飞秒激光烧蚀研究进展

介绍飞秒激光烧蚀材料的机理论模型，阐述飞秒激光烧蚀的特性，揭示飞秒激光烧蚀的广泛应用前景。     

微型电磁继电器的制作和仿真分析

介绍了一种基于MEMS技术的微型电磁继电器的制作过程和仿真分析.这种微继电器的大小约是4mm×4mm×0.5mm,主要采用普通的微加工技术来完成全部制作工艺.与传统继电器相比,这种继电器采用平面线圈来代替螺线管线圈,有利于MEMS工艺,并且提出了一种双支撑的悬臂梁结构做为活动电极,具有较高的灵敏性和稳定性.另外,还进行了一些有关线圈通过激励电流后对活动电极产生电磁力的理论计算和仿真分析,利用这些结果可以对这种电磁继电器的结构和参数进一步优化.     

Electrochemical micromachining using a solid electrochemical reaction at the metal/β″-Al2O3 microcontact

A simple solid state technique for electrochemical micromachining of metal substrates using a metal ion conductor (Na-β″-Al₂O₃) was proposed. The fundamental solid electrochemical cell consists of a (anode) metal substrate (M = Ag, Cu, Zn, and Pb)/pyramidal Na-β″-Al₂O₃/Ag (cathode) system, where the contact diameter between M/Na-β″-Al₂O₃ was extremely small, on the order of a few micrometer. Under an applied electric field, the metal substrate was electrochemically oxidized to metal ions (Mⁿ⁺) at the M/Na-β″-Al₂O₃ microcontact. These Mⁿ⁺ ions migrated into the Na-β″-Al₂O₃. As a result of continuous electrolysis, the metal substrate was locally consumed at the microcontact, and thus solid state electrochemical micromachining was accomplished. As expected, the machining size or depth depended on the electrolysis conditions (current, operating time) and the apex configuration of pyramidal Na-β″-Al₂O₃. Moreover, the scanning of the Na-β″-Al₂O₃ pyramid during electrolysis produced a fine patterned metal substrate. In the present paper, solid state electrochemical micromachining was performed for several metal substrates, and its advantages and disadvantages vis-a-vis the conventional electrochemical micromachining method are discussed in detail.     

一种高深宽比微细槽的电火花加工工艺

为实现高深宽比微槽的加工,提出了一种自成形和扫描加工相结合的微细扁平电极制作及微细槽加工的工艺方法.采用棒状毛坯电极在一平板试件上扫描加工出一定长度的通槽,将毛坯电极沿垂直通槽方向向左和右偏移,两侧分别进行电火花反拷加工,得到扁平微细电极.再采用该扁平电极在线进行扫描加工即可得到期望的微细槽.实验获得了深径比大于18及尺寸一致性较高的阵列微细槽.与反拷或线电极磨削得到微细电极相比,自成形电极方法降低安装精度要求.而采用扁平电极进行微深槽的微细电火花加工,相对提高电极截面面积,降低电极损耗率,有利于提高加工效率.     

基于LIGA技术的微细电火花加工优化研究

比较了活动掩膜法与固定掩膜法得到的PMMA胶结构,实验表明固定掩膜法更适合于多次曝光.结合LIGA技术和微细电火花加工的优点,用LIGA技术制备出具有复杂形状的铜微细工具电极,再用该工具电极进行微细电火花加工,在不锈钢上加工出异形微细孔.并通过进一步调整电火花加工工艺参数,优化了加工尺寸精度和表面粗糙度.     

飞秒激光在6H-SiC表面诱导偏振依赖纳米结构特性研究

激光诱导偏振依赖纳米结构是一种有效实现纳米图案化的技术,并且一直备受研究者的青睐。利用飞秒激光微加工技术,对6H-SiC晶体表面激光诱导偏振依赖纳米结构特性进行了研究。通过改变入射激光加工偏振态和延迟时间样品表面诱导产生了直径约为150 nm的球形纳米颗粒、椭圆形纳米颗粒和空间周期约为150 nm的高空间频率表面条纹结构。实验结果表明,入射激光偏振特性会直接影响诱导产生的微结构形貌,并且优先入射的飞秒激光对最终产生的表面微结构形貌有决定性作用。初步探讨了偏振依赖纳米结构形成的物理机制,表面等离激元(surface plasmon polariton, SPP)在表面微纳米结构的产生过程中扮演着重要角色,研究结果对激光诱导表面周期结构(laser-induced periodic surface structures, LIPSS)可控制备具有重要意义。     

Cutting force and hole quality analysis in micro-drilling of CFRP

Micro-drilling in carbon fiber reinforced plastic (CFRP) composite material is challenging because this material machining is difficult due to anisotropic, abrasive and non-homogeneous properties and also downscaling of cutting process parameters affect the cutting forces and micro-drilled hole quality extensively. In this work, experimental results based statistical analysis is applied to investigate feed and cutting speed effect on cutting force components and hole quality. Analysis of variance based regression equation is used to predict cutting forces and hole quality and their trend are described by response surface methodology. Results show that roundness error and delamination factor have similar trends to those of radial forces and thrust force, respectively. Non-linear trends of cutting forces and hole quality errors are observed during downscaling of the micro-drill feed value. Optimization results show that cutting forces and hole quality errors are minimum at a feed value which is almost equal to the tool edge radius rather than at the lowest feed value. Therefore, the presented results clearly show the influences of size effects on cutting forces and hole quality parameters in micro-drilling of CFRP composite material.     

Bulk micromachining of silicon in TMAH-based etchants for aluminum passivation and smooth surface

The fabrication of silicon based micromechanical sensors often requires bulk silicon etching after aluminum metallization. All wet silicon etchants including ordinary undoped tetramethyl ammonium hydroxide (TMAH)-water solution attack the overlaying aluminum metal interconnect during the anisotropic etching of (100) silicon. This paper presents a TMAH-water based etching recipe to achieve high silicon etch rate, a smooth etched surface and almost total protection of the exposed aluminum metallization. The etch rate measurements of (100) silicon, silicon dioxide and aluminum along with the morphology studies of etched surfaces are performed on both n-type and p-type silicon wafers at different concentrations (2, 5, 10 and 15%) for undoped TMAH treated at various temperatures as well as for TMAH solution doped separately and simultaneously with silicic acid and ammonium peroxodisulphate (AP). It is established through a detailed study that 5% TMAH-water solution dual doped with 38 gm/l silicic acid and 7 gm/l AP yields a reasonably high (100) silicon etch rate of 70 μm/h at 80 °C, very small etch rates of SiO₂ and pure aluminum (around 80 Å/h and 50 Å/h, respectively), and a smooth surface (±7 nm) at a bath temperature of 80 °C. The etchant has been successfully used for fabricating several MEMS structures like piezoresistive accelerometer, vaporizing liquid micro-thruster and flow sensor. In all cases, the bulk micromachining is carried out after the formation of aluminum interconnects which is found to remain unaffected during the prolonged etching process at 80 °C. The TMAH based etchant may be attractive in industry due to its compatibility with standard CMOS process.     

一种扭摆式硅微机械加速度传感器

介绍了一种基于体硅微机电系统(MEMS)工艺制作的扭摆式硅微机械加速度传感器,对制作过程的一些工艺问题进行探讨,并提出相应的解决办法,主要涉及到硅-玻璃阳极键合、结构释放等关键工艺。对测试结果进行了初步分析,分辨力可以达到1mgn,测试±1gn范围内线性度可以达到99.99%。