Simulation of thermal barrier coating spallation induced by the initiation/growth/coalescence of internal crack and interfacial crack based on a real image model

In the furnace cycle test, the growth of oxide film leads to the propagation and coalescence of multiple cracks near the interface, which should be responsible for the spallation of thermal barrier coatings (TBCs). A TBC model with real interface morphology is created, and the near-interface large pore is retained. The purpose of this work is to clarify the mechanism of TBC spallation caused by successive initiation, propagation, and linkage of cracks near the interface during thermal cycle. The dynamic growth of thermally grown oxide (TGO) is carried out by applying a stress-free strain. The crack nucleation and arbitrary path propagation in YSZ and TGO are simulated by the extended finite element method (XFEM). The debonding along the YSZ/TGO/BC interface is evaluated using a surface-based cohesive behavior. The large-scale pore in YSZ near the interface can initiate a new crack. The ceramic crack can propagate to the YSZ/TGO interface, which will accelerate the interfacial damage and debonding. For the TGO/BC interface, the normal compressive stress and small shear stress at the valley hinder the further crack propagation. The growth of YSZ crack and the formation of through-TGO crack are the main causes of TBC delamination. The accelerated BC oxidation increases the lateral growth strain of TGO, which will promote crack propagation and coalescence. The optimization design proposed in this work can provide another option for developing TBC with high durability.     

Wetting,infiltration and interaction behavior of CMAS towards columnar YSZ coatings deposited by plasma spray physical vapor

Thermal barrier coatings (TBCs) produced by electron beam physical vapor deposition (EB-PVD) or plasma spray (PS) usually suffer from molten calcium-magnesium-alumino-silicate (CMAS) attack. In this study, columnar structured YSZ coatings were fabricated by plasma spray physical vapor deposition (PS-PVD). The coatings were CMAS-infiltrated at 1250?°C for short terms (1, 5, 30?min). The wetting and spreading dynamics of CMAS melt on the coating surface was in-situ investigated using a heating microscope. The results indicate that the spreading evolution of CMAS melt can be described in terms of two stages with varied time intervals and spreading velocities. Besides, the PS-PVD columnar coating (～100?μm thick) was fully penetrated by CMAS melt within 1?min. After the CMAS attack for 30?min, the original feathered-YSZ grains (tetragonal phase) in both PS-PVD and EB-PVD coatings were replaced by globular shaped monoclinic ZrO₂ grains in the interaction regions.     

Highly active lanthanum doped nickel anode for solid oxide fuel cells directly fuelled with methane

Lanthanum doped nickel and YSZ composite anode (LaNi–YSZ) exhibited a greatly reduced polarization resistance and high performance for electrochemical oxidation of hydrogen and methane, which resulted from a fine anode structure with a high dispersion of nickel catalyst and a high catalytic activity towards methane.     

硫对注入YSZ单晶的金属铂在退火过程中结晶的影响

秀卢瑟福背散射－沟道技术（ＲＢＳ－Ｃ）和Ｘ射线衍射技术（ＸＲＤ）研究了Ｐｔ和注入ＹＳＺ（Ｙ２Ｏ３稳定的ＺｒＯ２）后产生的损伤和退火过程中损伤的恢复及注入Ｐｔ的晶化，ＲＢＳ－Ｃ分析表明ＹＳＺ室温下的存在较强自退火效应，ＸＲＤ分析结果示出硫以铂的晶化产生很大影响。     

μC／OS—Ⅲ在Cortex—M3处理器上的移植

为了将μC／OS-Ⅲ移植到Cortex—M3处理器上,选用RealView MDK作为软件开发平台,针对Cortex—M3处理器特性编写了移植所需的C语言和汇编语言源代码,并验证了移植的正确性。移植后的μC／OS-Ⅲ能够稳定运行于Cortex～M3处理器上。该移植对大部分Cortex—M3处理器具有通用性,对其他架构处理器的μC／OS-Ⅲ移植具有参考作用。     

微波诱导稀土复合固体超强酸SO4^2-／ZrO2-Nd2O3催化合成乙酸苄酯

以新型稀土复合固体超强酸为催化剂，在微波辐射下苯甲醇和乙酸反应合成了乙酸苄酯，探索反应各因素对酯化率的影响。实验结果表明：SO4^2-／ZrO2-Nd2O3具有较高的催化活性。最佳反应条件为：醇酸摩尔比2．0（乙酸用量为0．2mol前提下），催化剂用量为1．8g，带水剂环己烷12mL，微波辐射功率550W，辐射时间25min，酯化率可达96．3％。该催化剂易于回收且可重复使用，具有良好的活性稳定性。     

5YSZ陶瓷基体的成型及烧结收缩率调节

为了提高5YSZ陶瓷基体的致密度和调节其烧结收缩率,通过流延法成型,优化了分散剂、消泡剂、球磨时间、固含量和胶含量。优化的条件为:分散剂含量0.9%,消泡剂含量0.63%,球磨时间22h+22h,固含量64%,胶含量29%。在优化的条件下,浆料分散均匀,生瓷带无气泡,5YSZ陶瓷基体烧结致密,且与Al2O3印刷层共烧良好。     

混合H2／H∞控制问题的降阶控制器

考虑混合H2／H∞控制问题的降阶控制器的设计问题．基于线性矩阵不等式（LMI）,分别‘给出了连续和离散情形下混合H2／H∞问题的降阶控制器的设计．     

湿度对CR-39固体核径迹探测器测量^220Rn／^222Rn水平的影响研究

在可调控温度、湿度及氡浓度的南华大学氡实验室对不同的湿度条件下CR-39固体核径迹探测器测量^220Rn、^222Rn的探测效率进行了测定,分析了湿度对CR-39固体核径迹探测器测量^220Rn、^222Rn探测效率的影响．实验结果表明：相对湿度在35％-95％范围内,当湿度为50％左右时,CR-39固体核径迹探测器测^222Rn,探测效率最高,标准偏差为2．0％;相对湿度在30％-100％范围内,当湿度为75％时,CR-39固体核径迹探测器测^220Rn的探测效率最低,标准偏差达到78．4％．     

Characterization of YSZ solid oxide fuel cells electrolyte deposited by atmospheric plasma spraying and low pressure plasma spraying

Yttria doped zirconia has been widely used as electrolyte materials for solid oxide fuel cells (SOFC). Plasma spraying is a cost-effective process to deposit YSZ electrolyte. In this study, the 8 mol% Y₂O₃ stabilized ZrO₂ (YSZ) layer was deposited by low pressure plasma spraying (LPPS) and atmospheric plasma spraying (APS) with fused-crushed and agglomerated powders to examine the effect of spray method and particle size on the electrical conductivity and gas permeability of YSZ coating. The microstructure of YSZ coating was characterized by scanning electron microscopy and x-ray diffraction analysis. The results showed that the gas permeability was significantly influenced by powder structure. The gas permeability of YSZ coating deposited by fused-crushed powder is one order lower in magnitude than that by agglomerated powder. Moreover, the gas permeability of YSZ deposited by LPPS is lower than that of APS YSZ. The electrical conductivity of the deposits through thickness direction was measured by potentiostat/galvanostat based on three-electrode assembly approach. The electrical conductivity of YSZ coating deposited by low pressure plasma spraying with fused-crushed powder of small particle size was 0.043 S cm⁻¹ at 100 °C, which is about 20% higher than that of atmospheric plasma spraying YSZ with the same powder. This article was originally published inBuilding on 100 Years of Success, Proceedings of the 2006 International Thermal Spray Conference (Seattle, WA), May 15–18, 2006, B.R. Marple, M.M. Hyland, Y.-Ch. Lau, R.S. Lima, and J. Voyer, Ed., ASM International, Materials Park, OH, 2006.