminate. Therefore, two separate traction-separation laws are employed; one represents unreinforced laminate properties and the other for the enhanced delamination toughness owing to the pin bridging action. This approach can account for the so-called large scale bridging effect and avoid using concentrated pin forces in numerical models, thus removing the mesh-size dependency and permitting more accurate and reliable computational solutions.     

Effect of temperature on stresses and delamination failure of z-pinned joints

Although z-pins have been shown effective in preventing delaminations in adhesively bonded and co-cured joints, their applicability depends on a reliable assessment of the strength of a z-pin-composite assembly. In particular, high residual thermal stresses that have been found in experiments dictate the necessity in a local stress analysis. Elevated temperature applied to the joint during its lifetime may also affect its effectiveness in preventing delaminations. The present paper illustrates an approach to determining local residual stresses confirming the observations regarding a possible delamination and cracking in the composite structure due to high post-processing transverse stresses. The analysis of the effect of elevated temperature applied at one of the surfaces on the response of a z-pinned joint is conducted using the concept of a double cantilever beam with an “insulated” crack. In addition, it is illustrated that an elevated temperature may actually benefit the integrity of the joint if it causes an increase in the z-pin-composite interfacial strength.     

Compression properties of z-pinned composite laminates

The effect of z-pinning on the in-plane compression properties and failure mechanisms of polymer laminates is experimentally studied in this paper. The reduction to the compression modulus, strength and fatigue performance of carbon/epoxy laminates with increasing volume content and diameter of pins is determined. The elastic modulus decreases at a quasi-linear rate with increasing pin content and pin diameter. Softening is caused by fiber waviness around the pins and reduced fiber volume content due to volumetric swelling of the laminate from the pins. A simple model is presented for calculating the compression modulus of pinned laminates that considers the softening effects of fiber waviness and fiber dilution. The compression strength and fatigue life also decrease with increasing volume content and diameter of the pins. The strength and fatigue properties are reduced by fiber kinking caused by fiber waviness around the pins and the reduced fiber content caused by swelling. The deterioration to the compression properties is also dependent on the fiber lay-up pattern of the laminate, with the magnitude of the loss in properties increasing with the percentage of 0° (load bearing) fibers in the laminate. The paper gives suggestions for minimizing the loss to the compression properties to laminates due to pinning.     

搭接长度对Z-pins增强陶瓷基复合材料接头连接性能的影响

本文对搭接长度分别为15mm,20mm,23mm,37ram,60mm的Z-pins增强陶瓷基复合材料接头在单向载荷作用下的连接性能进行了试验研究和数值模拟.试验结果表明接头的最终失效形式有两种:(1)搭接长度大于、等于20mm的接头由搭接板断裂而失效;(2)搭接长度等于15mm的接头由搭接面的脱胶而失效.在搭接长度为20mm～60mm之间,接头的最大破坏载荷与搭接长度之间呈线性关系变化.采用有限元的方法对搭接接头的破坏过程进行了数值模拟,模拟结果与试验结果吻合较好,进而得到了介于上述两种破坏模式之间的搭接接头的搭接长度.     

Z-pins对层合复合材料非对称分层增韧作用参数分析——Ⅱ型层间韧性

利用纤维Z-pins的细观力学模型构造了相应的Z-pin单元,结合考虑一阶剪切变形的梁单元,建立了用于分析含非对称分层采用Z-pins增韧的端部开口弯曲试件(End notched flexure,ENF)的有限元模型,并在分层裂纹面上引入接触单元以防止分析过程中2个分层子梁在端部开口处的相互嵌入。通过数值算例分析了Z-pins对含非对称分层的ENF试件Ⅱ型层间韧性的增强作用。参数分析表明,当分层位置靠近层合板的表面时,Z-pins的增韧作用明显下降,Z-pins对Ⅱ型层间韧性的增强作用主要由2个分层子层中较薄子层决定,但另一分层的厚度也对Ⅱ型层间韧性有一定的影响。     

Environmental durability of z-pinned carbon fibre–epoxy laminate exposed to water

The influence of z-pins on the water absorption properties of a quasi-isotropic carbon fibre–epoxy laminate is assessed. Fibrous composite pins accelerate the moisture absorption rate and increase the total absorbed moisture concentration when the laminate is immersed in water. However, the moisture absorption properties of the laminate are not affected significantly by pins when exposed to hot and humid air. Water diffusion into the z-pinned laminate is aided by interfacial cracks between the pins and laminate. Also, the axial alignment of fibres within the composite pins in the through-thickness direction increases the water absorption rate. Pin pull-out tests reveal that water absorption reduces the mode I crack bridging traction load generated by pins by reducing the shear strength of the pin-laminate interface. This indicates that the mode I delamination toughness induced by pinning is weakened by moisture absorption.     

Structural characteristics and ablative behavior of C/C–ZrC–SiC composites reinforced with “Z-pins like” Zr–Si–B–C multiphase ceramic rods

In order to improve the ablation and oxidation resistance of C/C–ZrC–SiC composites in wide temperature domain, “Z-pins like” Zr–Si–B–C multiphase ceramic rods are prepared in the matrix. The influence of different sintering temperatures on the microstructure of ceramic rods and the ablative behavior of heterogeneous composites are studied. The results showed that the ZrB₂ and SiC phases are formed in the sintered matrix, and the increase of sintering temperature is beneficial to improve the density of the ceramic rods. The ablation properties of samples have been greatly improved. The mass and linear ablation rate are 0.8 mg/s and 3.85 μm/s, respectively, at an ablation temperature of 3000 °C and an ablation time of 60 s. After ablation, the matrix surface is covered with SiO₂ and ZrO₂ mixed oxide films. This is due to the preferential oxidation of “Z-pins like” Zr–Si–B–C multiphase ceramic rods in the ablation process, and B₂O₃ melt, SiO₂ melt, borosilicate glass, ZrSiO₄ melt and ZrO₂ oxide film can be generated successively from the low-temperature segment to the ultra-high temperature segment. These oxidation products can be used as compensation oxide melts for the healing of cracks and holes on the matrix surface in different temperature ranges and effectively prevent the external heat from spreading into the matrix. Therefore, C/C–ZrC–SiC composites with “Z-pins like” Zr–Si–B–C multiphase ceramic rods achieve ablation resistance in wide temperature domain.     

Z-pin植入对二维机织复合材料层合板力学性能影响的数值模拟

针对植入Z-pin后的碳纤维增强平纹机织复合材料的微观结构,建立了含Z-pin机织复合材料单层板和层合板的单胞模型。预测了Z-pin直径、分布间隔对单层板的面内纵向拉伸力学性能的影响,发现含有Z-pin的机织复合材料单胞在受面内拉伸时,会在Z-pin附近出现应力集中,单胞首先会在应力集中区域发生失效而导致强度降低。通过三维单胞模型模拟了Z-pin在层合板中拉出脱离的过程,得出了不同Z-pin直径、不同分离层厚度下的拉拔力-位移曲线。建立了用非线性弹簧模拟Z-pin的双悬臂梁（DCB）模型,结合虚拟裂纹闭合技术（VCCT）,模拟了含有Z-pin复合材料层合板的Ⅰ型裂纹扩展,结果表明：Z-pin直径越大,分布越密,层合板的等效Ⅰ型应变能释放率 G_IC越大,且直径越大,G_IC 随裂纹扩展的波动幅度越大,分布越密,G_IC 波动的波长越小。