毫米波三维异质异构集成技术的进展与应用

三维异质异构集成技术是实现电子信息系统向着微型化、高效能、高整合、低功耗及低成本方向发展的最重要方法,也是决定信息化平台中微电子和微纳系统领域未来发展的一项核心高技术。文章详细介绍了毫米波频段三维异质异构集成技术的优势、近年来的发展趋势以及面临的挑战。利用硅基MEMS 光敏复合薄膜多层布线工艺可实现异质芯片的低损耗互连,同时三维集成高性能封装滤波器、高辐射效率封装天线等无源元件,还能很好地处理布线间的电磁兼容和芯片间的屏蔽问题。最后介绍了一款新型毫米波三维异质异构集成雷达及其在远距离生命体征探测方面的应用。     

A miniature triaxial apparatus for investigating the micromechanics of granular soils with in situ X-ray micro-tomography scanning

The development of a miniature triaxial apparatus is presented. In conjunction with an X-ray micro-tomography (termed as X-ray μCT hereafter) facility and advanced image processing techniques, this apparatus can be used for in situ investigation of the micro-scale mechanical behavior of granular soils under shear. The apparatus allows for triaxial testing of a miniature dry sample with a size of \mathrm{8}\hspace{0.17em}\mathrm{mm}\times \mathrm{16}\hspace{0.17em}\mathrm{mm} (diameter \times height). In situ triaxial testing of a 0.4–0.8 mm Leighton Buzzard sand (LBS) under a constant confining pressure of 500 kPa is presented. The evolutions of local porosities (i.e., the porosities of regions associated with individual particles), particle kinematics (i.e., particle translation and particle rotation) of the sample during the shear are quantitatively studied using image processing and analysis techniques. Meanwhile, a novel method is presented to quantify the volumetric strain distribution of the sample based on the results of local porosities and particle tracking. It is found that the sample, with nearly homogenous initial local porosities, starts to exhibit obvious inhomogeneity of local porosities and localization of particle kinematics and volumetric strain around the peak of deviatoric stress. In the post-peak shear stage, large local porosities and volumetric dilation mainly occur in a localized band. The developed triaxial apparatus, in its combined use of X-ray μCT imaging techniques, is a powerful tool to investigate the micro-scale mechanical behavior of granular soils.     

微桥法镍膜的弹性模量和残余应力测量

利用MEMS技术制作了不同尺寸的镍(Ni)膜微桥结构样品。采用纳米压痕仪XP系统测量了微桥载荷与位移的关系,并结合微桥力学理论模型得到了两种不同尺寸的Ni膜的弹性模量和残余应力。结果表明,两种不同尺寸的Ni膜的弹性模量结果一致,为190 GPa左右,但是残余应力变化较大。与采用纳米压痕仪直接测得的带有硅(Si)基底的Ni膜弹性模量186.8 7.5 GPa相比较,两者符合较好。     

MEMS封装技术研究进展

介绍了MEMS封装技术的特点、材料以及新技术,包括单片全集成MEMS封装、多芯片组件(MCM)封装、倒装芯片封装、准密封封装和模块式MEMS封装等。文中还介绍了MEMS产品封装实例。     

微型无阀泵参数化结构设计及测试

 从理论计算和试验两方面研究了用于微流控化学分析芯片的微型无阀泵流动特性，初步建立了微型无阀泵流道结构的数学模型，重点讨论了结构参数的选取原则及相应的流动阻尼系数的计算方法． 通过试验验证了数值计算的可靠性，为微型无阀泵参数化设计及优化提供了理论依据及经验曲线．     

Mechanical behavior of 30–50 nm thick aluminum films under uniaxial tension

We present uniaxial tensile test results for 30–50 nm thick freestanding aluminum films. Young’s modulus and ductility were found to decrease monotonically with grain size. Reverse Hall–Petch behavior was observed with no appreciable room temperature creep. Non-linear elasticity with small irreversible deformation was observed for 50 nm thick specimens.     

Si基膜片型气敏传感器微结构单元的热学性能

微结构气敏传感器由于其微型化、低功耗、易阵列化和易批量生产等优点而受到国内外研究者的广泛关注。利用微机电系统（MEMS）加工技术，制备Si基膜片型微结构单元，并分析其热学性能。这种单元工作区温度为-300℃时，加热功率约75mW；并且膜片工作区的热质量很小，温度可以于毫秒量级的时间内，在室温和450℃之间调制。利用这种微结构单元，可以在温度调制方式下，研究气敏薄膜的电学特性和敏感机理。     

MEMS移相器及其在微型通信系统中的应用

从传统移相器的构造和原理出发，进一步分析了MEMS移相器的结构、特性。结果表明，MEMS移相器具有传统移相器所无法比拟的体积小、损耗小、成本低、频带宽、易于集成等突出优点。随着高阻硅衬底在微波领域应用的扩展，MEMS移相器介质损耗大幅度降低，将能与信号处理电路一同集成于硅衬底上，便于相控阵雷达等通信系统实现微小型化。     

MEMS光开关及其与光纤组装方式的研究

光开关是一种在光路中应用极其广泛的光无源器件,可用于扫描、投影、通讯等多种不同的领域,其中用于全光通讯中连接光纤之间的光开关日渐成为人们关注的焦点.高性能、低成本、又能大量生产的MEMS光开关很好地满足了全光网络对器件的要求.本文对这种MEMS光纤光开关的类型、特点以及研究现状进行了介绍,并给出了MEMS光开关与输入输出光纤的组装与自组装以及主要方式.     

Analytical model of displacement amplification and stiffness optimization for a class of flexure-based compliant mechanisms

The paper formulates an analytical method for displacement and stiffness calculations of planar compliant mechanisms with single-axis flexure hinges. The procedure is based on the strain energy and Castigliano’s displacement theorem and produces closed-form equations that incorporate the compliances characterizing any analytically-defined hinge, together with the other geometric and material properties of the compliant mechanism. Displacement amplification, input stiffness and output stiffness calculations can simply be performed for any serial compliant mechanism. The class of amplifying compliant mechanisms that contain symmetric corner-filleted or circular flexure hinges is specifically addressed here. A parametric study of the mechanism performance is performed, based on the mathematical model, and an optimization procedure is proposed, based on Lagrange’s multipliers and Kuhn-Tucker conditions, which identifies the design vector that maximizes the performance of these flexure-based compliant mechanisms. Independent finite element simulation confirms the analytical model predictions.