面向工程应用的单片机课程教学改革与实践

在分析传统单片机教学存在问题的基础上,提出面向工程应用,聚焦企业需要,构建能力递进、面向应用的内容体系,搭建资源共享、实践创新、师生互动的自主学习平台,组建培养兴趣,突出技能的“双师型”教学团队,实践表明,在传授知识的同时,能有效提升学习兴趣,优化人才素质结构。     

Rapid screening of DON contamination in whole wheat meals by Vis/NIR spectroscopy and computer vision coupling technology

This work intends to develop an online experimental system for screening of deoxynivalenol (DON) contamination in whole wheat meals by visible/near-infrared (Vis/NIR) spectroscopy and computer vision coupling technology. Spectral and image information of samples with various DON levels was collected at speed of 0.15 m s⁻¹ on a conveyor belt. The two-type data were then integrated and subjected to chemometric analysis. Discriminant analysis showed that samples could be classified by setting 1000 μg kg⁻¹ as the cut-off value. The best correct classified rate obtained in prediction was 93.55% based on fusion of spectral and image features, with reduced prediction uncertainty as compared to single feature. However, quantification of DON by quantitative analysis was not successful due to poor model performance. These results indicate that, although not accurate enough to provide conclusive result, this coupling technology could be adopted for rapid screening of DON contamination in cereals and feeds during processing.     

Influences of chip serration on micro-topography of machined surface in high-speed cutting

Saw-tooth chip changes from macroscopically continuous ribbon to separated segments with the increase of cutting speed. The aim of this study is to find the correlations between chip morphology and machined surface micro-topography at different chip serration stages encountered in high speed cutting. High strength alloy steel AerMet100 was employed in orthogonal cutting experiments to obtain chips at different serration stages and corresponding machined surfaces. The chips and machined surfaces obtained were then examined with optical microscope (OM), scanning electron microscope (SEM), and white light interferometer (WLI). The result shows that chip serration causes micro-waves on machined surface, which increases machined surface roughness. However, wave amplitudes (surface roughness) at different serration stages are different. The principal factor influencing wave amplitude is the thickness of the sawed segment (tooth) of saw-tooth chip. With cutting parameters in this study, surface roughness contributed by chip serration ranges from 0.39 μm to 1.85 μm. This may bring on serious problems in the case of trying to replace grinding with high-speed cutting in rough machining. Some suggestions have been proposed to control the chip serration-caused surface roughness in high-speed cutting based on the results of the current study.     

An architecture to support scalable distributed virtual environment systems on grid

A Distributed Virtual Environment (DVE) system offers a computer-generated virtual world in which individuals located at different places in the physical world can interact with one another. In order to achieve real-time response for a large user base, DVE systems need to have a scalable architecture. In this paper, we present the design of a grid-enabled service oriented framework for facilitating the construction of scalable DVE systems on computing grids. A service component called “gamelet” is proposed, whose distinctive mark is its high mobility for supporting dynamic load sharing. We propose a gamelet migration protocol which can ensure the transparency and efficiency of gamelet migration, and an adaptive gamelet load-balancing (AGLB) algorithm for making gamelet redistribution decisions at runtime. The algorithm considers both the synchronization costs of the DVE system and network latencies inherent in the grid nodes. The activities of the users and the heterogeneity of grid resources are also considered in order to carry out load sharing more effectively. We evaluate the performance of the proposed mechanisms through a multiplayer online game prototype implemented using the Globus toolkit. The results show that our approach can achieve faster response times and higher throughputs than some existing approaches. This research is supported in part by the China National Grid project (863 program) and the HKU Foundation Seed Grant 28506002.     

2.5GHz低相位噪声CMOS LC VCO的设计

用0 .35μm、一层多晶、四层金属、3.3V的标准全数字CMOS工艺设计了一个全集成的2 .5 GHz L C VCO,电路采用全差分互补负跨导结构以降低电路功耗和减少器件1/ f噪声的影响.为了减少高频噪声的影响,采用了在片L C滤波技术.可变电容采用增强型MOS可变电容,取得了2 3%的频率调节范围.采用单个16边形的对称片上螺旋电感,并在电感下加接地屏蔽层,从而减少芯片面积,优化Q值.取得了在离中心频率1MHz处- 118d Bc/ Hz的相位噪声性能.电源电压为3.3V时的功耗为4 m A.     

串行16位DAC转换芯片在流量手操器中的应用

本文介绍串行16位D／A转换芯片MAX541及其与AT89C52单片机的接口电路、相应的转换子程序，并给出其在过程流量手操器中的应用。     

新型的芯片间互连用CMOS/BiCMOS驱动器

从改善不同类型 IC芯片之间的电平匹配和驱动能力出发 ,设计了几例芯片间接口 (互连 )用 CMOS/Bi CMOS驱动电路 ,并提出了采用 0 .5 μm Bi CMOS工艺 ,制备所设计驱动器的技术要点和元器件参数。实验结果表明所设计驱动器既具有双极型电路快速、大电流驱动能力的特点 ,又具备 CMOS电路低压、低功耗的长处 ,因而它们特别适用于低电源电压、低功耗高速数字通信电路和信息处理系统。     

采用自动双探边器降低芯片漏测率

半导体芯片的检测是芯片生产企业生产过程中的重要环节，芯片在检测过程中，由于圆形硅片的结构特点而造成的漏测又是困扰芯片生产企业不可小视的实际问题。本文介绍了利用双探边器解决由于硅圆片结构所造成的漏测的有效办法及具体操作方法。     

单片机控制下液晶显示器的使用

介绍液晶显示器EDM12864B的原理及其在单片机控制下的简单应用。     

Acquisition and pattern recognition of spectrum information of welding metal transfer

With the creation of a pattern recognition system for metal transfer mode, this article has collected five kinds of spectrum signals in gas metal arc welding (MIG, MAG and CO₂) and take them as training samples. These samples have been pretreated by computer, several key characteristic parameters of the spectrum signal have been creatively extracted, and a corresponding recognition function and a minimum-distance-classifier have been constructed. The results show that the pattern recognition of several kinds of metal transfer modes for the metal gas arc welding can be done successfully, and relative important parameters in welding process, such as the frequency of droplet transfer and the approximate diameter of each droplet, can also be obtained.