Thermal and hygroscopic reliability of flip-chip packages with an anisotropic conductive film

Thermal and hygroscopic reliability of anisotropic conductive film (ACF) joints in relation to flip-chip bonding force was evaluated by thermal shock and constant temperature/humidity testing. The failure mode by thermal shock testing varied with increasing bonding force, i.e., (1) formation of a conduction gap between conductive particles and Au bump or Ni/Au plated Cu pad at low bonding force and (2) delamination of adhesive matrix from the plated Cu pad on the flexible substrate at high bonding force. The delamination initiated as a crack under a conductive particle and propagated sideward resulting in a complete delamination of the ACF from the Cu pad. However, delamination was observed between the ACF and Au bump on the chip side after the constant temperature/humidity testing for 500 h. A theoretical calculation was also conducted to predict the connection resistance of the ACF joint before and after reliability tests. The calculation showed the importance of the bonding gap between the electrodes.     

Impact of climate change on corrosion risks

Abstract

According to most pundits on the topic, climate change will have a serious impact on many aspects of our life on the planet. At the onset it is not obvious how most of the predicted changes will take their toll on the integrity of the equipment and systems presently in use. This paper will examine three aspects of climate change that may alter the corrosive behaviour of the environment and increase the risk of corrosion failures: changes in precipitation patterns, corrosivity of coastal regions, and increased stresses on marine systems.     

The development of a fault-tolerant control approach and its implementation on a flexible arm robot

This article presents a robust sensor fault-tolerant control (FTC) scheme and its implementation on a flexible arm robot. Sensor faults affect the system's performance in the closed loop when the faulty sensor readings are used to generate the control input. In this article, the non-faulty sensors are used to reconstruct the faults on the potentially faulty sensors. The reconstruction is subtracted from the faulty sensors to generate a 'virtual sensor' which (instead of the normally used faulty sensor output) is then used to generate the control input. A design method is also presented in which the virtual sensor is made insensitive to any system uncertainties (which could corrupt the fault reconstruction) that cannot fit into the framework of the model used. Two fault conditions are tested: total failure and incipient faults. Then the scheme robustness is tested and evaluated through its implementation on two flexible arm systems, one with a flexible joint and the other with a flexible link. Excellent results have been obtained for both cases (joint and link); the FTC scheme produced system performance almost identical to the fault-free scenario, whilst providing an indication that a fault is present, even for simultaneous faults.