A novel low power hybrid cache using GC-EDRAM cells

In a typical embedded CPU, large on-chip storage is critical to meet high performance requirements. However, the fast increasing size of the on-chip storage based on traditional SRAM cells makes the area cost and energy consumption unsustainable for future embedded applications. Replacing SRAM with DRAM on the CPU’s chip is generally considered not worthwhile because DRAM is not compatible with the common CMOS logic and requires additional processing steps beyond what is required for CMOS. However a special DRAM technology, Gain-Cell embedded-DRAM (GC-eDRAM)  [1], [2], [3] is logic compatible and retains some of the good properties of DRAM (small and low power). In this paper we evaluate the performance of a novel hybrid cache memory where the data array, generally populated with SRAM cells, is replaced with GC-eDRAM cells while the tag array continues to use SRAM cells. Our evaluation of this cache demonstrates that, compared to the conventional SRAM-based designs, our novel architecture exhibits comparable performance with less energy consumption and smaller silicon area, enabling the sustainable on-chip storage scaling for future embedded CPUs.     

基于Internet的远程教育系统模型研究

随着计算机网络技术的发展，远程教学系统的结构发生了重大的变化，逐步由原来的客户机／服务器(C／S)结构转变为基于Internet的浏览器／服务器(B／S)结构。本文提出了基于CORBA技术的B／S结构系统模型。分析了其运行过程，并与传统的结构进行了比较，指明了其优越性。在本文的结尾。指出了使用这种技术的一个具体例子。     

DSP--数字化时代的基因芯片

DSP是当今发展最为迅速的和最有发展前景的技术之一。与普通CPU和MCU相比 ,DSP在数字信号处理方面有着无可比拟的优势 ,特别适合网络、通信、控制等需要进行大量数字信号处理的应用场合。今天DSP已经成为通信、计算机、网络、工业控制以及家用电器等电子产品中不可或缺的基础器件 ,DSP在通信、计算机、网络、工业控制以及消费类电子产品等领域有着非常广泛的应用 ,本文阐述了DSP的特点、应用和市场以及DSP技术的发展前景。     

面向WCDMA建立网络管理信息模型

分析了WCDMA移动通信网网管系统管理框架，在此基础上提出采用公共对象请求代理体系结构（CORBA）建立网管系统信息模型的优势，给出WCDMA网管系统的信息模型，同时介绍了对象管理组（OMG）接口描述语言（IDL）。     

基于CORBA的电信计费系统的研究与开发

简述了目前计费系统的特点和若干问题，讨论了基于CORBA技术的组件开发方式，并着重论述了基于CORBA的计费系统体系结构、设计方法与功能特点。     

分布式模型的分析研究

首先介绍了分布式计算机的特点。然后具体讨论了目前最新的几种分布式计算技术，并阐述了几种技术的特点，进行了分析比较。最后对分布对象计算技术的未来发展及应用进行了探讨。     

Tribotronics—Towards active tribology

A constant trend towards more compact mechanical systems with higher power densities and increased thermo-mechanical loads emphasises the importance of the development of new design approaches and novel tribological systems. Ignoring this may cause a significant slow down in technological and industrial development. Tribotronics or active tribology based on adaptive performance is thought of as being critical in the implementation of smart machine concepts. Recognition of the importance of tribotronics, or active control of system loss outputs, such as those through friction and wear will have significant beneficial economic consequences as a result of the associated accelerated rate of technological progress. These smart tribotronic systems can be embedded in a great variety of machines and mechanisms. If this integration is made at the design stage, products that are more flexible, efficient and reliable can be produced. The concept of tribotronics is presented and discussed in this paper. Some illustrative examples that show the feasibility of an “active” approach are given. In addition, various possibilities already reported in literature are discussed.     

构建S3C4510B嵌入式系统的开发应用平台

利用三星公司生产的S3CA510B这款32位ARM7TDMI单片机构建一个应用系统，利用开发软件ARM SDT v2．51，在开发应用系统上实现存储器地址重映射、中断控制、串行通信、液晶、键盘接口。在此基础上，在S3CA510B上嵌入操作系统μC／OS-Ⅱ，用于液晶、键盘接口和多任务管理，为32住单片机的进一步开发应用构造了一个平台。     

溅射——气体——聚集共沉积法制备金属／金属（介质）复合团簇镶嵌薄膜

提出了溅射－气体－聚集共沉积制备金属／金属（介质）复合团簇镶嵌薄膜的新方法，并利用该方法成功地在方华膜衬底上制备了系列Ｆｅ／Ａｇ及ＣａＦ２复合团簇镶嵌薄膜样品。透射电镜分析结果表明，样品中Ｆｅ（Ｃｕ）团簇都较好地镶嵌于Ａｇ（ＣａＦ２）基质中，其结构为两种材料的多晶共存形态。进一步分析发现，与块材相比，Ｆｅ／Ａｇ样品中Ｆｅ团簇晶格常数呈现出不同程度的收缩，而Ｃｕ／ＣａＦ２样品中Ｃｕ团簇晶格常数则呈现出不同程度的膨胀。运用附加压力的模型对该现象进行了解释。