| 一种热关断电路的设计 |
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| 引用本文： | 张炽昌,邵丙铣.一种热关断电路的设计[J].微电子学,1999,29(4):302-304. |
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| 作者姓名： | 张炽昌 邵丙铣 |
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| 作者单位： | 复旦大学国家微电子材料与元器件微分析中心!上海200433 |
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| 摘 要： | 利用电路中器件的温度特性，采用可控硅等元件，设计了一种热关断电路，中在温度上升到由用户预先设定的范围是发出逻辑信号ＴＳＤ以实现控制。采用ｃｄｓＳｐｉｃｅ软件进行好模拟，获得了预期的效果。
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| 关 键 词： | 模拟集成电路 热关断器件 可控硅 |
Design of a Thermal Shut Down Device |
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| ZHANG Chi chang a,SHAO Bing xian.Design of a Thermal Shut Down Device[J].Microelectronics,1999,29(4):302-304. |
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| Authors: | ZHANG Chi chang a SHAO Bing xian |
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| Abstract: | Utilizing temperature characteristics of the device,a thermal shut down(TSD) device is implemented based on silicon controlled rectifiers(SCR).When temperature rises to the specific range defined by the user,the circuit may generate a logic signal TSD for control.Simulation by cdsSpice is performed and an anticipated result is achieved. |
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| Keywords: | Analog IC Thermal shut down(TSD)device Silicon controlled rectifier(SCR) |
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