Wear and Creep Characteristics of a Carbon‐Derived Si3N4/SiC Micro/Nanocomposite

In the presented work some properties of a recently developed Si₃N₄/SiC micro/nanocomposite have been investigated. The material was tested using a pin on disc configuration. Under unlubricated sliding conditions using Si₃N₄ pin at 50 % humidity, the friction coefficient was in the range of 0,6 ‐ 0,7. The reduction of humidity resulted in a lower coefficient of friction, in vacuum the coefficient of friction had a value of about 0,6. The wear resistance in vacuum was significantly lower then that in air. The wear patterns on the Si₃N₄+SiC disc revealed that mechanical fracture was the wear controlling mechanism. Creep tests were realized in four point bending configuration in the temperature interval 1200‐1400 °C at stresses 50,100 and 150 MPa and the minimal creep deformation rate was established for each stress level. The activation energy, established from the minimal creep deformation had a value of about 360 kJ/mol and the stress exponent values were in the range of 0.8‐1.28. From the achieved stress exponents it can be assumed that under the studied load/temperature conditions the diffusion creep was the most probable creep controlling mechanism.     

JOINING MECHANISMS OF β''''-Al2O3 CERAMIC AND PYREX GLASS TO Al MATRIX COMPOSITE

The bonding of β'-Al2O3 and pyrex glass to Al matrix composites by anodic bonding process is achieved. The microstructure of the bonded interface and the joining mechanisms are analyzed with scanning electron microscope (SEM), energy dispersive X-ray fluorescence spectrometer (EDX). It is observed that the bonding region across the interface consists of the metal layer, oxide transitional layer and the ceramic layer, with the transitional layer composed of surface region and sub-surface region. The bonding process can mainly be categorized into anodic bonding process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining of the interface. The temperature, voltage and the drift ions in the ceramic or glass during the bonding process are the essential conditions to solid state diffusing and oxide bonding at the interface. The voltages, temperature, pressure as well as the surface state are the main factors that influence the anodic bonding.     

未增塑聚氯乙烯(PVC-U)异型材配方基础

PVC-U异型材配方十分复杂,常用原料通常在10种以上。根据大连实德集团实际生产情况,这10多种原料通常以7大组分的方式进行配料和生产。文中就该配方中7大组分的分类、特点及应用情况分别进行了详细介绍。     

WC对Cu/WC_P复合材料性能及组织的影响

通过ＷＣ含量对ＷＣ／Ｃｕ复合材料性能的影响，确定了冷压－烧结法制备Ｃｕ／ＷＣ材料的适宜ＷＣ含量为１０ｖｏｌ％左右。并就ＷＣ对该材料组织和再结晶行为的影响进行了有益的探讨。     

氧化铝/锌合金复合材料界面的SEM观察

利用挤压铸造制备氧化铝／锌合金复合材料，在扫描电镜（ＳＥＭ）上观察复合材料的界面。结果表明，在复合材料中纤维与基体间存在致密界面层，合金元素通过适当的化学反应可改善纤维与基体间的结合；在凝固过程中，纤维／基体界面上的硅在共晶体的共生生长过程中起了领先相作用，导致复合材料的共晶转变是由铝硅共晶转变和锌铝共晶转变两者组成。     

SHS法陶瓷衬管的研究现状及应用前景

回顾了自蔓延高温合成陶瓷衬管的发展历史，对国内外的研究现状进行归纳总结，介绍了离心ＳＨＳ法生产陶瓷衬管的工艺特点及产品性能，展望了离心ＳＨＳ陶瓷衬管的应用前景。     

预应力钢-混凝土组合梁的应用与研究

回顾了预应力钢 混凝土组合梁国内外应用与研究历史 ,分析了现有规范及理论的不足 ,并指出了有待解决的问题。     

Thermomechanical stress fields in high-temperature fibrous composites. I: Unidirectional laminates

This two-part paper presents a closed-form procedure for evaluation of estimates of local thermomechanical stress fields in two-phase fibrous composites and laminates. The first part is concerned with a unidirectional elastic laminate subjected to uniform mechanical loads and to uniform changes in temperature. Both phases are assumed to be elastic, with temperature-dependent moduli and expansion coefficients; the solution reflects the influence of thermomechanical interactions. Exact solutions are not possible for any real system, because the local geometry is not known in detail. Instead, estimates of the fields are found from a modified Mori-Tanaka approximation. Examples are presented for two SiC/Ti---Al---Nb composites. Local stresses of interest are found after cooling from fabrication to room temperature. The presence of local yielding, and the influence of coupling terms on the local stress magnitudes are examined. Extension of the results to laminated plates is presented in Part II (Dvorak, G.J., Chen, T. & Teply, J., Composites Science and Technology, 43 (1992) 359–368, this issue).     

聚吡咯导电材料合成方法的进展

本文对聚吡咯及聚吡咯导电复合物的合成方法进行了综述。