投影散斑相关方法测量芯片翘曲度

本文采用投影散斑相关法对芯片翘曲度进行了测量。利用单个CCD和单个投影装置多次扫描的方法，得到若干幅具有部分重叠区域的小图像，然后通过配准和拼接获得全景图像，实现整体测量。在拼接区标定若干控制点，然后以这些控制点为基准进行坐标变换实现重叠区域的配准和拼接，以提高分辨率、实现全场测量，得到芯片相对于标准平面的面内位移和形变。通过三角法标定，获得了离面位移和形变，从而完成了对手机屏幕芯片翘曲度的测量。与牛顿环测量法相比较，结果证明了投影散班方法测量芯片翘曲度的精度和可行性。

Speckle projection correlation technique for measuring warpage of mobile-phone chip

The speckle projection correlation technique is used to measure the chip warpage.With single charge-coupled device(CCD) and single projector,using multi-scan method,several partially overlapped images are obtained.The matching algorithm based on coordinate transform is applied to stitch the overlapped images.The spatial resolution is improved and the total shape of sample is obtained.In the application to mobile phone,the speckle projection correlation technique was used to measure the warpage of mobile-phone chip.The results are compared with those obtained from Newton ring method and the results are consistent very well.The experiment results prove the accuracy and feasibility of the speckle projection correlation technique.